Telecosm 2004 John Trezza 2004 Xanoptix Inc

Telecosm 2004 John Trezza © 2004 Xanoptix, Inc 1

Xanoptix Purpose Xanoptix exists to permit the concept of a “Chip” to transcend materials, technologies and distances. Xanoptix will enable a world free of hardware bottlenecks by allowing unimpeded communication between integrated circuits Many data paths, Unrestricted speed, and Vast reach (microns to kilometers). By doing so, we will Radically improve the price/performance electronics, Merge ‘chips’ and ‘the network’, and Move the IC industry from a ‘mainframe-like’ model to a ‘PC-like’ model. © 2004 Xanoptix, Inc 2

More Complex Chips with More I/O hip NC a. O at D d re esi (D ta) Da C Sta ck I ed 10, 000 x ip Data Off Ch © 2004 Xanoptix, Inc 3

Industry Problems ICs: Poor Communication & Performance • IN SYSTEM: Can send 0. 01% of Desired CHIP Data • BY USING 10% to 50% of CHIP POWER AND AREA • IN NETWORK: 0. 0001% ICs: complex to design & Limited In Roadmap & Expensive • Material Choices Like the Model-T Colors • IP sharing hard • $1 million & Months of Design for Each Attempt • No Upgradability • Large chips = “wafers-per-chip” Yields • Million costs when 90% of chip needs Inexpensive • Chips not expected to grow in next 10 years! © 2004 Xanoptix, Inc 4

What we do – 3 D Integrated Circuits Material-Neutral, Chip-level, direct die-to-die interconnection Integrate 3 D Wafer THE XANOPTIX DIFFERENCE MILLIONS of Connections per cm 2 Daughter Wafers Mother Wafer (e. g. CMOS) Electronic Passive Optical Si Ga. As, In. P Ceramic ANY Material / Process / Fab Stack Semiconductor Economies of Scale. Ga. As Si Si Silicon CMOS, Bi-CMOS, Ga. As IC, etc. Multi-Vertical-Stack 1000 s Optical Connections Electronic Connections (um sized) © 2004 Xanoptix, Inc (Chips kilometers Apart Act as 1 Chip) 5

Process Base Process Electrical, Mechanical, Thermal Connection 4 to 14 um Daughter IC I/O Pad Openings <5 um Mother Wafer 7 to 50 um Multi-Stacking Chips w/ vias © 2004 Xanoptix, Inc 6

What we are working to achieve Repeat the IC Revolution Transform Boards of Chips & Modules Into Individual Stacked Chips PROCSSOR WLAN USB/Audio HDD USB/ Audio/HDD OPTICAL GRAPHICS DRAM © 2004 Xanoptix, Inc 7

What we are working to achieve Move the IC Industry from a ‘mainframe-like’ to a ‘PC-like’ model Transform Large, Complex Chips Into Modular Stacked Chips Mainframe-Like © 2004 Xanoptix, Inc PC-Like 8

What we are working to achieve Remove I/O Bottlenecks over Any Distance. Transform Many ICs & the network Into One Big ‘Chip’ Transceiver © 2004 Xanoptix, Inc 9

3 D Stacked ICs: ICs are Dramatically Improved in Performance • ALL Data Available over ANY distance (The chip =network) • 90% Less I/O Power • 99% Less I/O Space ICs are Unlimited in Flexibility & Decreased in Cost • Mix & Match Processes & Material From Best Suppliers • The chip IS the board • Days of Design for new version of a chip • Customize & Upgrade your chip just a PC. • Several Smaller chips each with very high yield • Cost is on function-by Function basis • ‘Unlimited’ chip size © 2004 Xanoptix, Inc 10

Key Capabilities ELECTRONICS 3 D Stacked IC OPTICS Mixed Signal IC Design Optical Device Design & Fabrication 3 -D Folded Packaging Design Optical Packaging Design © 2004 Xanoptix, Inc 11

Xanoptix Has Advanced 3 D Capabilities Electrical Chips Demonstrated Chips for Products Capability ~ 600 10, 000 Million+ 14 um 7 um 4 um 2 um 40, 000/cm 2 160, 000 / cm 2 1, 000/cm 2 1, 000+/ cm 2 216 N/A ~ 300, 000 > 300, 000 1 st Optical Product # contacts/chip Contact Size Contact Density # Optical devices © 2004 Xanoptix, Inc Contact yields 99. 9995% 12

First Commercial Application Combines active optics and electronics into single chips Single Chip Optoelectronic Transceiver 250 Gb/s (equivalent to 1, 250 Ethernet Cards) © 2004 Xanoptix, Inc 13

