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Universita’ di Pavia 24 Marzo, 2004 Microelettronica e MEMS Oggi Bruno Murari STMicroelectronics Universita’ di Pavia 24 Marzo, 2004 Microelettronica e MEMS Oggi Bruno Murari STMicroelectronics

Outline l The Electronic System Building Blocks l System Oriented and Smart Power Technologies Outline l The Electronic System Building Blocks l System Oriented and Smart Power Technologies l MEMS: Inertial Sensors and Microactuators l Microfluidics: Lab on Chip and Photonics Switches l Packaging and Interconnections l Conclusions

The Electronic System Building Blocks The Electronic System Building Blocks

Concentrated System in a Single Box Concentrated System in a Single Box

Typical Aggregation of Different Technologies for System Optimization Typical Aggregation of Different Technologies for System Optimization

System Oriented and Smart Power Technologies System Oriented and Smart Power Technologies

BCD History and Evolution BCD History and Evolution

Engine Control Unit Architecture Engine Control Unit Architecture

Typical So. C for Intelligent Mirror in Modern Cars Typical So. C for Intelligent Mirror in Modern Cars

Example of Intelligent Mirror in Modern Cars Example of Intelligent Mirror in Modern Cars

Typical Power Management Chip for Mobile Phones Typical Power Management Chip for Mobile Phones

Example of Portable Sets that require Sophisticated Power Management Chips Example of Portable Sets that require Sophisticated Power Management Chips

Optical Data Storage Disk Drive N/P-LDMOS in H-bridge • Integrated motor driver device with Optical Data Storage Disk Drive N/P-LDMOS in H-bridge • Integrated motor driver device with capability to control the spindle, tracking, focus and tray motors. • This device operates on a single 3. 3 V supply and provides integrated power FETs for all engine motors. N/P-LDMOS in H-bridge

Power Combo for Data Storage Hard Disk Drive N/P-LDMOS in H-bridge Logic CMOS Power Combo for Data Storage Hard Disk Drive N/P-LDMOS in H-bridge Logic CMOS

Logic CMOS N/P-LDMOS Head Driver for Printer Logic CMOS N/P-LDMOS Head Driver for Printer

Efficiencies for Different Classes of Operation for Audio Output Amplifiers Efficiencies for Different Classes of Operation for Audio Output Amplifiers

System Structure of High Efficiency PA Final Amplifier Front Final Amplifier Rear FP + System Structure of High Efficiency PA Final Amplifier Front Final Amplifier Rear FP + RM I_F I_R Rear Front Vin F - - FM RP High Impedance I_RP Control Logic Buffer Vin R +

Example of 2 x 75 Watt High Efficiency PA Thick (6 mm) Copper Metallization Example of 2 x 75 Watt High Efficiency PA Thick (6 mm) Copper Metallization

DDX ® - Direct Digital Amplification DDX ® - Direct Digital Amplification

MEMS: Inertial Sensors and Microactuators MEMS: Inertial Sensors and Microactuators

Silicon as Structural Material Silicon as Structural Material

MEMS: Micro Electro Mechanical System l three dimensional device embedded in silicon – multifunction MEMS: Micro Electro Mechanical System l three dimensional device embedded in silicon – multifunction system consisting of sensors, actuators, electronics. –

Different Type of Accelerometer Different Type of Accelerometer

Rotational Accelerometer Rotational Accelerometer

Silicon Microstructures in Future HDD Silicon Microstructures in Future HDD

Typical Assembly of an HDD Suspension with Microactuator Typical Assembly of an HDD Suspension with Microactuator

Microactuator Chip Microactuator Chip

Microactuator Concept Microactuator Concept

Microactuator without Cap Movie Microactuator without Cap Movie

Microactuator with Cap Movie Microactuator with Cap Movie

Atomic Resolution Storage from HP Atomic Resolution Storage (ARS) technology l Uses focused electron Atomic Resolution Storage from HP Atomic Resolution Storage (ARS) technology l Uses focused electron beams and a phase change media to read and write data l Micromachined movers provide high resolution access of media by fixed emitter tips l Technology developed at HP Labs ARS products l Perfect for mobile applications l Small, high density storage l Memory cards and embedded storage applications l Cost effective … enabling appliances and applications Scientific American – January 2003

Millepede from IBM High Doped Silicon Cantilever Heater Scientific American – January 2003 Millepede from IBM High Doped Silicon Cantilever Heater Scientific American – January 2003

Millipede Movie (from IBM web Site) Millipede Movie (from IBM web Site)

Microfluidics: Lab on Chip and Photonics Switches Microfluidics: Lab on Chip and Photonics Switches

Ink Jet Cartridge Ink Jet Cartridge

Lab on Chip Lab on Chip

“Sample to Answer” Flow “Sample to Answer” Flow

Lab on Chip Movie Lab on Chip Movie

Bubble Switch for Optical Network ST/AGILENT Partnership Bubble Switch for Optical Network ST/AGILENT Partnership

Photonic Switching Concept Photonic Switching Concept

ST/AGILENT Bubble Switch Movie ST/AGILENT Bubble Switch Movie

Packaging and Interconnections Packaging and Interconnections

High Voltage Interconnection High Voltage Interconnection

High Voltage Through Silicon Vias High Voltage Through Silicon Vias

Multichip and Stacked Dice Multichip and Stacked Dice

Conclusions l The VLSI evolution has been and will a be major driving force, Conclusions l The VLSI evolution has been and will a be major driving force, but does not cover the whole picture l Interfacing the real world requires for different approaches, skills and education l Analog electronics is the bridge between the laws of nature (physics) and computing (software): multidisciplinary by nature, impossible to be constrained in one scheme l Lateral thinking is a key process for quantum leaps in innovation

Thank You Thank You