Your Full Service, Time Sensitive, Printed Circuit Board Solution Located in the Heart of Silicon Valley, Streamline Circuits is your premier PCB manufacture of leading edge Technology and Innovation. We offer full service solutions for Rigid PCB’s, Flex PCB’s and Rigid-Flex PCB’s in both Ultra Quick Turn options along with Standard Production lead times. You will find that Streamline holds the necessary certifications to insure the highest standards of workmanship while supporting your companies specifications. Mil / Aerospace Tele. Com Data. Com Medical Industrial 2
Streamline Circuit Corp’s Facility • • The facility was established in 1982 • 75, 000 sq. ft. PCB manufacturing facility • 1 mile from the San Jose Airport • Located in Silicon Valley • Located in Silicon Valley Manufacturing all levels of technology Financially secure in current market conditions – – – Time sensitive prototyping through production New management team installed September 2003 Complete manufacturing process under one roof Delivery convenience for out of state customers Short car ride away for pick up & deliveries Low cost infrastructure 3
Management and their Experience Chuck Dimick –CEO / Founder • Over 35 years of experience in PCB manufacturing. Former CEO of Dynamic Details Inc. and founder of the company's predecessor, Dynamic Circuits Inc. (1991) Greg Halvorson – President / Founder • Over 33 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc. and Dynamic Circuits Inc. Tom Doslak – Sr. Vice President of Sales & Marketing / Founder • Over 25 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional Sales Manager for Dynamic Details Inc. Mike Graves – VP of Operations • Over 30 years industry experience in both production and prototype manufacturing. Former VP of Operations for Pacific Circuits, and DDI. Also has experience as Quality Manager of a major PCB fabricator. Phil Frierson – Director of Quality • Over 25 years’ experience in quality & reliability assurance. Prior to Streamline, Phil was director of Quality & Reliability Assurance for Mo. Sys Inc. for nearly eight years. He has held other positions in management such as Director of New Product Introduction, VP of quality and VP Operations for other companies in the semiconductor space. .
Management and their Experience Cont. Mike Trammel – Director of Engineering • Over 27 years of industry experience. Former Director of Engineering for DDI and Dynavision. 12 years of Materials Application Engineering and R&D experience JR Ramirez – Production Manager / Founder • Over 35 years of industry experience. Former Production Manager for both Dynamic Details Inc. and Dynamic Circuits Inc. Louis Oliveira – Pre-Production Engineering Manager • Over 28 years of CAM “Computer Aided Manufacturing” experience to Streamline Circuits. Previously was Pre-Production Engineering at Dynamic Details. Held various key positions at Davila International Circuits. Phil Ramon – Pre-Production Engineering Supervisor • Over 37 years of experience in the PCB industry. Previously worked for 16 years on the management team for South Bay Circuits, more than 9 years as Pre-Production Engineering Manager and 10 years at CTS Printex.
Customer Service Support • Customer Service (24 hours - 7 days a week) – Sales, Engineering, Manufacturing and Quality • Dedicated customer service readily available-our support group’s located onsite in the facility • Quick response to all requests such as: – – Job status Delivery pull-in Quantity Increases Engineering design modification Inside Sales Customer Support 6
