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Thick GEM-like multipliers: a simple solution for large area UV-RICH detectors R. Chechik, A. Thick GEM-like multipliers: a simple solution for large area UV-RICH detectors R. Chechik, A. Breskin and C. Shalem Dept. of Particle Physics, The Weizmann Institute of Science, 76100 Rehovot, Israel R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 1

30 years of “Hole-multiplication” history: • Breskin, Charpak NIM 108(1973)427 discharge in glass capillaries 30 years of “Hole-multiplication” history: • Breskin, Charpak NIM 108(1973)427 discharge in glass capillaries • Lum et al. IEEE NS 27(1980)157, Del Guerra et al. NIMA 257(1987)609 Avalanches in holes • Bartol, Lemonnier et al. J. Phys. III France 6(1996)337 • Sakurai et al. NIMA 374(1996)341, Peskov et al. NIMA 433(1999)492 • Sauli NIMA 386(1997)531 CAT Glass Capillary Plates GEM • Ostling, Peskov et al, IEEE NS 50(2003)809 G-10 “Capillary plates ” R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 2

Expanding the standard GEM… Standard GEM TGEM Geometry: similar to “Optimized GEM” [Peskov] But: Expanding the standard GEM… Standard GEM TGEM Geometry: similar to “Optimized GEM” [Peskov] But: etched rim 1 mm • 50 holes/mm 2 • Microlithography + etching • High Spatial resolution (tens of microns) • VGEM~400 V • >103 gain in single GEM • 106 gain in cascaded GEMs • Fast (ns) • Low pressure – gain~30 • • • 1 -2 holes/mm 2 PCB tech. of etching + drilling Simple and robust Sub-mm to mm spatial resolution VTGEM~2 KV (at atm. pressure) 105 gain in single-TGEM, 107 gain in double-TGEM • Fast (few ns) • Low pressure (<1 Torr) gain 104 Torr R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 3

Expanding the standard GEM ? What scales up? and what does not? • The Expanding the standard GEM ? What scales up? and what does not? • The GEM geometry • Electric fields • Electron diffusion • Electron transport • Gain • Timing properties • Rate capability • Ions transport -> it is a new device that has to be studied from scratch ! R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 4

The TGEMs: A TGEM costs ~4$ /unit. With minimum order of 400$ ~120 TGEMs. The TGEMs: A TGEM costs ~4$ /unit. With minimum order of 400$ ~120 TGEMs. >10 times cheaper than standard GEM from CERN. R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 5

Various TGEMs studied at WIS Manufactured by standard PCB techniques of precise drilling in Various TGEMs studied at WIS Manufactured by standard PCB techniques of precise drilling in G-10 (+ other materials) and Cu etching Typical Atm. pressure geometry Low pressure geometry Hole diameter d=0. 3 mm Hole diameter d=1 mm Distance between holes a=0. 7 mm Distance between holes a=1. 5 mm 3 cm Thickness t=0. 4 mm Thickness t=1. 6 mm Cu G-10 0. 1 mm rim to prevent discharges 0. 1 mm Important for high gains! R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 6

Electric field & e- transport calculations: Maxwell / Garfield • Field values on electrode Electric field & e- transport calculations: Maxwell / Garfield • Field values on electrode surfaces • Field value inside the holes • Field direction->focusing into the holes • Dependence on the hole parameters Operated at VTGEM~2 KV E~4 (KV/cm) multiplication Hole length E~25 (KV/cm) R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 7

Operation principle Multiplication inside holes -> reduces secondary effects Each hole acts as an Operation principle Multiplication inside holes -> reduces secondary effects Each hole acts as an individual multiplier Edrift ETGEM Etrans Garfield simulation of electron multiplication in Ar/CO 2 (70: 30) R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 8

TGEM as a Photon detector Considerations: 1. High field on the pc surface, to TGEM as a Photon detector Considerations: 1. High field on the pc surface, to minimize back scattering. 2. Good e- focusing into the holes, to maximize effective QE. 3. Low sensitivity for ionizing background radiation. Solution: a reflective pc on top of the TGEM. Slightly reversed Edrift (~50 V/cm) • good photoelectron collection! • Low sensitivity to MIPS R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 9

TGEM as a Photon detector (‘cont) 0. 4 mm thick 0. 3 mm holes TGEM as a Photon detector (‘cont) 0. 4 mm thick 0. 3 mm holes 0. 7 mm pitch For typical operation voltages: Surface field > 5 k. V/cm • Full photoelectron extraction • High effective QE • TGEMs studied so far are more optically transparent than standard GEM. • Cu: 40 -50% area R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 10

Effective gain and effective QE Reflective pc Semitransparent pc PC PC GEM i i Effective gain and effective QE Reflective pc Semitransparent pc PC PC GEM i i measured gain in current mode is an effective gain: Effective gain = true gain in X the holes efficiency to focus the e - into the holes. QE in the detector is an effective QE: QE Eff. QE = true QE X efficiency to of the pc extract the ph. e. detect the ph. e. R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 11

Single-TGEM: Gain Example: TGEM with reflective Cs. I photocathode (Similar results with semitransparent pc) Single-TGEM: Gain Example: TGEM with reflective Cs. I photocathode (Similar results with semitransparent pc) n n Gain 104 -105 Single-photon detection no photon feedback Rise time < 10 ns 105 10 ns R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 12

