Loadpoint MEMS Technology 1 Loadpoint Background v

Loadpoint MEMS Technology 1

Loadpoint Background v v v European SME, Involved in MEMS since 1976 – Pressure sensors, Medical Ultra-Sonics, ink jet printers, actuators. Direct process development service Consumable support 890 Dicing machines, 3, 600 Dicing spindles in operation world wide 40 years experience of electronics industry 2

Division of the MST Market by Sector 4% World Market for MST 2005: $68 billion 3% 7% 28% 58% Based on Nexus market analysis 3

Nanotechnology Sectors Nano Powders 13% Nano Processes 1% MEMS 14% Consulting 2% Nano Materials 11% Nano Biotechnology 19% Nano Instruments 18% Nano Devices 19% Nano Chemicals 3% 4

Amount (US$ mil. ) Global Funding of Nanotechnology * * Approximate figures based on Nano. Investor. News. com 5

Switzerland: Unsurprisingly, watches MEMS Japan: Optics Germany: Automotive and RF MEMS for ‘phones Canada, Benelux: Microfluidics for Medi-MEMS Countries developing innovative fields Italy and Spain: Food Quality + Biosensors Singapore: Biosensors and Optical. Networks Israel: Anti-terror devices Nordic Zone: Maritime 6

MEMS The role of SME’s v v Highest costs are in Test and Packaging Unavailability of machinery for flexible or small batch production leading to specialist service providers Small flexible SME’s providing appropriate technology 7

MEMS China v v China, 2002 200 Million Yuan approved for MEMS special project under five years plan 863 (high Tech and Development Research Programme Fundamental Research Programme 973 (since 1997): 134 projects, 2. 5 B Yuan, MOEMS project, Nano Materials Project and Nano Electronics projects included One of the few countries including agricultural research as part of nanotechnology. 13 th Institute of China Electronics Technology Group offering flexible 3/4 inch MEMS fabrication line with test and packaging equipment 8

MEMS Directions Ultrasonic transducers Medical v v v Italian and Japanese sensors applied to genomics and DNA/RNA Ultrasonic transducers for diagnosis and endoscopy Benelux and Japan: Intra-vascular blood sensor Canada and Benelux - blood lab on a chip with micro-needles for thumb blot. Canada: diagnosis integration of Microfluidics, MEMS and Optical devices Micro-needles Intravascular MEMS 9 Cardio. MEMS

MEMS Directions Automotive v Sensors becoming the key to the Safe-Car – Micro-accelerometers – Crash Sensors – Roll Sensors – Tyre pressure sensors – Vision Assistance etc. 10

Communications v v RF MEMS and Optical devices are the focus Australian development in relays Canada showing particular interest in RF and now X-ray MEMS Taiwan, biggest government investment of MST is in this area - US$ 200 Million Optical and Display v USA & Israel Micro-mirror arrays 11

Microfluidics v v Fuel injectors for automotive industry Blood sampling and other medical uses Microassembly v v Synchrotron Projects - for imaging at molecular level Australia spending $206 M, other projects in Canada and Germany Microfluidics will be important for this area, fine spraying seems to be the best emerging method of production for nano-materials 12

MEMS, demands One MEMS structure Needs to be be connected to and protected from the outside world Source Competence Centre for Microactuators and non-Silicon microsystems So the mirror structure material, cover and possible interconnect layer need to be diced 13

Applications, driving forces for convergence for MEMS dicing v v v v MEMS CSP WSP BGA, UBGA, FR 3 / FR 4 & copper sub-frame Silicon, Glass, Quartz, Ceramic substrates, LTCC and similar PZT integrated transducers & actuators Stainless steel, copper etc. Ga. As and SAWF materials and similar 14

MEMS Process Points 1 v v v MEMS, BGA, BGA or similar converge at WSP level Material thickness, hardness and poly-material layers Cutting energy dissipation and strength of material Sensitive surface topography and coatings. Process Temperature control Keeping cutting swarf out of mechanisms 15

MEMS Process Points 2 v v Some structures have special needs Dicing Lab on Chip has considerable demands Temporary seals for chemical / compound needed Protection of bonding pads Source: Competence Centre for Microactuators and non-Silicon microsystems 16

MEMS Outlines Packages have standard features and these outlines indicate some seen. Solutions exist for all of these although some development is usually needed to determine full process Combination with BGA coming 17

Wafer Scale Packaging v v v Practical Considerations Interconnect Bonding Moulded cover material Flatness of moulded package 18

Large Area MEMS Integration of BGA & BGA dicing techniques v v Specialist application with points to watch – Frame material – Flatness – Work holding – In line v stand alone Next generation of multi layer devices 19

MEMS Future Packages v Integration of other materials will mean that multi-layer devices could evolve from forms currently seen, for example: Fibre board with interconnect & external connection Signal processing layer Sensor layer Actuation layer 20

MEMS - the future v v v Integration of more materials into the structure, up to at least 6 layers Move to low profile wafer scale packaging with BGA concepts Issues – Grinding and surface finishing for layer bonding – Dicing a mixture of materials with diverse characteristics, design for dicing Accurate break down into process elements for process development Design for dicing! 21

Our Major Products v Nano. Ace Dicer/Grinder 300 mm diameter material v Pico. Ace Nanogrinder 300 mm diameter material v Micro. Ace Dicer 150 mm diameter material 22

Loadpoint Chelworth IE, Cricklade, Swindon, Wiltshire, SN 6 6 HE, UK Tel ++441 793 751160; email john. sweet@loadpoint. co. uk Web: www. loadpoint. co. uk The information outlined in this presentation is considered in the public domain so free of any IPR restrictions other than that protecting Loadpoint’s general IPR by copyright © and registered design ®. All ideas and concepts offered are in good faith and require confirmation by either sampling or through extended research and development programmes. Sources of pictures from the WWW have been acknowledged as far as practical, there is no intention of infringing the IPR of the owners of those images as their sole purpose is to illustrate the point made in the presentation 23