Pioneers in Non-contact Measurement MTI Instruments Inc

Pioneers in Non-contact Measurement

MTI Instruments, Inc. Ø Founded in 1961 --now a public company listed on NASDAQ Ø Designs, manufactures and markets non-contact measurement instruments and systems for manufacturing and laboratory applications

Company Profile We apply our technical expertise in electronics, optics and software to meet the precision measurement needs of end-users and OEMs Ø Key attributes of our products: Non-contact High resolution Custom probe sizes High frequency response Accurate Reliable Ø Global sales, service and support network Ø Total customer commitment

Company Profile MTI Instruments, Inc. PBS Group Ø Portable engine balancing systems for the aircraft industry General Instruments Group Semiconductor Products Group Ø Measurement probes and electronics for laboratory and industrial applications Ø Measurement systems designed specifically for the semiconductor industry

Core Technologies MTI Instruments employs three unique sensing technologies to meet the diverse measurement needs of our customers Ø Accumeasure - Capacitance Displacement Thickness Micro-positioning Ø Microtrak - Laser triangulation Robotic Control Flatness Dimensional Measurement Ø Fotonic - Fiber Optic Vibration Positioning Modal Analysis

Semiconductor Products Group MTI Instruments offers a complete line of semiconductor metrology systems to meet the stringent requirements of the industry Ø Proforma™ 300 - Manual wafer thickness measurement Ø Proforma™ 300 GR - Manual thickness and resistivity in single compact design Ø Proforma™ 200 SA - Semi-Automated wafer surface mapping Ø Proforma™ Auto. Scan 200 - Fully automated wafer mapping system

PROFORMA Wafer Thickness Measurement Systems Ø Based on MTI’s proprietary Push-Pull capacitance technology Ø Ideal for both semiconducting and semi-insulating materials Ø Manual, semi-automated and fully-automated models for laboratory and manufacturing process applications

Push-Pull Probes Ø Single Sensing Face Ø Constant current supply, linear voltage change based on air gap Ø Electrical grounding of target required Ø Dual Sensing Element Ø No electrical grounding of target required Ø Ideal for highly resistive materials

Semiconductor Applications Wafer Specifications Ø Material: Semiconducting and Semi-Insulating Ø Diameter: 50 - 200 mm. Ø Surface: As-Cut, Lapped, Etched, Polished, Patterned Ø Flat/Notch: All SEMI standard Flat(s) or Notch Ø Conductivity: P or N type Ø Mounting: Bare Wafer, Sapphire/Quartz, Tape Process Monitoring Ø Slicing: Blade and wire guide degradation monitoring Ø Lap/etch and Polishing Removal Rates Ø Backgrinding Ø Final Inspection

PROFORMA 300 Ø Manual, non-contact wafer thickness gage Ø Thickness, TTV, continuous and 5 -point measurement Ø Measures diverse materials without re-calibration Ø Output data to any PC Ø Portable, easy to set up and operate—ideal for SPC

PROFORMA 300 Key Features Teflon wafer stage for easy non-abrasive positioning High-resolution LCD display Proprietary Push-Pull™ probe technology Adjustable stage for precise leveling On-board microprocessor for accurate, repeatable measurement Menu-driven for fast, easy setup

PROFORMA 200 SA Ø Semi automated operation Ø Windows® based control interface Ø Measures thickness, bow, warp, global and site flatness, TTV Ø Complete wafer surface mapping Ø Multiple chucks for all wafer sizes Ø Economical alternative to fully automated system

PROFORMA AUTOSCAN 200 Ø Fully automated wafer measurement system for semiconducting and semiinsulating materials Ø Thickness, TTV, bow, warp, resistivity, site and global flatness Ø Outstanding accuracy and repeatability Ø Integrated, modular design

PROFORMA AUTOSCAN 200 Ø Standard Windows NT user interface for easy set-up. Ø Choose from standard or user-programmable wafer scan patterns to mach your measurement needs.

PROFORMA AUTOSCAN 200 Ø Precise site flatness measurements are obtained through programmable wafer and site geometries.

PROFORMA AUTOSCAN 200 Ø Automated, full surface scanning allows for 3 -dimensional imaging of wafer profile.

PROFORMA AUTOSCAN 200 System Features Ø Completely automated wafer handling and surface scanning Ø Measures all wafer materials --Si, Ge, Ga. As, In. P Ø Full 1000 um thickness measurement range without recalibration Ø Measures wafers from 75 -200 mm. in diameter; Ø 100 wafer/hour throughput Ø Universal robot end effector Ø Automatic detection of wafer diameter Ø Laser cassette scanning detects crossovers, empty slots, broken wafers

PROFORMA AUTOSCAN 200 System Features (continued) Ø Ø Ø SEMI compliant modular design Integrated control system Ethernet network interface Customized data reporting Enclosed environment for Class 10 compatibility Optional laser OCR mark reading and resistivity modules

The new standard for measuring semiconducting and semi-insulating wafers