W-band Module Production and Other Fermilab Contributions Modest Fermilab involvement in QUIET-I Hardware Calibration Tools Proposed Significant Partnership in QUIET-II to the Fermilab PAC in November 2009 3 trips to CIT/JPL to study modules Shifts in Chile Hosted a QUIET Collaboration Meeting at Fermilab in June 09 Access to QUIET-I Data Pier Oddone, Fermilab Director DOE Field Work Proposal In Preparation 1
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Module bias optimization using Grid receiver Before LN 2 KICP Lab in Chicago After Wire grid 3
Commissioning Detector using Rotating Sparse Wire Grid Polarizer 4
The Science Team CMB Theory: S. Dodelson, A. Stebbins RF Technology: D. Mc. Ginnis Detector Fabrication: F. De. Jongh, H. Nguyen The Technical and Engineering Team Tooling Fabrication: J. Korienek, C. Lindenmeyer, Mechanical Assembly and Cryogenics: D. Butler, B. Gonzales, T. Hawke, W. Newby, J. Wilson Significant Experience System Controls: S. Hansen, J. Montes, J. Zimmerman Fermi-Glast Satellite Veto Shield Silicon Tracking Detectors for HEP Dark Energy Survey Camera Electrical Engineering and Testing: D. Kubik 5
Our Proposed Involvement in QUIET Phase II Technical Challenges Assembly of ~1500 W-band Polarization Analyzer Modules Precision Placement of 106 components Components as small as 200 m x 200 m ~ 2 year production run Collaborative effort with Caltech and JPL Very delicate HEMT components Precision control of silver epoxy die bonding Over 200 wirebonds per module Harsh Cryogenic and Vacuum Environment 6
Meeting the Production Goals Utilize 4 Coordinate Measurement Machines to Perform Automated Assembly Upgrade Machines with powerful Labview and Vision System Software Strong interests from ATLAS and CMS in using automated assembly tools at Fermilab for the LHC silicon detector upgrades A natural synergy between QUIET and Fermilab/HEP Work to be performed at the Fermilab Sidet Facility 7
Differences between Phase I and Phase II Assembly and Testing Phase II Module Housing Machining at JPL Module Housing Machining by Vendor using new technique Die Bonding by Nx. Gen New Die Bonding Technique developed at Fermilab Manual Conductor Bonding at JPL Automatic Conductor Bonding at Fermilab - Quality Assurance of Conductor Bonding Mechanical Strength - Quality Assurance of Epoxy Bonding Mechanical Strength Comprehensive Testing of Module Power Draw and RF response at 20 K and Room T Comprehensive Testing of Power Draw at Room T Comprehensive Testing of RF Response at Room T Comprehensive Thermal Cycling of Modules to 20 K Sample Testing of Power Draw at 20 K Sample Testing of RF Response at 20 K Goal: Guarantee quality components and robust procedures in order to reduce need for comprehensive testing. 8
Micro Assembly Tools New Tools for Die Bonding Automated Wirebonding Machines at Sidet Facility Will perform R&D of bonding mechanical strength in vacuum and cryogenic environment: R&D to Guarantee High Assembly Yield Reduces Need for Extensive Cryogenic Production Testing. 9
Quality Assurance is Critical Epoxy Lap Shear Strength Measurements and Thermal Cycling down to 28 Kelvin “Instron” Measurement of Die Bonding Adhesion of Epotek H 20 F Silver Epoxy Expected breaking point Manufacturer’s data on cold-temp degradation does not exist. Epotek is interested in our thermal-cycling result ! 10
Quality Assurance is Critical Al-Au Wirebond Strength Measurements and Thermal Cycling to 28 Kelvin 11
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Module Assembly and Receiver Integration Schedule Q 1 2010 Q 2 Q 3 Q 4 Q 1 2011 Q 2 Q 3 Q 1 Q 4 2012 Q 3 Q 4 Q 1 2013 Q 2 Q 3 Q 4 Tooling Development Module Housing and Non-In. P Parts Fabrication and Delivery of In. P Parts from CIT/JPL Assembly and Testing of 1 st 500 Modules Assembly and Testing of 2 nd 500 Modules Assembly and Testing of 3 rd 500 Modules Integration of 1 st Receiver and deployment Responsibility CIT/JPL Fermilab Chicago-Fermilab Integration of 2 nd Receiver and deployment Integration of 3 rd Receiver and deployment KEK/Princeton 13
Major Subsystem Costs W-Band Module Production and Testing: Caltech, JPL, Fermilab Component Module Housing/Parts Delivery Date 12 -2010 NSF Cost 466 K DOE Cost - DOE Contingency. - Tooling Materials 12 -2010 - 138 K 28 K Tooling Fabrication and Controls Programming 12 -2010 - 104 K 31 K 12 -2010 to 3 -2013 “ - 238 K 594 K 59 K 148 K 466 K 1074 K 266 K Production Labor Testing Labor Total - W-band Receiver Integration: Chicago, Fermilab Component Materials Technician Labor Engineering Labor Total Delivery Date 12 -2010 to 4 -2012 “ “ NSF Cost - DOE Cost 51 K 80 K 94 K DOE Contingency 10 K 24 K 225 K 54 K 14
Summary Project Construction Tasks Delivery of 1500 W-band modules in ~2 year production run Integration and commissioning of 1 Receiver at Fermilab Calibration tools and window engineering analysis Request to Fermilab/DOE: Project Cost = $ 1. 75 M (includes contingency) Operations Cost = $ 224 K Technical and Engineering Labor (no Scientist Labor) Production tooling material costs Contribution to Chile site operations cost Funds for Travel to Chile for Shifts and Installation All overheads have been included 15
Hogan’s Backup Slides 16
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