a8099567abf8b307d8cad428e735679f.ppt
- Количество слайдов: 44
Non solo "Best Performance"! Le nuove soluzioni per HPC e Cloud computing. Antonio Rolli Senior Sales Manager Version 2012 Q 1 Confidential © Supermicro 2012
Supermicro Overview l Founded in 1993, headquartered in Silicon Valley, USA (NASDA 2007: SMCI) l Supermicro is the market leader in server technology innovation and green computing l Supermicro has the broadest server portfolio than anyone else in the industry; all the designs are in-house / under the same roof l Supermicro’s application-optimized high-efficiency server, blades, GPU system, storage and workstation are deployed globally for data centers and critical IT infrastructures
Our Position & Potential to Grow Confidential Revenue ($M) l Market share Growing every year since founding, no exception l Outgrowing our aggressive competitions consistently l Winning by Technology and TTM June, 2011 2008 ~ 2011 Growth Rate l To grow even faster through increasing scale and innovation SMCI Other Tier 1’s
Technology Evolution Supermicro’s Building Block Solutions From MB, Chassis to Complete Rack w/ Pwr & Sys management Fat Twin Management SWR 2012
Product Families Data Center Optimized Twin Architecture GPU Solutions PUE optimized Cost optimized Mainstream Business Solutions FAT TWIN , PUE~1. 1 Storage Server Super. Blade® Resource Optimized (WIO/UIO) Micro Cloud 8 -Way MP System Workstation Application Optimized: Max. I/O Embedded
PUE Optimization v Drive thermals to 47 C Data Center Operating Temperature v Achieve PUE ~1. 1 v $250, 000* saved for every 4 C increased in DC temperature (For every 2500 DP nodes) v Make free-air-cooling (no air conditioning) possible Confidential
Make Servers More Efficient l Server systems need to continuously improve on power efficiency l 94%+ Efficiency is the mainstream and further efficiency increase will see diminishing return l The goal for digital power is to improve overall efficiency over the complete spectrum ü Well-designed cooling subsystem ü High-efficiency power supply ü Energy efficiency components Efficiency ü Power management software solution
Resource Optimized (WIO/UIO) Twin Architecture Data Center Optimized High-Performance Computing High Density Cloud Computing Application Optimized: Multi I/O GPU Super. Computing Embedded Super. Blade 2 UTwin 2, 2 UTwin 2+, 2 UTwin+, 1 UTwin Mainstream Business Solutions Workstation Storage Server
The Twin Architecture l Phenomenal success since its debut 5+ years ago, l Wide-range of usage across multiple industries: l l ü Doubled density Increases space utilization HPC Oil & Gas Web Portal – Front End Storage l Continue to attract more users with the Cloud explosion l ü 50% more HDD Bay Increases capacity More than 40 SKU available on the X 9 platform alone! ü Share power source Decreases PUE ü Shared Cooling Further decreases PUE ü Hot-swap Improves serviceability ü Integrated I/O Reduced cost, Increases versatility
2 U Twin 2 New Features 4 node in 2 U DOM SATA Disk on Module Memory up to 256 GB DDR 3 Reg. ECC Intel® Xeon® Sandy Bridge E 5 -2600 Series Socket R 4 x high efficient Cooling Fans Mellanox Connect. X QDR/FDR Infini. Band onboard (selected module) Platinum level high efficient 1620 W redundant power supply PCI-Express 3. 0 x 16 (low profile) 6 Hotswap 2. 5” SAS/SATA per node or 3 Hotswap 3. 5” SAS/SATA per node PCI-Express 3. 0 x 8 for SMCI AOC LSI 2108 or 2008 Node 1 Node 2 Node 3 Node 4
