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Production Testing of ATLAS MDT Front-End Electronics G. Brandenburg, J. Oliver, M. Nudell, Harvard Production Testing of ATLAS MDT Front-End Electronics G. Brandenburg, J. Oliver, M. Nudell, Harvard University, Cambridge MA C. Posch, E. Hazen, Boston University, Boston MA L. Kirsch, Brandeis University, Waltham MA 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 1

Monitored Drift Tube (MDT) System • • Pressurized tubes: Ar/CO 2 at 3 atm Monitored Drift Tube (MDT) System • • Pressurized tubes: Ar/CO 2 at 3 atm 3 cm Aluminum tubes, 50 m Au-plated W-Re wire Length to 6 m Z 0 = 390 Gas gain ~ 2*104 Maximum drift time ~ 700 ns Resolution spec (per tube) 80 m Total of 360 k tubes 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 2

MDT Chamber isolated electrically from support and services. Only power/optical connections TTC Fanout Optical MDT Chamber isolated electrically from support and services. Only power/optical connections TTC Fanout Optical Fibers ROD (DAQ) Gigabit Optical Link (GOL) 2003 -10 -02 Drift Tubes LV Power 5 V DC @ 60 W Isolated Ground Spacer Frame HV Power Drift Tubes Chamber Service Module LV Power HV Power 3. 5 k. V Isolated Ground (1 k) Single Point Earth Ground E. Hazen - LECC 2003 - Amsterdam 3

MDT Electronics Readout End Completely Shielded Drift Tubes Lower Faraday Cage Hedgehog PCB Upper MDT Electronics Readout End Completely Shielded Drift Tubes Lower Faraday Cage Hedgehog PCB Upper Faraday Cage Mezzanine PCB 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 4

ASD Chip 1 of 8 channels Transimpedance preamps (delta response) ZIN 120 Bipolar shaper ASD Chip 1 of 8 channels Transimpedance preamps (delta response) ZIN 120 Bipolar shaper Discriminator Control logic Signal Dummy Wilkinson ADC LVDS TW QIN DACs Calibration Mode Deadtime Serial string register Note: with grateful acknowledgement of work of Mitch Newcomer / U. Penn 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 5

AMT-3 TDC • • 24 Channels 0. 78 ns least count Trigger matching logic AMT-3 TDC • • 24 Channels 0. 78 ns least count Trigger matching logic LVDS serial I/O for control and data • CMOS; rad-tolerant 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 6

Mezzanine Board Octal ASD AMT-3 TDC Note 2 D Barcode Discharge Protection Power, I/O Mezzanine Board Octal ASD AMT-3 TDC Note 2 D Barcode Discharge Protection Power, I/O Connector Digital, Analog Voltage Regulators Top/Bottom Layer PCB Ground Planes 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 7

Chamber Service Module • Multiplex up to 18 x 24 channels via optical fiber Chamber Service Module • Multiplex up to 18 x 24 channels via optical fiber • JTAG control of frontends • TTC (trigger/clock) signals distribution Ribbon Cables From Mezz Boards TTC Fiber CSM DC Power 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam GOL Fiber To DAQ 8

ASD Production • Packaged ICs purchased • 72 k parts tested in 3 months ASD Production • Packaged ICs purchased • 72 k parts tested in 3 months on home-made automatic tester • 3 -5 sec per chip test time (no robotic loader) • Tester cost about $100 k including 1 m-yr University engineering (vs $500 k for lower-performance commercial tester) • Detailed test results kept in database 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 9

ASD Tester Overview High-level commands i. e. : • Read preamp input levels • ASD Tester Overview High-level commands i. e. : • Read preamp input levels • Measure noise rate PC Parallel Interface Input Fifo Test Socket LVDS (Outputs) Commands (daughter board) Serial i/o Output Fifo High-level result data i. e. : • Measured DC levels • Measured noise rate 2003 -10 -02 DC Controller FPGA (XC 2 V 1000) Data Control Analog support DACs, ADCs, Multiplexers Command Processor: • 16 ns clock period • 4 ns TDC (DLL) • Floating-point timer (20 Hz-20 MHz) E. Hazen - LECC 2003 - Amsterdam 10