Proactive Engineering Services • Manufacturing Capabilities – Prototype though volume – All time sensitive builds • DFM (Design for Manufacturability) Cam Valor Stations – – – DFM Software (reviews in 10 minutes) Net list compare to customer data Custom Verification programs Looking for customer design error In plan Smart data Collection System • Controlled Impedance Verification – Stack up assistance – Copper distribution – Material verification 4 Laser Direct Imaging units 7
Controlled Impedance Verification • DFM Scan & Report • Stack up assistance • Copper distribution • Material verification • Sub Panel /Array Support Go to Pre. Production
Quality Reassurance • • Automated Optical Inspection Fusion 22 • • – – – – Net list compare prior to MFG Matching Net list to Gerber data Front End DRC (design rule check) Searching for customer design mistakes AOI Automated Optical Inspection Verifying inner & outer layers, and SUBS X-Ray Verification After Lam (Inspecta), After Drilling Cross Section Verification Hole Integrity True-Chem Software Controlled Impedance Testing TDR test of panel coupons 100% Net List Test On All Product Eliminator Tester & flying probe Coordinate Measurement Machine First articles, 100% measurement verification In house Mil & deliverable Lab 9
On Time Delivery Assurance • – – – • 10 flying Probe Testers • – – 100% In-house manufacturing from start to finish Control delivery & customer flexibility In-process quality verification system No out sourcing delivery delays Employee Training program Performance evaluation every 6 months In-house Chemical Laboratory Cross Sections Chemical analysis Mil spec verification Vacuum Lamination press 10
Continuous Improvement Programs • Working daily on: 48, 000 holes per minute 7 Micro Via laser Total – – – – Research and Development Pre-Engineering Programs Improvement Process Program Department Performance Reviews Preventative maintenance program Employee Training Program Planned Capital expense program Management meetings 11
A Full PCB Solution • • • Multilayer Rigid / Rigid- Flex / Flex 1 to 70 Layers Plus 28: 1 High Aspect Ratio 3. 23 Mils Hole to Copper Buried / Blind Vias 9 Sequential Laminations 13+ Stacked Vias 1 Mil Trace & Space Cavity Constructions 6 oz. + Copper Thickness Copper Filled Micro Vias +/- 5% Controlled Impedance Tol. • • • AS 9100 Rev. C / ISO 9001 / ISO 13485 Mil-Spec 55110 / ITAR Ro. HS & Halogen Free Materials IPC 6012 Rigid / 6013 Flex / 6015 MCM / 6016 HDI / 6018 High Frequency 3 Mil Mechanical Drills 24” x 30” Oversize Panel 2 Mil Laser Drill Vias Up to 345 Mils Board Thickness Via Under Pad (Conductive & Non. Conductive Filled) 75+ Materials (Hybrid Constructions) Certifications 12
New Equipment 2016 • Fusion 22 AOI (2) – 3 x the speed of previous models – Resolution down to 25 microns – Multi-Image Technology inspects panel multiple times in different lights angles allows errors to be detected across different colors – Smart Setup provides automatic generation of all parameters – Up to 70% false alarm reduction • SC 150 XXL Vertical Spray Coater – Even coating spray process enhances consistency and mfg. Throughput Ink free holes – Siemens PLC S 7/1200 with Simatic touch screen control panel – Easy to program and store necessary production parameters – In manual mode each single movement can be performed for maintenance 13
• Schmid Material Prep Line • Computer driven • 1 mil cores • OEM Press (3) • 4 Total • Excellon Cobra Combination Laser Drill • 7 on site • 5 Yag lasers • 2 CO 2 • Nuvogo 800 LDI • Measures down to 18 microns • 5 on site 14
• In-Plan Pre-Engineering (Fully integrated) • • Automated Traveler (Rule based) Material Prediction Software (Improves registration) Frontline DFM Tool (Insight, Genesis) CI Modeling and Verification ± 5% • 36 Station Automated Cuposit/Electroless • ≥ 29: 1 Aspect Ratio • Dynamic Scheduling for Multiple Material Types • Inspecta X-Ray (2 Machines) • Layer to Layer Optimization • 3. 2 Hole to Copper • Optimize Advanced Registration for Drilling 15