2 U Twin 2+ New Features 4 node in 2 U DOM SATA Disk on Module Memory up to 512 GB DDR 3 Reg. ECC Intel® Xeon® Sandy Bridge E 5 -2600 Series Socket R 4 x high efficient Cooling Fans PCI-Express 3. 0 x 8 Micro. LP slot IB FDR: AOC-CIBF-m 1 10 G SFP+: AOC-CTG-i 1 S AOC-CIBF-m 1 Platinum level high efficient 1620 W redundant power supply AOC-CTG-i 1 S PCI-Express 3. 0 x 8 for SMCI AOC LSI 2108 or 2008 6 Hotswap 2. 5” SAS/SATA per node or 3 Hotswap 3. 5” SAS/SATA per node Node 1 Node 2 Node 3 Node 4
2 U Twin New Features 2 U TWIN > 1 U + 1 U DOM SATA Disk on Module Memory up to 256 GB DDR 3 Reg. ECC Intel® Xeon® Sandy Bridge E 5 -2600 Series Socket R Supports 135 W 2. 9 GHz 4 x high efficient Cooling Fans Mellanox Connect. X QDR/FDR Infini. Band onboard (selected module) Platinum+ level high efficient 1280 W redundant power supply 3 PCI-Express 3. 0 x 8 (1 x LP, 2 x FHHL) 12 Hotswap 2. 5” SAS/SATA per node or 6 Hotswap 3. 5” SAS/SATA per node PCI-Express 3. 0 x 8 for SMCI AOC LSI 2108 or 2008 coming soon 2208 Node 1 Node 2
2 U Twin+ New Features DOM SATA Disk on Module Memory up to 512 GB DDR 3 Reg. ECC Intel® Xeon® Sandy Bridge E 5 -2600 Series Socket R 2 x Optional Cooling Fans (Rear) for Higher CPU W & Operating Temp. Support PCI-Express 3. 0 x 8 Micro. LP slot IB FDR: AOC-CIBF-m 1 10 G SFP+: AOC-CTG-i 1 S Platinum+ level high efficient 1280 W redundant power supply AOC-CIBF-m 1 AOC-CTG-i 1 S 12 Hotswap 2. 5” SAS/SATA per node or 6 Hotswap 3. 5” SAS/SATA per node PCI-Express 3. 0 x 8 for SMCI AOC LSI 2108 or 2008 coming soon 2208 Node 1 Node 2
Fat Twin. TM Server Solution June 15, 2012 Confidential © Supermicro 2012
Confidential Application Optimized vs. Flexible GPU Application Hadoop/Storage Application Confidential HPC/Cloud Application ? SMC Fat Twin Server Solution
Confidential Fat Twin Server Overview Confidential SYS-F 627 R 3 series SYS-F 617 R 2 series 4 U Fat Twin Overview: ► 4 U, rack mount chassis, EIA std 19” rack support ► XEON 130 W w/ 47 ºC and 135 W w/ 35 ºC support ► Two choice of enclosure: 30” and 35” depth ► Best PUE ~1. 1 and Free-air-cooling support ► 8/4/2 Hot-plug system nodes access from front side* ► 3% ~ 10% better efficiency + PUE optimization ► Redundant digital PWS, efficiency ≥ platinum level ► 8 HSWP 3. 5” HDD or 12 Fixed 3. 5” HDD per U
Optimized Configurations Confidential SYS-F 617 R 2 -R series SYS-F 627 R 3 -R series v 8 x Hot-plug MB nodes v Dual Sandy Bridge EP processor v 16 x DDR 3 DIMM v 6 x Hot-swap 2. 5” SAS/SATA HDD v 1 x Micro-LP + 1 x PCIe LP slots v Rear I/O, 30” enclosure v v SYS-F 617 R 2 -F series SYS-F 627 R 2 -F series v v v 8 x Hot-plug MB nodes w/ 47 o. C Dual Sandy Bridge EP processor 8 x DDR 3 DIMM 2 x HSWP 2. 5” + 2 x Fixed 3. 5” HDD 1 x PCIe LP slot Front I/O, 30” enclosure 4 x Hot-plug MB nodes Dual Sandy Bridge EP processor 16 x DDR 3 DIMM 8 x Hot-swap 3. 5” SAS/SATA HDD or 6 x Hot-swap 3. 5” HDD w/ 47 o. C v 1 x Micro-LP + 1 x PCIe LP slots v Rear I/O, 30” enclosure 4 x Hot-plug MB nodes w/ 47 o. C Dual Sandy Bridge EP processor 16 x DDR 3 DIMM 6 x HSWP + 12 x Fixed 2. 5” HDD 3 x PCIe LP slot + 2 x GPU (35” only) Front I/O, 30” & 35” enclosure SYS-F 627 R 3 -F series SYS-F 627 R 2 -R series v v v 47 o. C 4 x Hot-plug MB nodes w/ Dual Sandy Bridge EP processor 8 x DDR 3 DIMM 4 x HSWP + 4 x/6 x Fixed 3. 5” HDD 1 x PCIe LP slot Front I/O, 30” enclosure 4 x Hot-plug MB nodes Dual Sandy Bridge EP processor 16 x DDR 3 DIMM 12 x HSWP 2. 5” SAS/SATA HDD 1 x Micro-LP + 2 x PCIe FH slots Rear I/O, 30” enclosure
Optimized Configurations Confidential SYS-F 627 G series SYS-F 647 G series v v v v v 4 x Hot-plug MB nodes Dual Sandy Bridge EP processor 16 x DDR 3 DIMM 3 x GPU support Front I/O, 35” enclosure 2 x Hot-plug MB nodes Dual Sandy Bridge EP processor 8 x/16 x DDR 3 DIMM 4 x/8 x GPU support Front I/O, 35” enclosure Hadoop optimized series Storage/JBOD series v v v v v 4 x Hot-plug MB nodes Dual/Single Sandy Bridge EP processor 8 x/16 x DDR 3 DIMM 12 x 3. 5” + 1 x 2. 5” HDD 1 x PCIe LP slot Front I/O, 35” enclosure 4 x Hot-plug JBOD nodes Dual channel expander Total 68 x 3. 5” HDD Front load, 35” enclosure And more is coming……