ASD Tests • Serial I/O Test to verify JTAG interface • DC (voltage/current) tests: ASD Tests • Serial I/O Test to verify JTAG interface • DC (voltage/current) tests: – Preamp input voltage (self-bias point) – Bias Voltage Generator sweep • Can extract KP and KN – LVDS Driver Output VDIFF and VCM – Power Supply Current • AC (dynamic) tests: – Wilkinson ADC parameters – Programmable deadtime vs setting – Threshold sweep • Vary discriminator threshold and measure noise hit rate • Fit results to Gaussian • Extract V(offset), Sigma and nose rate at threshold=0 • All results saved to database for long-term reference 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 11

Threshold Sweep Test (Example of One Test) Noise vs threshold sweep • Gaussian fit Threshold Sweep Test (Example of One Test) Noise vs threshold sweep • Gaussian fit gives • Sigma • Discriminator offset voltage • Peak hit rate • Test takes ~2 sec • 2 channels simultaneously 4 seconds • Grand total test time < 5 seconds This test is an effective “go/no-go” test of the entire analog chain. 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 12

Threshold Sweep Test Implementation Floating. Point Timer 8 -bit mantissa 3 -bit exponent Latch Threshold Sweep Test Implementation Floating. Point Timer 8 -bit mantissa 3 -bit exponent Latch A MUX Data Out Latch B OVFL Measure time to record 32 hits using floating-point Timer (FPGA logic) OVFL Chan. A Counter Chan. B Counter Chan. A ASD output Chan. B ASD output 5 -bit event counters Control Logic (State Machine) 2003 -10 -02 Loop over threshold Settings from – 40 to 40 m. V (software loop) E. Hazen - LECC 2003 - Amsterdam Effective range from 20 Hz to 20 MHz Controlled by FSM Implemented using State. CADTM 13

Threshold Sweep Test Results: Offsets Cut at 12 m. V Gives 75% yield • Threshold Sweep Test Results: Offsets Cut at 12 m. V Gives 75% yield • Channel-to-channel spread of DC offsets at discriminator is most useful output of this test • Primary parameter for “quality” grouping of ASDs 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 14

ASD Test Result Summary • Overall 93% yield of functional parts • Most “Out ASD Test Result Summary • Overall 93% yield of functional parts • Most “Out of Tolerance” rejects due to threshold offsets > 12 m. V 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 15

Board Production Plan • Assemble in Israel, ship to Boston • Test flow: – Board Production Plan • Assemble in Israel, ship to Boston • Test flow: – Serialize with 2 D Barcodes – Burn-in (24 hr at elevated temp) – Full Functional Test – Pack and Ship 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 16

Mezz Board Test Setup Readout Adapter VME Readout PC, Software… Sites for 15 Boards Mezz Board Test Setup Readout Adapter VME Readout PC, Software… Sites for 15 Boards Test Pulse Injector 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 17

Mezz Board Testing • Full test of 15 boards in a few minutes • Mezz Board Testing • Full test of 15 boards in a few minutes • JTAG programming test • Threshold sweep similar to chip test – Termination resistor seen; confirms board connectivity – Verifies TDC and DAQ logic functionality • Bonus: – Individual boards can be identified with 99. 999% accuracy by threshold offset “signature” 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 18

Board Burn-In Facility Enclosed Cabinet Rack 10 Subracks (3 U std) Power Supply 2003 Board Burn-In Facility Enclosed Cabinet Rack 10 Subracks (3 U std) Power Supply 2003 -10 -02 PC with I/O Card (Digital/Analog) • 24 -hour elevated temp burn-in • Continuous monitoring of current, voltage, temp. Summary data stored indefinitely in database E. Hazen - LECC 2003 - Amsterdam 19

Board Burn-In Data • “Strip Chart” record: – Temperature (each board) – Analog, Digital Board Burn-In Data • “Strip Chart” record: – Temperature (each board) – Analog, Digital regulator output – Analog, Digital supply current • Problems such as tantalum cap failures show clearly • Max/Min/Mean/Sigma of each quantity stored in permanent database 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 20

Database • Extensive set of measured parameters kept for each channel/chip/board • Web access Database • Extensive set of measured parameters kept for each channel/chip/board • Web access with query/plot facilities • Tied to barcode ID of each chip and board • Some sample plots: Scatterplot of FET KN vs KP 2003 -10 -02 Histogram of Threshold Offsets E. Hazen - LECC 2003 - Amsterdam 21

Summary • Custom test hardware for production of 360 k channels built • 72 Summary • Custom test hardware for production of 360 k channels built • 72 k chips tested in 3 months • Test/burn-in capacity of 150 boards/day • On track to start delivery later this year • Would we do it this way again? Yes! 2003 -10 -02 E. Hazen - LECC 2003 - Amsterdam 22