Double-TGEM: Gain Example: TGEM with a semitransparent Cs. I photocathode (similar results with reflective Double-TGEM: Gain Example: TGEM with a semitransparent Cs. I photocathode (similar results with reflective pc) Important for double TGEM: • high Etrans • Large transfer gap 107 e- Etrans = 3 kv/cm 5 mm n n n Higher total gain (106 -107) >103 higher gain at same VTGEM Better stability R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 13

Operation in CF 4 Problem: • Requires high TGEM voltage. • Damage due to Operation in CF 4 Problem: • Requires high TGEM voltage. • Damage due to sparks is fatal: after a spark the TGEM deteriorates continuously. (We suspect effects of etching to the Si. O 2 fibers). • Fatal spark damage was also observed in standard GEMs operating in CF 4, due to the high operating voltages. Solutions: • Segment the TGEM • Cascade several TGEMs. • Test other materials: Kevlar, Teflon, etc. R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 14

Electron transfer efficiency TGEM with a reflective pc (Edrift=0) Transfer efficiency e affects energy Electron transfer efficiency TGEM with a reflective pc (Edrift=0) Transfer efficiency e affects energy resolution, detection efficiency, effective QE F f 0. 4 mm thick 0. 3 mm holes 0. 7 mm pitch Compared to standard GEM, very high fields are reached at the TGEM surface already at low VTGEM. Good e- extraction in all gases. R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 15

Electron transfer efficiency TGEM with a semitransparent pc is important also for double TGEM Electron transfer efficiency TGEM with a semitransparent pc is important also for double TGEM operation 0. 4 mm thick 0. 3 mm holes 0. 7 mm pitch Full efficiency already at low gains 10 -100 ! (more complex measurement) • Double-sided pc • Double normalization • Single e- pulse counting as before R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 16

Electron transfer efficiency -cont’ TGEM with a semitransparent pc - dependence on Edrift/VTGEM ETGEM/Edrfit Electron transfer efficiency -cont’ TGEM with a semitransparent pc - dependence on Edrift/VTGEM ETGEM/Edrfit > 1 ETGEM/Edrfit < 1 e- focused to hole e- collected on GEM top With typical TGEM operation voltage: full eff. up to Edrift = 4 kv/cm 0. 4 mm thick 0. 3 mm holes 0. 7 mm pitch R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 17

Energy resolution: 6 ke. V x-rays FWHM=~20% E resolution similar to standard GEM R. Energy resolution: 6 ke. V x-rays FWHM=~20% E resolution similar to standard GEM R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18

Counting rate capability § Reflective Cs. I pc § UV photons (185 nm) 0. Counting rate capability § Reflective Cs. I pc § UV photons (185 nm) 0. 4 mm thick 0. 3 mm holes 0. 7 mm pitch Total current limit 4*10 -7 [Amp/mm 2] R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 19

Ion back flow Affects pc longevity and secondary effects TGEM with a semitransparent pc Ion back flow Affects pc longevity and secondary effects TGEM with a semitransparent pc IBF = ipc/i. TGEM s. t. pc 0. 4 mm thick 0. 3 mm holes 0. 7 mm pitch Start amplification 12% With high VTGEM most of the ions are collected on the top of the TGEM. R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 20

Ion back flow Affects pc longevity and secondary effects TGEM with a reflective pc Ion back flow Affects pc longevity and secondary effects TGEM with a reflective pc IBF = ipc/i. TGEM Reflective pc With a reflective photocathode, most of the ions are collected on the top of the TGEM (like in a GEM). R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 21

Summary 1. G-10 TGEMs tested with several gases. 2. Gains: 105 with a single Summary 1. G-10 TGEMs tested with several gases. 2. Gains: 105 with a single TGEM; 107 with cascaded double TGEM 3. Fast signals: r. t. <10 ns. 4. The e- transfer efficiency (into the holes) is well understood. 5. Counting rate capability: ~ 106 avalnches/sec x mm 2 @ gain 4 x 104 6. Ion backflow: study in course 7. In TPC-like conditions: IBF with a single TGEM is 12%. 8. In GPM/reflective pc: IBF with a single TGEM is 98%. 9. A cascade + other “tricks” (see GEM/MHSP) should reduce IBF . 10. 8. TGEMs of different materials (e. g. Kevlar, Teflon…) for CF 4 ? . 11. 9. Will study TGEM of lower optical transparency (higher eff. QE) R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 22

The end R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem The end R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 23

TGEM: Low pressure operation § low pressure isobutane § semi-transparent Cs. I photocathode Single TGEM: Low pressure operation § low pressure isobutane § semi-transparent Cs. I photocathode Single TGEM 10 Torr Isobutane Gain~105; Rise time~5 ns R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 24

TGEM: Low pressure operation § low pressure isobutane § semi-transparent Cs. I photocathode R. TGEM: Low pressure operation § low pressure isobutane § semi-transparent Cs. I photocathode R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 25

Electron transfer efficiency the efficiency to focus an electron into the TGEM Pulse counting Electron transfer efficiency the efficiency to focus an electron into the TGEM Pulse counting measurement: • A way to separate the true gain from the effective gain. • Based on single e- pulses • same pc, lamp, gain and electronics, different e- path. • Comparing counting rate provides the fraction of single e events reaching TGEM bottom. (1) normalization (2) efficiency measurment Example: ref pc R. Chechik et al. ________RICH 2004_______ Playa del Carmen, Mexico C. Shalem et al, IEEE 2004, Rome, October 18 26