Confidential Why choose Fat Twin. TM Confidential ► Optimized design for different applications - Datacenter/ Cloud/ HPC applications - Science/ Research/ GPU application - File server/ Storage server - General server/ Enterprise server ► Free-air cooling and PUE optimized - Efficient air cooling design (PUE ~1. 1) - 135 W XEON CPU support up to 35 o. C - 130 W XEON CPU support up to 47 o. C ► Flexible, easy to maintain and Cost effective - Flexible and configurable node structure - Hot-plug MB node access from front side, easy for maintenance - Resource sharing in design, tooling, inventory and components for cost effectiveness - Support standard rack ► High density, high performance and lower power consumption - High density: support DP 16 DIMM & 8 x 3. 5” hot swap HDD per 1 U - High density: support DP 16 DIMM & 3 GPU per 1 U or 8 GPU per 2 U - High efficiency design for MB and sharing cooling with 3 -10% less power usage - High operation temperature support (47 OC Free-air-cooling, PUE~1. 1)
SYS-F 627 R 3 -RTB+/ SYS-F 627 R 3 -R 72 B+ PUE optimized SAS 2 H/W RAID (2208) with BBU support Intel® Xeon® Sandy Bridge E 5 -2600 Series Socket R 6+2 Hot-Swappable 3. 5” HDD per U New design locking mechanism Individual power/LED control Front accessible hotswap tray features better serviceability 16 Reg. ECC DIMM SATA Disk on Module
Introducing to 8 hot swappable 3. 5”HDDs per U 2 x 3. 5” HDDs or 2 PCIE 3. 0 x 8 1+1 1280 W 95% PSU 1 x LP PCIE 3. 0 x 16 2 x USB ports 1 x Dedicated IPMI port 1 x VGA port 2 X Gb. E ports 1 x Micro LP
SYS-F 617 R 2 -RT+/ SYS-F 617 R 2 -R 72+ (4 U, 8 x hot-swap node) SAS 2 H/W RAID (2208) with BBU support Intel® Xeon® Sandy Bridge E 5 -2600 Series Socket R 6 Hot-Swappable 2. 5” HDD New design locking mechanism Individual power/LED control Front accessible hot -swap tray features better serviceability 16 Reg. ECC DIMM SATA Disk on Module
Rear view of SYS-F 617 R 2 -RT+/ SYS-F 617 R 2 -R 72+ 1+1 redundant 1620 W 94+% PSU 2 x USB ports 1 x VGA port Micro LP: 2 x G-LAN 1 x LP 1 x FDR IB PCIE 3. 0 1 x 10 G SFP+ x 16 2 X Gb. E ports 1 x Dedicated IPMI port
Super Micro. Cloud. TM Super. Blade® GPU Solutions Storage Universal I/O Double-Sided Twin Architecture Datacenter Optimized http: //www. supermicro. com/Micro. Cloud/
What is Micro. Cloud? l Super. Server with a large number of UP nodes to maximize shared resource utilization and provide a cost-effective alternative to typical rackmount servers without any compromise. l Evolutionary design to expand Supermicro’s presence in high-efficiency Cloud computing infrastructure deployments http: //www. supermicro. com/Micro. Cloud/
Key Specifications 3 U Height (23” Depth Only) 1+1, 1620 W Redundant P/S 8 x Hot-Pluggable UP nodes Micro-LP 2 x Gb. E (per node) PCI-E 2. 0 x 8 Low-profile slot (per node) Individual Power/UID (per node) 16 x Hot-swap 3. 5” HDD (2 x SATA 3 HDDs per node) Dedicated IPMI LAN (per node)
Micro. Cloud. TM - Advantages • Space savings • High density design. Save 62. 5% rack space compare to traditional 1 U server • Power Savings • 94% power efficiency • Optimal power utilization, Improved cooling efficiency with bigger fans. • >15% power savings over standard 1 U UP Server. • Cost savings • Lower TCO through improved resource sharing, remote management, and redundancy • High Performance • 95 W CPU support, Hot-swap SATA 3 HDD, PCI-E slot, Micro-LP card • Ease of maintenance • Hot-swappable compute node, HDD, PSU. • IPMI for remote management
