Your Technology Experts 2017 Your Full Service

Your Technology Experts… 2017

Your Full Service, Time Sensitive, Printed Circuit Board Solution Located in the Heart of Silicon Valley, Streamline Circuits is your premier PCB manufacture of leading edge Technology and Innovation. We offer full service solutions for Rigid PCB’s, Flex PCB’s and Rigid-Flex PCB’s in both Ultra Quick Turn options along with Standard Production lead times. You will find that Streamline holds the necessary certifications to insure the highest standards of workmanship while supporting your companies specifications. Mil / Aerospace Tele. Com Data. Com Medical Industrial 2

Streamline Circuit Corp’s Facility • • The facility was established in 1982 • 75, 000 sq. ft. PCB manufacturing facility • 1 mile from the San Jose Airport • Located in Silicon Valley • Located in Silicon Valley Manufacturing all levels of technology Financially secure in current market conditions – – – Time sensitive prototyping through production New management team installed September 2003 Complete manufacturing process under one roof Delivery convenience for out of state customers Short car ride away for pick up & deliveries Low cost infrastructure 3

Management and their Experience Chuck Dimick –CEO / Founder • Over 38 years of experience in PCB manufacturing. Former CEO of Dynamic Details Inc. and founder of the company's predecessor, Dynamic Circuits Inc. (1991) Greg Halvorson – President / Founder • Over 34 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc. and Dynamic Circuits Inc. Tom Doslak – Sr. Vice President of Sales & Marketing / Founder • Over 26 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional Sales Manager for Dynamic Details Inc. Michael Graves - Vice President of Operations • Over 30 years industry experience in both production and prototype manufacturing. Former VP of Operations for Pacific Circuits, and DDI. He also has experience as Quality Manager of a major PCB fabricator. Lorraine Hook – Director of Quality • Over 47 years of industry experience. Former Director of Quality for many successful companies including DCI and DDI. She has held dual positions as Corp. Quality Systems Manager. Mike Trammel – Director of Engineering • Over 28 years of industry experience. Former Director of Engineering for DDI and Dynavision. 12 years of Materials Application Engineering and R&D experience.

Management and their Experience Cont. JR Ramirez – Production Manager / Founder • Over 36 years of industry experience. Former Production Manager for both Dynamic Details Inc. and Dynamic Circuits Inc. Louis Oliveira – Pre-Production Engineering Manager • Over 29 years of CAM “Computer Aided Manufacturing” experience to Streamline Circuits. Previously was Pre-Production Engineering at Dynamic Details. Held various key positions at Davila International Circuits. Phil Ramon – Pre-Production Engineering Supervisor • Over 36 years of experience in the PCB industry. Previously worked for 16 years on the management team for South Bay Circuits, more than 9 years as Pre-Production Engineering Manager and 10 years at CTS Printex.

Customer Service Support • Customer Service (24 hours - 7 days a week) – Sales, Engineering, Manufacturing and Quality • Dedicated customer service readily available-our support group’s located onsite in the facility • Quick response to all requests such as: – – Job status Delivery pull-in Quantity Increases Engineering design modification Inside Sales Customer Support 6

Proactive Engineering Services • Manufacturing Capabilities – Prototype though volume – All time sensitive builds • DFM (Design for Manufacturability) – – – Cam Valor Stations DFM Software (reviews in 10 minutes) Net list compare to customer data Custom Verification programs Looking for customer design error In plan Smart data Collection System • Controlled Impedance Verification – Stack up assistance – Copper distribution – Material verification 4 Laser Direct Imaging units (18 Micron) 7

Controlled Impedance Verification • DFM Scan & Report • Stack up assistance • Copper distribution • Material verification • Sub Panel /Array Support Go to Pre. Production

