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Searching for Higher Ground: Unveiling Ne. SSI* Gen. II *New Sampling/Sensor Initiative IFPAC - Searching for Higher Ground: Unveiling Ne. SSI* Gen. II *New Sampling/Sensor Initiative IFPAC - San Diego, CA, USA - Jan. 23, 2002 Rob Dubois - Peter van Vuuren - Jim Tatera and Associates “the best way to predict the future is to create it”

What is Ne. SSI? - Activities in 2001. . . z An ad hoc What is Ne. SSI? - Activities in 2001. . . z An ad hoc global industry initiative, formed June, 2000 to drive permanent change in how we do Process Analytical. z Sponsored by the Center for Process Analytical Chemistry (CPAC) z 2001 Activities… y. Focus Groups: Pittcon, ISA, IFPAC, CPAC y. Tutorials: ISA-Houston, INTERMAC-Tokyo y. Special Teams: X-Team

Ne. SSI Objectives z Facilitate the acceptance/implementation of. . . y modular, miniature & Ne. SSI Objectives z Facilitate the acceptance/implementation of. . . y modular, miniature & smart sample system technology y based on ISA SP 76 standard substrate (aka footprint) z Promote the concept of. . . y field-mounted smart sampling/analytical systems y sample system integration with miniature physical sensors z Lay the groundwork for. . . y open connectivity architecture for sensor communications (e. g. CANbus, Ethernet, etc. ) y industry standard communication protocols (e. g. OPC, etc. ) z Provide a technology bridge to the process for. . . y “sensor/lab-on-a-chip” micro-analytical devices

The drivers for change. . . z Reduce Cost to Build y. Design and The drivers for change. . . z Reduce Cost to Build y. Design and Engineering y. Manufacturing and Installation z Reduce Cost of Ownership y. Design Standardization y. Simpler, less expensive maintenance z Enhance Reliability y. Validate sample, data, communication

Market Acceptance Lower Cost Ease of Design System Reliability So Where In the World Market Acceptance Lower Cost Ease of Design System Reliability So Where In the World Are We? What’s going on in the world? • Fast networks; robust electronics • Lab-on-a-chip; lasers; wireless Ne. SSI What does the Market Need? • Reliable, rugged, fast analysis What are the Critical Issues? Analyzer House On the Post Time • Acceptability by Process Analy. • Technical challenges • Reasonable Cost

Ne. SSI Generation I zmechanical, passive components on an ISA SP 76 standard substrate Ne. SSI Generation I zmechanical, passive components on an ISA SP 76 standard substrate (SEMI roots) Manufacturers… • Parker-Hannifin • Autoflow • CIRCOR • Kinetics • Swagelok Courtesy of Swagelok

Ne. SSI Generation I z. Generation I - Industry Trends… y. End Users desire Ne. SSI Generation I z. Generation I - Industry Trends… y. End Users desire the conversion of today’s proprietary stand-alone modules into a SP 76 compliant configuration. (e. g. G. C. block & bleed, bypass loop & filtration, vent control, validation modules, etc. ) y. There will be a continual introduction of more components as End Users and Manufacturers embrace SP 76.

Introducing the Ne. SSI Gen. II Specification Introducing the Ne. SSI Gen. II Specification "When men got structural steel, they did not use it to build steel copies of wooden bridges. " Ayn Rand. Atlas Shrugged. 1957.

Ne. SSI Generation II z“Electrified” with diagnostic sensors z. Integral substrate heating & temp. Ne. SSI Generation II z“Electrified” with diagnostic sensors z. Integral substrate heating & temp. control z. Sensor & actuator serial communication z. Electrical components integrated with the SAM (Sensor Analytical Manager) z. Smart (self-diagnostic)

Gen II - A Global, Hazardous Package Heaters: - Substrate & Enclosure - IEC Gen II - A Global, Hazardous Package Heaters: - Substrate & Enclosure - IEC Ex d by Design Div/Zone 1 GP. A-D, T 4 NEMA 4 & IP 56 Rated Enclosure - insulated AC Power Under review by multi-functional X-team Sensors - Flow, Pressure, Temp. Encapsulated (IEC Ex m) Intrinsically Safe Bus (IEC Ex i)

Gen. II “The Future is Friendly” - Typ. No Purge or Pressurization - Low Gen. II “The Future is Friendly” - Typ. No Purge or Pressurization - Low utility req. - No need to S/D for maintenance (X-purge) AC Power - Intrinsically Safe electrical sensors and bus allow “hot” Plug & Play capabilities - NO GAS “SNIFF” PERMIT REQ. FOR MAINTENANCE General Enclosure; no costly X-proof bolting or flameproof enclosure Flexible All-Climate Operation

Gen. II - Serial Bus “Au Revoir 4 -20 m. A? ” z Flashable Gen. II - Serial Bus “Au Revoir 4 -20 m. A? ” z Flashable CANbus y. Device. Net, SDS, etc. z Engineering units on board sensors z Reduces wiring load z Eliminates I/O z Rugged, low cost (tiny) chip V T P A

Gen. II “Get on the substrate (bus)!” A Memory Comm. µP A/D Flow Sensor Gen. II “Get on the substrate (bus)!” A Memory Comm. µP A/D Flow Sensor A Vent Pneu-trinsic “combi” valve Comm. D/A Solenoid Actuator Valve

Gen. II “Flexible PID control” PID Control V P Substrate Pressure Regulator - spring Gen. II “Flexible PID control” PID Control V P Substrate Pressure Regulator - spring & diaphragm - also temperature and flow control

Gen. II - SAM* does the repetitive jobs PDA Field Interface Gateway to an Gen. II - SAM* does the repetitive jobs PDA Field Interface Gateway to an Ethernet LAN - Graphical - OPC - Wireless -Bluetooth™ - 802. 11 Wi-Fi Host to a… Sensor/Actuator Bus SAM Software Applets for Sample System Repetitive Tasks (Appl-I) Provides “Open” Development Space for Custom Software The Bluetooth and the Bluetooth trademark are owned by Bluetooth SIG, Inc. *SAM = Sensor Analytical Mgr.