• Flying Probe Tester (8 Machines) • • 16 Head Test Units Soft Touch Capable Fine Pitch. 19 mm Centers to. 003 Pitch ATG’s A 7 a (2) • 8 advanced speed test heads • Self-loading automation • Automatic adjustment of the vacuum matrix • Universal shuttle with tensioning function • 4 wire measurement • Micro short detection • Label printer 16
PCB TECHNOLOGY ROADMAP Standard Manufacturing 1. Line and Space 2. Drilled Via Size 3. Misc. Attributes 4. Laminate Materials *UTR = Ultra Thin Rigid Advanced Manufacturing Emerging Technology Engineering walk through Line Width Line Space Tolerance . 003”. 0038”. 003” +/-. 001”” +/-. 001 . 002” +/-. 00075” . 001” +/-. 0005” +/-. 00025” Drill Size Pad Diam Aspect Ratio . 008” +. 010” 28: 1 . 004” +. 008” 20: 1 . 003” +. 006” 20: 1 . 003” +. 002” 28: 1 Up to 36 Up to. 187” <16”X 22” 36 to 48 Up to. 300” <19”X 22” 48 to 60 Up to. 350” <22 X 28 >. 350 Interposer Substates UTR’s Next Generation HSD Advanced Interposers Nano Foils Alternative Resin Systems EMI Shield Conductive Bond Ply Thin Flex UL Approved High Speed Flex High Reliability Flex Data Security UL Multilayers Layer Count Thickness Board Size Rigid Flex FR 4 Polyimide PTFE HC (Rogers) Flex Rigid Flex FR 4 Stiffeners http: //streamlinecircuits. com/high-speed-materials/ 17
TECHNOLOGY ROAD MAP CONTINUED Emerging Technology Engineering Walk through Standard Manufacturing 5. Micro Via Size 6. Surface Finishes 7. LDI Soldermask 8. Conductive and Non-Conductive Via Fill Registration Min opening Min hole Aspect Ratio . 004” +. 005”. 6: 1 . 003” +. 004” 1: 1 HASL Entek Imm Silver ENIG ENEPIG Via Size Pad Dam Aspect Ratio Advanced Manufacturing LF HASL Eless Au Sel Solder Imm tin +/-. 003”. 006” +/-. 002”. 003” +/-. 001”. 002” Tangency . 012” 8: 1 . 010” 12: 1 . 008” 18: 1 <. 008 20: 1 . 002” +. 004” 2: 1 . 001” +. 003” 3: 1 Solder Bump TBD 18
Nadcap ISO 9001: 2000 IPC 6012, 13, 15, 16, 18 Class 3 ITAR AS 9100 Rev C Mil-Spec 31032 in process
Q-Pulse Total Quality Management • Quality Assurance Systems – Q-Pulse Quality System • NCMR’s and Corrective Actions • Audits • Training • Equipment Calibrations BACK 20
Streamline’s Capital Expenditures Laser Direct Imaging Nuvogo 800 LDI • Use advanced equipment technologies to manufacture today's printed circuit board requirements • The future in PCB manufacturing is about technology and automation Cuposit & Electroless Line • Hire and Train equipment operators • High percentage engineering personnel and staff DES Inner Layer Stripline 21
Design Strategies Epoxy fill with copper Vias Resin Fill off set Vias Resin fill/stacked Vias All Copper Fill process
V-Stacks: Patented Micro. Via technology that will change everything A combination of Streamline's engineering talent created V-Stack, a new Micro. Via manufacturing process that will change everything we know about Via Stacking. This technology allows a manufacturer to create Micro. Via structures greater than 4 layers deep with only 1 lamination cycle. V-Stack technology also yields finer features and higher layer to layer reliability. Due to the 30% - 60% reduction in processing, this Micro. Via technology is a cost effective route for advanced technology. 23
IPC Manufacturing Class & Industries 24
Rigid-Flex Examples 6 Layer Rigid Flex with Cavity 8 Layer Rigid Flex Micro via 10 Layer Micro via BGA
PCB Equipment Needed for the Future Production Engineering LDI Image Processing Develop Etch Strip Laser Drilling Electroless Technology Registration and Micro Via’s Solder Mask Silkscreen Test Product Integrity Quality Verification Off-Shore Solution Test Cases Flex / Rigid-Flex Back
Flex / Rigid-Flex
Rigid-Flex Examples 6 Layer Rigid Flex with Cavity 8 Layer Rigid Flex Micro via 10 Layer Micro via BGA