Quality Reassurance • • In house Mil & deliverable Lab • • – – – – Net list compare prior to MFG Matching Net list to Gerber data Front End DRC (design rule check) Searching for customer design mistakes AOI Automated Optical Inspection Verifying inner & outer layers, and SUBs X-Ray Verification After Lam (Inspecta), After Drilling Cross Section Verification Hole Integrity True-Chem Software Controlled Impedance Testing TDR test of panel coupons 100% Net List Test On All Product Eliminator Tester & flying probe Coordinate Measurement Machine First articles, 100% measurement verification Automated Optical Inspection Fusion 22 (25 Micron) 9

On Time Delivery Assurance • – – – Vacuum Lamination press 20 Chambers • • – – 100% In-house manufacturing from start to finish Control delivery & customer flexibility In-process quality verification system No out sourcing delivery delays Employee Training program Performance evaluation every 6 months In-house Chemical Laboratory Cross Sections Chemical analysis Mil spec verification 10 flying Probe Testers 10

Continuous Improvement Programs • Working daily on: 48, 000 holes per minute 7 Micro Via laser Total – – – – Research and Development Pre-Engineering Programs Improvement Process Program Department Performance Reviews Preventative maintenance program Employee Training Program Planned Capital expense program Management meetings 11

A Full PCB Solution • • • Multilayer Rigid / Rigid- Flex / Flex 1 to 70 Layers Plus 28: 1 High Aspect Ratio 3. 23 Mils Hole to Copper Buried / Blind Vias 9 Sequential Laminations 13+ Stacked Vias 1 Mil Trace & Space Cavity Constructions 6 oz. + Copper Thickness Copper Filled Micro Vias +/- 5% Controlled Impedance Tol. • • • AS 9100 Rev. C / ISO 9001 / ISO 13485 Mil-Spec 55110 / ITAR Ro. HS & Halogen Free Materials IPC 6012 Rigid / 6013 Flex / 6015 MCM / 6016 HDI / 6018 High Frequency 3 Mil Mechanical Drills 24” x 30” Oversize Panel 2 Mil Laser Drill Vias Up to 345 Mils Board Thickness Via Under Pad (Conductive & Non. Conductive Filled) 75+ Materials (Hybrid Constructions) Certifications 12

PCB TECHNOLOGY ROADMAP Standard Manufacturing 1. Line and Space 2. Drilled Via Size 3. Misc. Attributes 4. Laminate Materials *UTR = Ultra Thin Rigid Advanced Manufacturing Emerging Technology Engineering walk through Line Width Line Space Tolerance . 003”. 0038”. 003” +/-. 001”” +/-. 001 . 002” +/-. 00075” . 001” +/-. 0005” +/-. 00025” Drill Size Pad Diam Aspect Ratio . 008” +. 010” 28: 1 . 004” +. 008” 20: 1 . 003” +. 006” 20: 1 . 003” +. 002” 28: 1 Up to 36 Up to. 187” <16”X 22” 36 to 48 Up to. 300” <19”X 22” 48 to 60 Up to. 350” <22 X 28 >. 350 Interposer Substates UTR’s Next Generation HSD Advanced Interposers Nano Foils Alternative Resin Systems EMI Shield Conductive Bond Ply Thin Flex UL Approved High Speed Flex High Reliability Flex Data Security UL Multilayers Layer Count Thickness Board Size Rigid Flex FR 4 Polyimide PTFE HC (Rogers) Flex Rigid Flex FR 4 Stiffeners http: //streamlinecircuits. com/high-speed-materials/ 13

TECHNOLOGY ROAD MAP CONTINUED Emerging Technology Engineering Walk through Standard Manufacturing 5. Micro Via Size 6. Surface Finishes 7. LDI Soldermask 8. Conductive and Non-Conductive Via Fill Registration Min opening Min hole Aspect Ratio . 004” +. 005”. 6: 1 . 003” +. 004” 1: 1 HASL Entek Imm Silver ENIG ENEPIG Via Size Pad Dam Aspect Ratio Advanced Manufacturing LF HASL Eless Au Sel Solder Imm tin +/-. 003”. 006” +/-. 002”. 003” +/-. 001”. 002” Tangency . 012” 8: 1 . 010” 12: 1 . 008” 18: 1 <. 008 20: 1 . 002” +. 004” 2: 1 . 001” +. 003” 3: 1 Solder Bump TBD 14