SYS-5037 MC-H 8 TRF - Micro. Cloud. TM SYS-5037 MC-H 8 TRF =Motherboard: MB-X 9 SCD-F =3 U Chassis: CSE-938 H-R 1620 B Processor Support Intel® Xeon E 3 -1200 series Processor (Sandy Bridge) Chipset Intel® C 204 PCH Chipset (Cougar Point) Memory Capacity Up to 32 GB DDR 3 ECC UDIMM 1333/1066 support Expansion Slots (per node) 1 x PCI-E x 8 LP Slot per Node I/O ports (per node) 2 x Gb LAN (Intel 82580) 1 x Dedicated LAN for IPMI Remote Management 1 x VGA, 1 x COM port, 2 x USB 2. 0 (with KVM dongle) Drive Bays (per node) 2 x 3. 5” Hot-Swap SATA (6 G/s) Software RAID (0, 1) Power Supply 1620 Watts Redundant 80 Plus Platinum Level Key features l l High-density, Enterprise Performance, Cost-effective, Multi-node UP server Up to 8 x hot-pluggable node in 3 U chassis IPMI 2. 0 with KVM over Dedicated LAN for each node Redundant 80 Plus Platinum Level Power Supplies System Cooling 4 x 8 cm Heavy Duty Fans with Speed Control Applications l l l Cloud Computing/Provider Web/Collocation Services Web Cache, CDN, Video Streaming Social Networking, downloads Corporate – WINS, DNS, Print, Login Available NOW
SYS-5037 MR-H 8 TRF (Romley Micro. Cloud) Micro. Cloud II – Romley UP System =Motherboard: MB-X 9 SRD-F =3 U Chassis: CSE-938 H-R 1620 B Processor Support Intel® Romley E 5 -2600/1600 series Processor (Socket R) Chipset Intel® C 600 PCH Chipset Memory Capacity Up to 128 GB DDR 3 ECC LV/LR/R/UDIMM 1333/1600 in 4 DIMMs Expansion Slots (per node) 1 x PCI-E x 8 LP Slot per Node * I/O ports (per node) 2 x Gb LAN (Intel 82580) 1 x Dedicated LAN for IPMI Remote Management 1 x VGA, 1 x COM port, 2 x USB 2. 0 (with KVM dongle) Drive Bays (per node) 2 x 3. 5” Hot-Swap SATA (6 G/s) , 1 x SATA DOM RAID Supported - RSTe 4. 0 Power Supply 1620 Watts Redundant 80 Plus Platinum Level Key features l l High-density, Enterprise Performance, Cost-effective, Multi-node UP server Up to 8 x hot-pluggable node in 3 U chassis IPMI 2. 0 with KVM over Dedicated LAN for each node Redundant 80 Plus Platinum Level Power Supplies SMC Confidential System Cooling 4 x 8 cm Heavy Duty Fans with Speed Control Applications l l l Cloud Computing/Provider Web/Collocation Services Web Cache, CDN, Video Streaming Social Networking, downloads Corporate – WINS, DNS, Print, Login Sample: Nov 2011
Next Generation Sandy Bridge Based Super. Blade® © Supermicro 2012
Sandy Bridge Super. Blade® Systems ENCLOSURES NEW BLADES Twin. Blade® SBE-720 D/E 14 Datacenter. Blade SBE-714 D/E 0. 35 U ® GPU Blade SBI-7127 RG Twin. Blade® SBI-7227 R-T 2 0. 5 U 10 -Blade SBE-710 E/Q 0. 7 U Storage Blade SBI-7127 R-S 6 Increased density boost best performance/sq ft NETWORKING MODULES 1 Gb. E 1/10 Gb. E MANAGEMENT Chassis Management Module Datacenter. Blade® SBI-7427 R-S 3/T 3 Infini. Band FDR/QDR 10 Gb. E POWER SUPPLY MODULES Web-based GUI IPMIView CLI 3000 W (200 -240 VAC) 2500 W (200 -240 VAC) 2000 W (200 -240 VAC) 1620 W (100 -240 VAC)
GPU Solution Confidential © Supermicro 2012
Technology Progression & Partnership The Possibility is Unlimited!!! The fastest 1 U server in the world Telsa S 1070 GPU Blades 1 U 4 -GPU Standalone box PCI-E x 16 New generation CPU & GPU supports The first optimized CPU/GPU integrated Hybrid System 2 U GPU / with QDR IB onboard 2 U Twin SC 827 HD-R 1400 B 6016 TT-TF 1 U Twin™ SW 7046 GT-TRF 2009 1 U 4 -GPU Integrated X 8 and X 9 Working with the right technology partner is the key! front view The most powerful PSC 2008 2 U 6 -GPU Integrated X 8 and X 9 2010 2011