Flex Capabilities Standard Advanced Layer Count 1 L to 6 L 8 L to 10 L Maximum Panel Size 10”x 16” (250 x 406 mm) 10”x 35” (250 x 889 mm) Min. Line/Space (H & ⅓ oz) 0. 004" (0. 10 mm) 0. 003" (0. 076 mm) Outline Tolerance +/-. 004” (0. 10 mm) +/-. 002” (0. 05 mm) by laser Stiffener Types PI, FR 4+PSA PI, FR 4, Steel, Alum Polyimide Thickness 0. 5, 1 mil (12. 5, 25 um) 2, 3, 4 mils (50, 75, 100 um) Base Copper Thickness 0. 5, 1 oz (17. 5, 35 um) ¼ to 2 oz (9 to 70 um) HDI Microvias Yes Adhesiveless Materials Yes Flexible Soldermask Yes White Coverlay Yes RA Copper Yes 29
Base Material Flex and Rigid Flex • IPCManufacturer • 4202/1 Du. Pont • 4203/18 Du. Pont • 4204/11 Du. Pont • 4101/21 Isola • 4101/24 Isola • Arlon Preg • 4101 B/124 Arlon Preg • 4101/26 Isola • Isola Prepreg • Grace • 4101/41 Arlon • Isola Prepreg • 4101/42 Arlon Preg • 4101/99 Isola • Other Material Flex and Flex-Rigid Material Name Pyralux FR, Pyralux AP FR 406, FR 408, 370 49 N 51 N FR 406, FR 408, 370 FR 406 N GA-170 LL 35 N P 26 38 N 370 HR • Name • Conductive Silver Ink • Flex LPI Solder Mask Manufacture Du. Pont Taiyo • Rogers • • • Material Name CB 028 PSR-9000 FXT, PSR-900 RFLEX 8080 Liquid Coverlay Kapton/Polyimide Stiffener Du. Pont Pyralux, FR, Pyralux FR 4 Stiffener Isola FR 406, FR 408, 370 Grace GA-170 LL Polyimide Stiffener Arlon 35 N Aluminum Stiffener Pressure Sensitive Adhesive 3 M 467 MP, F 9469 PC, F 9460 PC • Strain Relief (Epoxy) Emerson &Cuming Eccobond 45 Clear, Black Note: Other materials available and have been manufactured, but non standard on per customer request.
Technology Process
Pre-Production Engineering Services • “In Plan” planning software • Customer Specific Rules Based Automation • Valor front end CAM (Unlimited Seats) • Industry Standard for front end engineering • Stack up consultations, Service Offered No Charge $ • Insight Frontline DFM’s, Service Offered No Charge $ • Tech Seminars /Webinars • Material Science, Latest in Laminates and Preg’s • R&D, Building the Toughest to Gain the Knowledge When you need it, we will be ready! Go to slide 8 32
Hybrid Construction for low cost (Meg 6 combined with low cost material for power layer)
High Speed Materials Website Page
DFM Report 35
Graphical DFM report BACK Go to slide 8 36
Imaging System 37
LDI (Laser Direct Imaging) Orbotech Paragon SM 20
LDI Imaging Systems • 100% Laser Direct Imaging (LDI) • Repeatable process, computer controlled • 24/7 consistent imaging regardless of shift • No film means lower tooling costs • No repeating defects • Consistent trace width • Tighter impedance control (+/- 5 %) • ¼ Mil Accuracy. 0008 Min Line/. 0005 Space • Layer to layer registration within. 0004” • No film growth due to heat expansion BACK 39
SCHMID Precision DES Line (Develop – Etch – Strip)
Inner Layer Develop Etch Strip • January 2012 State of the art Schmid DES line Installed • Computer controlled for consistent product • Full automation removes human element • 2 Micron variation over panel • 1 mil core capability for substrate, HDI, and Rigid flex • 4, 000 Cores per day capacity based on current copper mix • Tripled capacity upon installation • Positions Streamline for future technologies BACK 41
Precision Laser Drilling 6 High Speed Laser Drills
Laser Drilling • 6 Laser drills in house (7 th has been purchased) • Daily processing 4 -N-4 of means experience • Higher stacks available • . 0014” Hole, . 004” Pad advances technology window • Aspect Ratio: 3: 1 • Positional Accuracy for Hole Location +/-. 0005” 43
Via formation, Aspect Ratios and Stacked Vias for Increased Densities BACK 44
Electroless Processing • Completely Automated Line installed January 2012 • Industry leading 28: 1 Aspect Ratio: allows for higher density designs • Bar coded processing removes operator errors • Dwell times established in planning for speed & efficiency, translating to consistent product • Ultrasonic, knife edge agitation, vibration & thumper • 36 stations, Oversized tanks (24”x 30” Panels) • High volume throughput capability BACK 45