Certifications Nadcap ISO 9001: 2000 IPC 6012, 13, 15, 16, 18 Class 3 DA and DS ITAR AS 9100 Rev C Mil-Spec 31032

Q-Pulse Total Quality Management • Quality Assurance Systems – Q-Pulse Quality System • NCMR’s and Corrective Actions • Audits • Training • Equipment Calibrations BACK 16

Streamline’s Capital Expenditures Laser Direct Imaging Nuvogo LDI (18 Micro) • Use advanced equipment technologies to manufacture today's printed circuit board requirements • The future in PCB manufacturing is about technology and automation Cuposit & Electroless Line • Hire and Train equipment operators • High percentage engineering personnel and staff DES Inner Layer Strip-line 17

Streamline’s Toolkit Best in Class Preengineering Tools Personnel Advanced Materials State of the Art AOI, Testing Best in Class Drilling Laser Drill Technology Electroless Plating Tomorrows Printed Circuit Technology Material Prep Laser Direct Imaging Best in Class DES State of the Art Lamination Technologies and Registration Systems 18

IPC Manufacturing Class & Industries 19

Rigid-Flex Examples 6 Layer Rigid Flex with Cavity 8 Layer Rigid Flex Micro via 10 Layer Micro via BGA

PCB Equipment Needed for the Future Production Engineering LDI Image Processing Develop Etch Strip Laser Drilling Electroless Technology Registration and Micro Via’s Solder Mask Silkscreen Test Product Integrity Quality Verification Off-Shore Solution Test Cases Flex / Rigid-Flex Back

Flex / Rigid-Flex

Rigid-Flex Examples 6 Layer Rigid Flex with Cavity 8 Layer Rigid Flex Micro via 10 Layer Micro via BGA

Flex Capabilities Standard Advanced Layer Count 1 L to 6 L 8 L to 10 L Maximum Panel Size 10”x 16” (250 x 406 mm) 10”x 35” (250 x 889 mm) Min. Line/Space (H & ⅓ oz) 0. 004" (0. 10 mm) 0. 003" (0. 076 mm) Outline Tolerance +/-. 004” (0. 10 mm) +/-. 002” (0. 05 mm) by laser Stiffener Types PI, FR 4+PSA PI, FR 4, Steel, Alum Polyimide Thickness 0. 5, 1 mil (12. 5, 25 um) 2, 3, 4 mils (50, 75, 100 um) Base Copper Thickness 0. 5, 1 oz (17. 5, 35 um) ¼ to 2 oz (9 to 70 um) HDI Microvias Yes Adhesiveless Materials Yes Flexible Soldermask Yes White Coverlay Yes RA Copper Yes 24

Base Material Flex and Rigid Flex • IPCManufacturer • 4202/1 Du. Pont • 4203/18 Du. Pont • 4204/11 Du. Pont • 4101/21 Isola • 4101/24 Isola • Arlon Preg • 4101 B/124 Arlon Preg • 4101/26 Isola • Isola Prepreg • Grace • 4101/41 Arlon • Isola Prepreg • 4101/42 Arlon Preg • 4101/99 Isola • Other Material Flex and Flex-Rigid Material Name Pyralux FR, Pyralux AP FR 406, FR 408, 370 49 N 51 N FR 406, FR 408, 370 FR 406 N GA-170 LL 35 N P 26 38 N 370 HR • Name • Conductive Silver Ink • Flex LPI Solder Mask Manufacture Du. Pont Taiyo • Rogers • • • Material Name CB 028 PSR-9000 FXT, PSR-900 RFLEX 8080 Liquid Coverlay Kapton/Polyimide Stiffener Du. Pont Pyralux, FR, Pyralux FR 4 Stiffener Isola FR 406, FR 408, 370 Grace GA-170 LL Polyimide Stiffener Arlon 35 N Aluminum Stiffener Pressure Sensitive Adhesive 3 M 467 MP, F 9469 PC, F 9460 PC • Strain Relief (Epoxy) Emerson &Cuming Eccobond 45 Clear, Black Note: Other materials available and have been manufactured, but non standard on per customer request.

