Personal and Portable: The technology that is making it happen Gene A Frantz Principal Fellow Texas Instruments
Decades of Digital Signal Processing Decade Characteristic $/MIPS ’ 60 s University Curiosity $100 - $1, 000 ’ 70 s Military Advantage $10 - $100 ’ 80 s Commercial Success $1 - $10 ’ 90 s Consumer Enabler 10¢ - $1 Beyond Expected Part of Daily Life 1¢ - 10¢
Generations of DSP Processing Processors 1980 1990 Technology Product Technology What is DSP? How do I create a product? How do I solve problems?
Early DSP’ing Milestones n Before 1965: First tentative steps n 1965: Rediscovery of the FFT n 1965 to 1970: The potential becomes clear n 1970 to 1980: Tools are developed n 1980: VLSI makes it practical n Now: Incredible computational power opens up many new applications Courtesy of Ron Schafer
Some Early Contributors Bishnu Atal John Markel, Steen Gray John Makhoul Manfred Schroeder Courtesy of Ron Schafer
The TX-2 Computer, Circa 1967 Courtesy of Ron Schafer
Another Contributor Jack Kilby 1 st Integrated Circuit
One View of DSP, Circa 1976 “That discipline which has allowed us to replace a circuit previously composed of a capacitor and a resistor with two anti-aliasing filters, an A-to-D and a D-to-A converter, and a general purpose computer (or array processor) so long as the signal we are interested in does not vary too quickly. ” Thomas P. Barnwell, III = IN Filter A/D DSP D/A $50 $500 $50 Filter OUT $50 Courtesy of Ron Schafer
Early DSP’or Milestones 1978: TI “Speak and Spell” DSP synthesizer 1979: Intel 2920 “Analog Signal Processor” 1979: American Microsystems International S 28211 1980: NEC µPD 7720 1980: AT&T Bell Labs DSP-1 (captive) 1982: TI TMS 32010 Courtesy of Will Strauss
The Key Drivers “Smaller Features è Lower Cost/Function è Larger Market” Plotted Annually History Forecast
Lithography Advancements Fuel Growth Nanometer 400 nm 350 nm 250 nm 180 nm 130 nm 90 nm 6" 6" 6" 8" 12" Die size (mm 2) 80. 7 46. 6 19. 2 10. 7 6. 7 4. 2 Dies per wafer 310 558 1435 2626 12, 186 18, 667 5922% increase in dpw
Shrinking Process: The Benefits Device Year Transistors Process 32010 1983 50, 000 3. 0 um NMOS 32020 1984 100, 000 2. 4 um NMOS 320 C 30 1988 500, 000 1. 0 um CMOS 320 C 50 1990 1, 200, 000 0. 8 um 320 C 5510 2000 22, 000 0. 18 um 320 C 556 x 2002 180, 000 0. 13 um
Wafer Fabs Wafer size: 300 mm Final capacity: 35 K+ wafers/ month Technology: 130 nm copper 90 nm copper # Tools on floor: 320 1 st full flow silicon: 2 -15 -01 130 nm qualification: 2 Q 02 90 nm customer prototypes: 2 H 02 90 nm qualification: 2 H 03 Fab Space Greater than 10 K wafers per month Waffle table: Total mfg: 118 K sq. ft. 150 K sq. ft.
130 nm Copper Technology Today Wireless Infrastructure Wired. Infrastructure Performance Audio Digital Still Client Wireless Camera Wireless Infrastructure 6 DSP CPU 600 MHz Viterbi and Turbo hardware accelerators Wireless Client @ 300 MHz CPU 6225 MHz DSP+GPP 24 Mb 3 MB 300 MHz DSP+GPP @ integrated Imaging 600 MHz memory integrated Floating Low power 3 MB accelerators 180 M point consumption memory transistors Viterbi Voice, data, video hardware accelerators Performance Audio DSP+GPP Low power consumption Voice, data, video 180 M transistors and Turbo TMS 320 C 5561 OMAP 5910 TMS 320 C 6416 Digital Still Camera DSP+GPP Imaging TMS 320 C 5561 accelerators TMS 320 DM 310 TMS 320 DA 610 OMAP 5910 TMS 320 C 6416 TMS 320 DM 310 225 MHz Floating point TMS 320 DA 610
90 nm Transistor Over 400 million transistors on a single chip n Functional integration to create entire system on one chip 37 nm Delivery n Initial test chips in 90 nm process – 1 H 02 n First device – 2 H 02 n Fully qualified production – 2 H 03 Result n Cost-effective, system-on-a-chip n Unprecedented performance levels n Significant power savings 12" 6"
What will it cost? EUV 157 -nm 193 -nm 248 -nm 450 ? 300 -mm 200 -mm 100 -mm i-line 150 -mm g-line 1 x scan ?
The Future of Integration DEVICE CAPABILITIES 1982 1992 2002 2012 Technology (u. M) 3 0. 8 0. 1 0. 02 Transistors 50 K 500 K 180 M 1 B MIPS 5 40 5, 000 50, 000 RAM (bytes) 256 2 K 3 M 20 M Power (m. W/MIPS) 250 12. 5 0. 1 0. 001 Price/MIPS $30. 00 $0. 38 $0. 02 $0. 003 The Greatest DSP Products Haven’t Been Invented Yet
Trends In Technology n n n n Transistors moving from microns to nanometers Gates per square millimeter going from tens of thousands to hundreds of thousands Die sizes shrinking from tens of square millimeters to units of square millimeters Wafer size moving to 300 millimeter Dies per wafer increasing from thousands per wafer to tens of thousands per wafer Tooling costs going from hundreds of thousands of dollars to millions of dollars Fab cycles increasing from weeks to months
The Age of Computing ? ? TAM Internet $500 B DSP & Analog PC $100 B Microprocessor $10 B Minicomputer TTL/Logic $1 B Mainframe Transistors 1960 s 1970 s 1980 s 1990 s 2000 s 2010 s
The Perfect Roadmap One Device Even Fewer Devices Lots of Devices Time
Quiz Who is the only DSP Guru with their picture on a Nation’s Currency?
Quiz Who is the only DSP Guru with their picture on a Nation’s Currency?
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