IPS Automatic Electroless Plating Line
Test Capabilities: • 100% Flying probe testing (8 Systems) • Flexibility, no fixtures, less cost • Allows for testing sub chapters before final book • Everett Charles Eliminator faster testing • Every board 100% Net List Tested BACK 47
ATG Flying Probe Testing (8) • 16 Head Test Units • Soft Touch Capable • Fine Pitch. 19 mm Centers to. 003 Pitch • ATG’s A 7 a (2) • • 8 advanced speed test heads Self-loading automation Automatic adjustment of the vacuum matrix Universal shuttle with tensioning function 4 wire measurement Micro short detection Label printer 48
Pluritec Inspecta X-ray Registration System
Internal Registration • In unison with “Xact Software” for scaling • Internal Registration is one of the key attributes in being successful • X-Ray allows verification in real time • X-Sections Verify X-Ray 50
Xact Scaling Report
Non Conductive Filled Via Wrap Per IPC 6012 Class III Electroless Wrap Dendrites (Teeth) Smooth Copper
Copper Fill Laser Vias & Through Hole Solid Copper Vias Thermal Via Farms for Thermal Management BACK 53
Chip Scale Packaging • Chip Scale Packaging Requires Streamlines Equipment Sets for Success-100% LDI 54
LSMDP Laser Solder Mask Defined Pad Using the LDI’s • Precise Imaging to. 0005” clearance – – Allows reduced solder mask clearance sizes May reduce layer count Maximize geometry Using laser solder mask defined pad (LSMDP) • You can define a “Pad” on top of a pad
LSMDP (Laser Solder Mask Defined Pad)
Ink Jet Silkscreen Orbotech Sprint-8 TM
Ink Jet Silkscreen “Now Engineers can actually read to debug!” – Ultra Fine Crisp Lines, Down to 3 mil – Serialization on the fly, BAR Code & QR codes – Applied over partially cured mask providing for the mask and legend to be cure simultaneously to reduce cycle time – Combination inkjet and laser technology – Dry's the ink as it’s applied BACK
Quality Verification • Verify Expected Results • 2 X-Section labs on site • 200 plus sections per day • Wet processing lab onsite • CMM For critical measurement reporting • Two TDR’s for impedance verification • Single ended & diff pairs (Separate testing for accuracy) • Ionic contamination testing • In process lamination X-ray verification • XRF Gold thickness verification X-Ray 59
Q-Pulse Total Quality Management • Quality Assurance Systems • Q-Pulse Quality System • NCMR’s and Corrective Actions • Audits • Training • Equipment Calibrations • Quality Certifications • IPC Certified Trainers 6012, 13, 15, 18 • ISO 9001 AS 9100 C ITAR MIL-P-55110 • Mil-P-31032 In Process BACK 60
Future Investments • New Schmid outer layer etcher • 2 Orbotech AOI systems with. 0005” (1/2 mil) capability • New Electroless Gold line (Enepig) • 2 Additional LDI systems • New Photo plotter for button and silkscreen film • Additional OEM Press • Facility Growth Expansion BACK 61
Sample Case #1 Highlights: 1/1 Trace Space 4 N 4 Stacked Micro Vias. 225 mm 1300 Pin BGA 1. 6 Mil Via – 4 Mil Pad. 020 Thick Sub Panel Test Equipment Set: LDI, DES Laser, Inspecta, LDI, Inspecta, LDI S/M LDI, Laser, Electroless LDI, DES, Inspecta Flying Probe 62
Sample Case #2 Speed Test: • 800 ea 10 layers • 2 Lamination cycles • Buried vias, 2 -9 • Laser Micro Blind 2 -3, 89 • Laser Micro Blind 1 -2, 910 with via in pad • 3/3 trace and space • 6. 5 PTH to Copper Delivered in 4 Days 63
Sample Case #3 Extremely Thin • 4 Layer Buried vias 2 -3 • 2 Lamination cycles • Laser Micro Blind 1 -2, 3 -4 • Finished thickness. 0054 • Equipment set BACK 64
Скачать презентацию Your Full Service Time Sensitive Printed Circuit Board
c2d54caa689368b7194a5bda53b6b63a.ppt