Off-Shore Solution

One Stop PCB Solution • 3 million square feet manufacturing Space • QTA 15 -20 days ( based on technology) • Local Team Support ( US and China) • 24 hours 7 days a week technical support • Focused Facilities based on Technology & Quantities 27

Complete Tooling Package “Build Exact” 28

Integration-Domestic/Offshore “Build Exact” 29

Time To Market “Build Exact”

Intellectual Property ● The implementation of strict protection for intellectual property of customers, other than the traditional encryption and decryption. ● We provide rigorous authorization and detailed access logs to our employees, in order to control the exchange information. ● Move Customers' Logo off and destroy the unusable boards completely. ●……

Beijing Kaiserstra. Be, Germany EUROPE N. AMERICA Utah Oregon ASIA California Chongqing Shanghai Texas AFRICA Zhuhai Florida Shenzhen, Guangdong Hangzhou S. AMERICA OCEANIA Headquarter Plants Offices Go to Slide 1 BACK 32

PCB Capabilities Standard Maximum Layer Count Maximum Panel Size Advanced 36 L 40 L 21”x 24” (533 x 610 mm) 24”x 42” (610 x 1067 mm) Maximum Finished Thickness 0. 126" (3. 2 mm) 0. 256" (6. 5 mm) Minimum Finished Thickness 0. 006" (0. 15 mm) 0. 004" (0. 10 mm) Minimum Core Thickness 0. 002” (50 um) . 0015” (38 um) Trace/Space (H oz) 0. 003” . 0025” Maximum Aspect Ratio 14: 1 25: 1 Minimum Mechanical Drill 0. 008" (0. 20 mm) 0. 006" (0. 15 mm) Minimum Laser Drill 0. 004" (0. 10 mm) 0. 003" (0. 076 mm) Min. Soldermask Dam 0. 003" (76 um) 0. 0025" (64 um) Max. Base Copper Thickness 5 oz (75 um) 6 oz (210 um) Impedance Control +/- 8% +/- 5% 33

Technology Development Continual development of new Technologies, Processes, and Materials • Low Dk/Df, Low CTE, CAF resistant, and Halogen Free FR-4 • High Aspect Ratio Plating (25: 1 and 30: 1) • Advanced plating and photo lithography processes • Advanced tooling systems for registration • High Technology Radio Frequency (RF) PCB’s • Metal Backed and Thermal Management PCB’s • Solid Copper Plating for Through Vias • Deep Blind Vias and Deep Stacked Microvias • Embedded Capacitance & Resistance (2015) • Embedded Heater Circuits (2015) Filled Buried Vias Stacked Microvias 34

Manufacturing Capabilities STANDARD ADVANCED Single-Side Flexible Panel Size Double-Side Flexible Panel Size 12"x 18"x 24" 20"x 26" 24"x 36" 12"x 18"x 24" and Up Mulilayer Flexible Panel Size Layer Count 12"x 18" 3 to 12 18"x 24" and Up 13+ RIGID FLEX PANEL SIZE Layer Count Multiple Lamination Copper Foil Weights Internal/External 12"x 18" 2 to 28 18"x 24" and Up 28+ 1/4 to 2 ounce Up to 3 ounce Kapton Polyimide Stiffener . 001" to. 007" . 008" and Up FR 4 Stiffener . 003" to. 062" . 063" and Up Polyimide Rigid Stiffener Lines, spaces & pad diameters Internal Line Width Internal Spacing External Line Width External Spacing SMT Pitch Controlled Impedance . 003" to. 062" . 063" and Up . 0035". 010" 10% . 001". 010" 5% Via hole Finish Laser Micro Vias Blind/buried Vias Laser Pads Minimum Drilled Hole Size Drilled Hole to Copper Castellation Finish surface STANDARD. 004". 012". 008" Yes ADVANCED. 002". 0079". 007" Yes Tin Lead Plating Thickness . 0003" to. 0005" Less. 0005" Tin Nickel Plating Thickness 150 Micro Inches 250 Micro Inches Low Stress Nickel 100 Micro Inches 250 Micro Inches Gold Plating Thickness 30 Micro Inches As Specified Yes Yes Yes . 002". 001". 005". 003". 002" Yes Yes Yes . 001". 003". 002". 001" Electroless Nickel/Immersion Gold Immersion Silver Entek 106 A HT HASL TOLERANCES Plated Hole Tolerances (+/-) Non-Plated Hole Tolerances (+/-) Fabrication Tolerance (+/-) Vision Rout (+/-) Laser Rout (+/-)