X 9 GPU enabled line-ups GPU Servers Super. Server SYS-2027 GR-TRF-FM 407 SYS-2027 GR-TRF-FM 409 Super. Server SYS-1027 GR-TRF-FM 307 SYS-1027 GR-TRF-FM 309 GPU Workstations Super. Workstation SYS-7047 GR-TRF SYS-7047 GR-TPRF SYS-7047 GR-TRF-FC 409 SYS-7047 GR-TPRF-FM 407 SYS-7047 GR-TPRF-FM 409 GPU Blades Super. Server SYS-5017 GR-TF Super. Server SYS-1017 GR-TF Supermicro Confidential / NDA Required Super. Blade SBI-7127 RG + SBE-720 E * Pictures are reference only
X 9 GPU solutions Model Super. Server SYS-2027 GR-TRF Super. Server SYS-1027 GR-TRF Super. Server SYS-5017 GR-TF Super. Server SYS-1017 GR-TF Super. Server SYS-7047 GR-TRF CPU Sandy bridge DP Sandy bridge UP Sandy bridge DP Memory Up to 256 GB in 8 DIMM Up to 512 GB in 16 DIMM HDD 10 x 2. 5” 4 x 2. 5” 3 x 3. 5” 6 x 2. 5” (8 + 2) x 3. 5" Expansion slot 4 GPU 1 PCI-e 3. 0 x 4 1 PCI-e 3. 0 x 8 (LP) 3 GPU 1 PCI-e 3. 0 x 8 (LP) 2 GPU 4 GPU 1 PCI-e 3. 0 x 8 (LP) 2 PCI-e 3. 0 x 8 Power Supply 1800 W platinum redundant 1400 W platinum 1620 W platinum redundant * Pictures are reference only Supermicro Confidential / NDA Required
Introducing Supermicro’s Everest Product Line Bert Shen DP MB PM June 11, 2012 Confidential © Supermicro 2012
Supports the “Everest” E 5 -2698 CPUs l Supermicro’s Everest product line supports the E 52698 CPU § Intel’s codename for the highest-frequency bin Xeon CPU is also called “Everest” l Sandy Bridge Everest CPU specs § 4. 0 GHz, 4 cores, 135 W § Requires optimized cooling for CPU temperature (~30 deg C cooler than other CPUs) l Target customer is financial companies focused on low -latency computing (HFT)
Powered by X 9 DAX motherboard l Overclocking § Focused on overclocking highest-end CPUs (E 52643, 2687, 2698), but supports overclocking of all E 5 -2600 series § Overclocks CPUs up to 6% and Memory 24% § Board-level overclocking circuitry maximizes Sandy Bridge performance beyond most competitors’ capabilities § Allows frequency, voltage, memory latency margining
Additional X 9 DAX features l Reliable enterprise-class overclocking § Not a gaming or enthusiast board, like competitors’ overclocked solutions § Underwent extra phases of validation beyond normal product testing l Datacenter-optimized with HW RAID and 10 Gb. E options § Built for max performance using air-cooling § LSI 2208 and 10 G options for energy-efficient DCO product line
Winning business with Server Management Software MFU Overview NMView Overview Confidential © Supermicro 2012
Confidential Supermicro Mass Firmware Update Software l Remotely upgrade SMCI firmware components in large Linux deployments l BIOS, System parameters, BMC l Parallel Updates- Reduces down time during server upgrades l CLI interface allow easy integration into existing infrastructure l Secure connection between client and server Availability March 31 st for trial version April 30 thth for licensed copies
Remote Power Management Solution – Key Benefits l Monitor server power consumption during production workloads (helping measure and optimize PUE) Available Now for Trials v Maximize rack efficiency by enforcing power limit on racks according to data center power capacity v Lower operating rack temperature by limiting power during hot weather periods v Lower power costs by making better use of variable power pricing (e. g. during the night) http: //www. supermicro. com/NMView
Summary l Maintenance of Supermicro servers in large Linux cluster deployments becomes easy now with MFU software l NMView power management solution is available now to save OPEX on power consumption for our end users
Summary l Supermicro is growing fast to serve its customers l Supermicro has the broadest the most efficient Application Optimized system solutions l Supermicro Keep IT Green™
a8099567abf8b307d8cad428e735679f.ppt