Gen. II - Standalone and/or Embedded SAM Ethernet LAN Analyzer Controller CANbus V T Gen. II - Standalone and/or Embedded SAM Ethernet LAN Analyzer Controller CANbus V T P A

What will a Gen II system look like? Ethernet LAN CANbus Analyzer Controller V What will a Gen II system look like? Ethernet LAN CANbus Analyzer Controller V F P A T Substrate Programmable Substrate Heater T Auxiliary Heating/Cooling SAM PDA

Gen III - Enabling Technology for Analysis Fiber Optic AT Courtesy of CPAC SAM Gen III - Enabling Technology for Analysis Fiber Optic AT Courtesy of CPAC SAM (Mass-Sensors Inc. ) One sensor per component “lab on a chip” One Sensor and Multiple Analytes A F Vv T A

Gen. III “Beam Me Up, Scotty” z Sensor signal is wireless. . . Ethernet Gen. III “Beam Me Up, Scotty” z Sensor signal is wireless. . . Ethernet LAN y 802. 11 Wi-Fi y Bluetooth z Power Supplied by. . . y X-proof mini power bus y …or IS power bus V F P A Power Supply Universal AC Power

Today’s Ne. SSI Compliant Analytical Systems OXYGEN p. H Courtesy of Rosemount Analytical Courtesy Today’s Ne. SSI Compliant Analytical Systems OXYGEN p. H Courtesy of Rosemount Analytical Courtesy of Panametrics & Swagelok H 2 O Courtesy of Panametrics & Swagelok UV, VIS Courtesy of Applied Analytics

Announced at IFPAC 2002. . . HOT Conductivity Courtesy of Rosemount Analytical and CD Announced at IFPAC 2002. . . HOT Conductivity Courtesy of Rosemount Analytical and CD Feng

Today’s Mass Flow Controllers New Courtesy of Porter Instruments and the Swagelok Co. y. Today’s Mass Flow Controllers New Courtesy of Porter Instruments and the Swagelok Co. y. Porter (Div. 2) y. Unit Instruments y. Brooks

Petrochemical Plant installations. . . Courtesy of another petrochemical facility and Parker-Hannifin Courtesy of Petrochemical Plant installations. . . Courtesy of another petrochemical facility and Parker-Hannifin Courtesy of a major gulf coast petrochemical facility

Ne. SSI Roadmap Analytical & Wireless Gen. III Smart/”Electrified” Gen. II Mechanical Gen. I Ne. SSI Roadmap Analytical & Wireless Gen. III Smart/”Electrified” Gen. II Mechanical Gen. I Analytics/Sensors (e. g. laser based)/Wireless Simple Analyzers (H 2 O, O 2, p. H, UV/VIS, etc. ) Smart Field Installations Prototype - Gen II Smart/Heating/SAM Mechanical Field. Installations Mechanical Components e. g. filters, valves, etc. Ne. SSI/CPAC Vision & Roadmap SP 76 Substrate Available 2000 Rev. 1, Dec. 2001 01 02 03 Time (years) 04 05 06

Summary: “Higher Ground is in Sight” z. Roadmap & 3 Generations Outlined z. Impending Summary: “Higher Ground is in Sight” z. Roadmap & 3 Generations Outlined z. Impending Release of Gen II Spec to Ne. SSI Mail-out List z. Gen. II prototype z. Spin-offs: Conn. I, Appl-I, analytical, t sensors

Acknowledgements I z The X-Team y [Team Lead] Jim Tatera y Peter Pergande (Exxon. Acknowledgements I z The X-Team y [Team Lead] Jim Tatera y Peter Pergande (Exxon. Mobil) y Dave Lewko (Bantrel) y S. Leach (Shell) y A. Allen (Conoco) y D. Chadwick (Total. Elf. Fina) y R. Ales (Swagelok) y R Eddleman (Measurementation) y Don Long (MTL) y Glen Schmidt (SAAI) z ISA SP 76 Members z Exxon. Mobil Chemical y Dan Podkulski (SP 76) y Jeff Gunnell y John Cumbus y Rajko Puzic z Dow Chemical y Craig Snook y Walt Henslee y Bac Vu (SP 76)/John Leach III y C. Kleimeier/S. Bach y Debbie Mack/Naim Akmal y K. Elliot/D. Ponthieu z CPAC y Mel Koch/Dave Veltkamp

Acknowledgements II Ne. SSI Components y Doug Mitchell Panametrics y John Wawrowski Swagelok y Acknowledgements II Ne. SSI Components y Doug Mitchell Panametrics y John Wawrowski Swagelok y Yoav Barshad - Applied Analytics y Nick van Bruggen - Porter y CD Feng - Rosemount y Steve Doe - Parker. Hannifin Connectivity y Kelley Bell - ABB y Bob Nickels - Honeywell y Bob Farmer - Siemens y Jonathan Bradford Rockwell Automation y Gary Frank - Kinetics y Rick Ales - Swagelok Instrinsic Safety y Chris Towle - MTL

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