Communication Infrastructure IT Our products are used in 于 Communication Terminal Other Products: Consumer/ Office Facilities/ Military/ Vehicle/ Industrial Equipment Automobile electronic

Product Mix Complete PCB Solutions 37

Certifications Plant ISO 9001 TS 16949 ISO 14001 QC 080000 OHSAS 18001 GJB 9001 TL 9000 F 1 Certified Certified F 2 Certified Certified F 3 Certified Certified F 4 Certified F 5 Certified F 6 Certified Certified AS 9100 ISO 27001 Certified On-going Certified Certified

Materials Material Type 175 ITEQ IT 180 A 175 370 HR 175 Sheng. Yi S 1000 150 S 1141 140 ITEQ IT-140 TC 140 Nan. Ya Halogen-Free FR-4 S 1000 -2 Sheng. Yi Low-Tg FR-4 Tg (°C) ISOLA Mid-Tg FR-4 Product Sheng. Yi High-Tg FR-4 Supplier NY 1140 Sheng. Yi S 1155 130 Sheng. Yi S 1165 170 ISOLA Aluminum Flex Polyimide Rigid Polyimide Nelco N 4000 -13, -13 EP/SI, N 4000 -29 Panasonic Rogers High Speed
 Low Loss Materials FR 408, FR 408 HR, IS 420, IS 620, GETEK Megtron 4, Megtron 6 RO 3003, RO 3006, RO 3010, RO 4003 C, RO 4350 B Arlon / Taconic Yugu PTFE (RF 35, TLX, TLY) YGA Series SY/Taiflex/Panasonic ½, 1 mil, 2 mil PI Ventec VT 901 250 Additional Materials are available. 39

Zeta Certified Revolutionary ZETA® Material • Sunshine is a ZETA® Certified Fabricator • Glass-free Polyimide Film, 13/25 um [0. 5/1 mil] • Low Dk (3. 0 -3. 4) and low Df (. 005 -. 010) • Ideal for HDI and High Speed Applications • High peel strength after multiple lam cycles • Lead-free compatible and Halogen free • High dielectric strength • Eliminates Pad Cratering Zeta® Cap Copper C-Stage Polyimide Zeta® Bond SE B-Stage Epoxy Zeta® Lam Copper C-Stage Polyimide B-Stage Epoxy Graphics provided by Integral Technology 40

Product Showcase High Speed Board • 10 Layer HDI • N 4000 -13 EP • 119 x 112 mm [4. 7”x 4. 4”] • Thickness 1. 6 mm [. 062”] • Construction 1+8+1 • Aspect Ratio 10: 1 • Via-in-Pad (VIPPO) • Min L/S. 10 mm [. 004”] • Drill/Pad. 006”/. 016” • ENIG Finish • Application: GPS Receiver, Satellite Positioning System 41

Product Showcase Telecom Linecard • 16 Layer HDI • 370 HR • 376 x 272 mm [14. 8”x 10. 7”] • Thickness 2. 21 mm [. 087”] • Construction 1+14+1 • Aspect Ratio 11: 1 • Via-in-Pad (VIPPO) • Min L/S. 10 mm [. 004”] • Drill/Pad. 008”/. 018” • Controlled impedance • ENIG Finish • Application: Data Server, Communications 42