Para-Optix Product Line Xanoptix Component Xanoptix IC • 15 x number of optical devices • 3: 1 Laser redundancy • Programmable Chip Optical Connector Heat Sink Electrical Connector Xanoptix 3 -D Packaging Optical Output 1 cm P R O G R A M MING XTM-12 XTM-16 5 Gb/s © 2004 Xanoptix, Inc XTM-24 XTM-32 XTM-48 XTM-72 400 Gb/s 14

PARA-OPTIX VS. LC SFF IP Routers Core Switching CATV/Metro Switching Storage/Data Switching Computing & Server © 2004 Xanoptix, Inc 15

Next Generation: Fiber Cables NEXT GENERATION PASSIVE OPTICAL CABLING “ 100, 000 points of light” 100, 000 fibers 3 mm 100, 000 s of fibers 1000 s Optical I/O © 2004 Xanoptix, Inc 16

Future Development Roadmaps Intelligence Tx / Rx Transceiver Backup/redundancy Power monitoring Pre-Emphasis Equalization SERDES Clock Recovery Microprocessor FPGA Graphics Network Processors SRAM &DRAM BIOS Chipsets Memory controllers Drive controllers Data aggregators Microprocessors Gb. E / Fib. Ch codec SONET scrambling Crossbar Switching Drop/Add ECC & CRC Regenerators Framing Header Decoding Digital Crossconnect WDM Crossconnecct Clocking distribution Bus Controller © 2004 Xanoptix, Inc Speed/I/O 640 Mb/s/ch 1 Gb/s/ch 1. 25 Gb/s/ch 2. 5 Gb/s/ch 3. 125 Gb/s/ch 5. 5 Gb/s/ch 6. 25 Gb/s/ch 10 Gb/s/ch 12. 5 Gb/s/ch 40 Gb/s/ch # optical I/O 1 2 4 8 12 16 24 32 48 72 96 128 144 256 288 576 9216 36864 589824 Wavelength(s) 850 nm VCSEL 1310 nm DFB Single Mode devices CWDM (2 -16 l) 1550 nm DFB DWDM(16 -256+ l) 600 nm VCSEL 1310 nm VCSEL 17

Example: Communication Systems Expensive Monolithic BECOME Routers, Servers, DWDM systems $1 Million ; 6 ft System. Commodity Systems • 1000 s of Optical I/O channels • Hundreds of wavelengths $1, 000 ; 1 in System. Microprocessor, Router, DWDM System © 2004 Xanoptix, Inc 18

Transceiver © 2004 Xanoptix, Inc 19

Computing, Storage, Office, and Consumer Opportunities Single Chip Digital Cameras (Sensor, Logic, Memory, display, and Network in one) Highly Parallel Communication For storage systems Other Consumer Electronics • Single Chip DVD Recorder (read the disk in one rotation) • Memory Stacks • Single chip “Xbox in a wristwatch” • Printer/Scanner/Copier Chip © 2004 Xanoptix, Inc 20

Next Generation: Telecom & Communications Products WLAN on a Chip Cell Phone / Base Station “on a Chip” LNB devices/Modules for Satellite TV Single-Chip, Ultra Redundant Undersea Repeaters Single Chip Fiber to The Home ‘box’ Modular ASICs © 2004 Xanoptix, Inc 21

Next Generation: Consumer, Industrial, Military, and Commercial Active printed circuit boards, Cables & IC sockets The Connector/Cable *IS* the Electronics/Optics/network In-Flight Networking & Entertainment Chips Single Chip High-Temp Industrial Control Sytems Avionics & Space © 2004 Xanoptix, Inc 22

Next Generation: Automotive Products Active Auto Fiber Harness (embedded Electronics and/or optics in cables/connectors) Drive by Wire; In Car network. Sensor Modules / Engine Control Modules On Board Computer Networks Silicon Ga. As / In. P MEMS © 2004 Xanoptix, Inc Ga. N RF Optics 23

Summary: Performance, Functionality, Yield, Cost • A Chip combines the best of all technologies. • Merge ‘chips’ and the ‘network’ • Increased Communication Bandwidth & Functionality (millions / cm 2) • Extended communication distance (1 um kms) • Lower communication power • Upgradability: Treat ICs like PCs • Eliminate the need for entire classes of other components • 1 st Commerical Chips: 245 Gb/s in 1 square centimeter --more bandwidth than 1000 Ethernet cards • Huge opportunities throughout the industry. © 2004 Xanoptix, Inc 24

The Vision Event Integrated Circuits Developed (1961) Significance First Product Market Result Revolutionized Electronics Hearing Aid $100 s Billions Electronics industry now (TI & Fairchild) 3 D and OPTICALLY Revolutionizes ENABLED Electronics & Integrated The Network Circuits Developed (2001) Intelligent Transceiver $ (Xanoptix) © 2004 Xanoptix, Inc 25