Product Showcase High Layer Count Board • 30 Layers • S 1000 -2 (Hi-Tg FR 4) • 7. 0” x 7. 0” • Thickness 3. 81 mm [. 150”] • 25: 1 Aspect Ratio with 25 um [1. 0 mils] plating required in vias • Smallest drill. 006” on. 012” pads • Via-in-Pad (VIPPO) with maximum dimple 12. 5 um [0. 5 mils] • Full body nickel/gold • Minimum line/space. 10 mm [4 mils] • BGA mounting device positional accuracy requirement • Fabrication rout tolerance of +/- 0. 20 mm [. 008”] 43

Product Showcase ATE Board • 34 Layers • S 1000 -2 (Hi-Tg FR 4) • 368 x 368 mm (14. 5”x 14. 5”) • Thickness 4. 6 mm (. 180”) • 18: 1 Aspect Ratio • Blind vias from L 32 -34 • Via-in-Pad (VIPPO) • Internal Cu: 1 & 2 oz • Minimum L/S 4 mils • Drill/Pad. 010”/. 016” • Over 20 impedance controlled lines (SE/Diff) • Countersink holes • For semiconductor testing 44

Product Showcase Rigid-Flex • 14 Layer HDI Rigid-Flex • Construction: 14 R – 2 F – 14 R • Min L/S: . 10 mm [4 mils] • Thickness: 1. 6 mm [. 062”] • Application: Medical • 8 Layer Rigid-Flex • Construction: 3 R – 2 F – 3 R • Min L/S: . 13 mm [5 mils] • Thickness: 1. 0 mm [. 040”] • Application: Industrial 45

Product Showcase • RF (Radio Frequency) • Layer Count: • Mat’l Options: 2 L to 10 L boards Rogers (4350 B, 3010, 4003 C), Taconic (RF 35, TLX, TLY) • Hybrid Option: RO 4350 B + FR 4 • Finishes: ENIG, Thick Wire Bondable Gold, Flash Gold • Special Process: Selective plating and etching • Applications: Radio Trans-receivers, Antennas, Power Amplifiers 46

Comprehensive Quality System Structure In Process Quality Control Incoming Quality Control Panel Control (Traceability) Outgoing Quality Control Quality Assurance TQM Activities (Continuous Improvement) Regular Reliability Test

Implemented Routine Reliability Tests(1) No 1 2 3 4 5 6 7 Description Cross Section Test Parameter Microscope inspection Preconditioning with 2 X IR Solderability Reflow; Solder Pot Temp. : 232± 6 o. C, 2 -3 sec (Solder Dip) Temp 288± 5 o. C, Cycle Time: Thermal Stress, PTH 10+1/-0 sec, Solder Float X 5 Cycles; 1 oz copper foil, 25 mm sample width, vertical pulling @ 50 Peel Strength mm/min for min. 30 mm distance Dielectric Withstanding Finished PCB, 500 +15/-0 V, Voltage 150 V/s, for 30+3/-0 sec Liquid to Liquid -55 to 125 o. C, 15 min. dwell and Thermal Cycling ramp time, 200 cycles Plated thickness of 0. 05 mm to Tensile Strength & 0. 1 mm; gage length 50 mm; Elongation cross head speed 1. 2 mm/min; chart speed 500 mm/min Method Reference Frequency IPC-TM-650 2. 1. 1 per Lot IPC-TM-650 2. 4. 12 per Lot IPC-TM-650 2. 6. 8 per Lot IPC-TM-650 2. 4. 8. 4 weekly IPC-TM-650 2. 5. 7 weekly IPC-TM-650 2. 5. 32 monthly IPC-TM-650 2. 4. 18. 1 monthly

Implemented Routine Reliability Tests(2) No Description Test Parameter Method Reference 65± 2℃, 87+3/-2 %RH, 100 V IPC-TM-650 2. 6. 3 bias, 500 hrs Metal thickness on the pad at four corners and center of the IPC-TM-650 2. 4. 15 board 8 CAF Testing 9 Surface Finish Thickness 10 Solvent Extracted 75% v/v 2 -propanol/water; run IPC-TM-650 2. 3. 25 Contamination (SEC) time: 30 minutes 11 Lead: 230± 5℃ @ 20 -30 sec; J-STD-020 Lead free: 260± 5℃ @ 20 -30 sec 3 M Brand 600 ½” wide; min. 50 Per IPC-TM-650 mm in length; perpendicular 2. 4. 1 pulling IR Reflow Simulation Frequency monthly per Lot per day per Lot 12 Soldermask Adhesion 13 Interconnect Stress Ambient temperature to 150 o. C, IPC-TM-650 2. 6. 26 Test (IST)) min. 300 cycles monthly Tg/∆Tg, CTE, T 260. Sample is heated at a rate of 5 o. C/min until IPC-TM-650 2. 4. 24 all desired transitions have been completed per day 14 Material Stability per Lot

State of the Art Facilities

Facilities Summary • 25 years of PCB fabrication experience in China • Strong financial backing • Market/Product focused factories • State of the art equipment and processes • QTA/NPI to volume production capabilities • No constraints on expansion • Dedicated research and development institute • Commitment to be the technology leader 52

Technology Process

Pre-Production Engineering Services • “In Plan” planning software • Customer Specific Rules Based Automation • Valor front end CAM (Unlimited Seats) • Industry Standard for front end engineering • Stack up consultations, Service Offered No Charge $ • Insight Frontline DFM’s, Service Offered No Charge $ • Tech Seminars /Webinars • Material Science, Latest in Laminates and Preg’s • R&D, Building the Toughest to Gain the Knowledge When you need it, we will be ready! Quality Assurance 54

Hybrid Construction for low cost (Meg 6 combined with low cost material for power layer)

High Speed Materials Website Page

DFM Report 57

Graphical DFM report BACK Go to Pre-Production 58

Imaging System 59

LDI (Laser Direct Imaging) Orbotech Paragon SM 20

LDI Imaging Systems • 100% Laser Direct Imaging (LDI) • Repeatable process, computer controlled • 24/7 consistent imaging regardless of shift • No film means lower tooling costs • No repeating defects • Consistent trace width • Tighter impedance control (+/- 5 %) • ¼ Mil Accuracy. 0008 Min Line/. 0005 Space • Layer to layer registration within. 0004” • No film growth due to heat expansion BACK 61

SCHMID Precision DES Line (Develop – Etch – Strip)

Inner Layer Develop Etch Strip • January 2012 State of the art Schmid DES line Installed • Computer controlled for consistent product • Full automation removes human element • 2 Micron variation over panel • 1 mil core capability for substrate, HDI, and Rigid flex • 4, 000 Cores per day capacity based on current copper mix • Tripled capacity upon installation • Positions Streamline for future technologies BACK 63

ESI UV / CO 2 Laser Drilling Systems • • • 42, 000 Holes Per Minute – 2 tables (84, 000 holes per minute with dual table deployment) – High speed and volume throughput Removes RF stitching constraint Copper weights can be reduced/more waveforms Hole sizes are shrinking with increased density of collimator Recipe controlled Eliminates carbon burn on cutting edge

Laser Drilling • 7 Laser drills in house (7 th has been purchased) • Daily processing 4 -N-4 of means experience • Higher stacks available • . 0014” Hole, . 004” Pad advances technology window • Aspect Ratio: 3: 1 • Positional Accuracy for Hole Location +/-. 0005” 65

Via formation, Aspect Ratios and Stacked Vias for Increased Densities BACK 66

Electroless Processing • Completely Automated Line installed January 2012 • Industry leading 28: 1 Aspect Ratio: allows for higher density designs • Bar coded processing removes operator errors • Dwell times established in planning for speed & efficiency, translating to consistent product • Ultrasonic, knife edge agitation, vibration & thumper • 36 stations, Oversized tanks (24”x 30” Panels) • High volume throughput capability BACK 67

IPS Automatic Electroless Plating Line

Test Capabilities: • 100% Flying probe testing (8 Systems) • Flexibility, no fixtures, less cost • Allows for testing sub chapters before final book • Everett Charles Eliminator faster testing • Every board 100% Net List Tested BACK 69

ATG Flying Probe Testing (8) • 16 Head Test Units • Soft Touch Capable • Fine Pitch. 19 mm Centers to. 003 Pitch • ATG’s A 7 a (2) • • 8 advanced speed test heads Self-loading automation Automatic adjustment of the vacuum matrix Universal shuttle with tensioning function 4 wire measurement Micro short detection Label printer 70

Pluritec Inspecta X-ray Registration System

Internal Registration • In unison with “Xact Software” for scaling • Internal Registration is one of the key attributes in being successful • X-Ray allows verification in real time • X-Sections Verify X-Ray 72

Xact Scaling Report

Non Conductive Filled Via Wrap Per IPC 6012 Class III Electroless Wrap Dendrites (Teeth) Smooth Copper

Copper Fill Laser Vias & Through Hole Solid Copper Vias Thermal Via Farms for Thermal Management BACK 75

Chip Scale Packaging • Chip Scale Packaging Requires Streamlines Equipment Sets for Success-100% LDI 76

LSMDP Laser Solder Mask Defined Pad Using the LDI’s • Precise Imaging to. 0005” clearance – – Allows reduced solder mask clearance sizes May reduce layer count Maximize geometry Using laser solder mask defined pad (LSMDP) • You can define a “Pad” on top of a pad

LSMDP (Laser Solder Mask Defined Pad)

Ink Jet Silkscreen Orbotech Sprint-8 TM

Ink Jet Silkscreen “Now Engineers can actually read to debug!” – Ultra Fine Crisp Lines, Down to 3 mil – Serialization on the fly, BAR Code & QR codes – Applied over partially cured mask providing for the mask and legend to be cure simultaneously to reduce cycle time – Combination inkjet and laser technology – Dry's the ink as it’s applied BACK

Quality Verification • Verify Expected Results • 2 X-Section labs on site • 200 plus sections per day • Wet processing lab onsite • CMM For critical measurement reporting • Two TDR’s for impedance verification • Single ended & diff pairs (Separate testing for accuracy) • Ionic contamination testing • In process lamination X-ray verification • XRF Gold thickness verification X-Ray 81

Q-Pulse Total Quality Management • Quality Assurance Systems • Q-Pulse Quality System • NCMR’s and Corrective Actions • Audits • Training • Equipment Calibrations • Quality Certifications • IPC Certified Trainers 6012, 13, 15, 18 • ISO 9001 AS 9100 C ITAR MIL-P-55110 • Mil-P-31032 In Process BACK 82

Future Investments • New Schmid outer layer etcher • 2 Orbotech AOI systems with. 0005” (1/2 mil) capability • New Electroless Gold line (Enepig) • 2 Additional LDI systems • New Photo plotter for button and silkscreen film • Additional OEM Press • Facility Growth Expansion BACK 83

Sample Case #1 Highlights: 1/1 Trace Space 4 N 4 Stacked Micro Vias. 225 mm 1300 Pin BGA 1. 6 Mil Via – 4 Mil Pad. 020 Thick Sub Panel Test Equipment Set: LDI, DES Laser, Inspecta, LDI, Inspecta, LDI S/M LDI, Laser, Electroless LDI, DES, Inspecta Flying Probe 84

Sample Case #2 Speed Test: • 800 ea 10 layers • 2 Lamination cycles • Buried vias, 2 -9 • Laser Micro Blind 2 -3, 89 • Laser Micro Blind 1 -2, 910 with via in pad • 3/3 trace and space • 6. 5 PTH to Copper Delivered in 4 Days 85

Sample Case #3 Extremely Thin • 4 Layer Buried vias 2 -3 • 2 Lamination cycles • Laser Micro Blind 1 -2, 3 -4 • Finished thickness. 0054 • Equipment set BACK 86