Internal Vacancies IFMY IFLP June 2010 Prepared

Internal Vacancies IFMY & IFLP, June 2010 Prepared by HR

Note : Complete Job Description can be obtained from the relevant HR Business Partners Internal Vacancies – MAL Position Process Engineer (Front of Line) Assistant Engineer (Process) Manufacturing Engineer Equipment Engineer 3/19/2018 Dept/ Segment AS ME GG/ Level Scope Requirement 9/10/11 Monitor performance, yields, quality and reliability of processes, materials, products, identify problems or unfavourable deviations. Provide solutions recommendation and execute solution. Identify opportunity for improvement and innovation in FOL processes. Available vacancies : 1) Flip Chip Process 2) General process quality Degree with minimum 2 -5 years of working experience in wire bond process/ assembly and interconnect technology of electronic devices. Experience in failure analysis and mechanism. Have knowledge in FMEA, DOE, risk assessment and statistical tools G 1/L 1 -L 2 Monitor performance, yields, quality and reliability of processes, materials, products, identify problems or unfavourable deviations. Provide solutions, recommendations and execute solution. Indentify opportunity for improvement and innovation in Flip Chip process both in terms of yield and quality. Diploma in Engineering or relevant field with at least 2 -5 years of related semiconductor experience in Assembly process. Well versed in process control. Experience in handling/operation of equipment. Manage ramp up and ratio lots. Drive improvement activities in FOL/EOL area. Support in solving chronic issues. Degree in Engineering with minimum 5 years related working experience in Semiconductor assembly area. Experienced in assembly processes and equipments. Well versed in process control. Support machine maintenance and upgrading. Participate and support project assigned. Contribute and participate in improvement programmes. Support new machine purchases & spare parts stock availability. Plan training schedules and contents to maintenance personnel. Degree in Engineering with minimum 2 years related experience in semiconductor assembly or equipment maintenance experience. Possess project management skills. Proficient in FMEA, risk assessments and statistical tools. 9/10/ 11 For internal use only Copyright © Infineon Technologies 2008. All rights reserved. Page 2

Note : Complete Job Description can be obtained from the relevant HR Business Partners Internal Vacancies – MAL Dept/ Segment Position Project Leader/ Manager (Idea to Product) AS PD Development Engineer (Pre. Assembly – Backgrinding, Bare Die & Wafer Sawing) AS PD GG/ Level Scope Requirement Package Development for package definition (PAD) and package development (PDO) for Leadframe & Laminate Packages from concept to design to implementation to volume production. Design and define package solution together with the relevant parties/sections. Overall packaging project management and ensure fulfillment of project targets (time, quality, cost) to achieve business success together with business divisions. Interface with business divisions and factory (internal & subcon) in all aspects of the projects. Degree/Masters in related Engineering field with 3 -5 years in semiconductor industry in the field of package development or assembly engineering (preferably in leadframe & laminate packages). Possess good knowledge in FMEA, risk analysis /assessments, statistical tools and problem solving methodology. Proficient in Ms Project to set up project plan and track progress. 10/11/ 12 To provide solution on a new package/process development for Package Development projects. Process owner to provide technical solution for new package/process development on individual area and maintaining the stability on pre-assembly processes (both backgrinding-wafer thinning, bare die process and wafer sawing). Degree in relevant engineering field with minimum 5 years related experience in package development/process development in a semiconductor environment. Experienced in FA & surface activation mechanism/techniques, systematic process development, effective in setting up DOE. Possess good project management skills, FMEA and risk assessments. Those with experience in FE wafer technology is of added advantage. 9/10 Consolidate weekly production plan and optimise schedule of daily start plan for smooth execute of production deliveries. Commit and coordinate urgent (ad-hoc) requests and deliveries to meet customers deadlines. Drive and coordinate fulfillment of overall KPIs (Delivery, Clip, Range, Fast Track) with various departments. Provide guidance and support to operative personnel on logistics and planning functions. Manage and enhance key operative systems and tools. Degree in Business Administration/Economics /Science or equivalent. Minimum 1 year of related experience preferably in a semiconductor environment. A team player who can work under pressure and able to meet tight deadlines. Willing to take on assignments and other new challenges above basic function of a planner. Result oriented, critical and analytical. Proficient in Ms. Office applications. 10/11 Line Planner AS SP 3/19/2018 For internal use only Copyright © Infineon Technologies 2008. All rights reserved. Page 3

Note : Complete Job Description can be obtained from the relevant HR Business Partners Internal Vacancies – MAL Position Dept/ Segment GG/ Level Scope Requirement Degree in relevant field with minimum 5 years of related experience in semiconductor failure analysis and reliability. Understand FA methodology mechanism & preparation. Candidates with the following experience is preferred: 1. Experience in performing grinding/ polishing techniques in cross-sectioning device package. 2. Possess knowledge on various type of semiconductor failure mechanisms, ie. Intermetallic failure and delaminations. 3. Familiar with operating relability test equipments eg. Soaking chamber 4. Strong experience in the use of analytical tools, eg. EDX/SEM/x-ray/SIMS, etc. Failure Analysis & Reliability Engineering Engineer AS PD 10/11 Support IC Failure analysis, reliability, product engineering, QA, Customer/supplier interface and critical problem management, project management & supplier management. Production Technician (Setup activities) AS SO G 2/ L 3 - L 5 Carry out DA / WB machine setup and maintenance. Certificate / Diploma in relevant field preferably with 1 -2 years of relevant experience. G 2/ L 2 -L 4 Position 1 : Back grind, Pre-Assy & Flip Chip Position 2 : Trim & Form, Ball attach and substrate singulation. Position 3 : Molding Position 4 : Die Bond & Wire Bond Diploma in relevant field with at least 3 -5 years of related working experience. Support Engineering sample manufacturing activities. Effective and efficient sample assembly according to customer requirement. Assembly run according to sample order requirements. Timely sample order processing and control by providing regular status update. Diploma in relevant field with minimum 2 years related semiconductor assembly experience. Experience in assembly processes and equipment. Well verse in machine set up skill. Able to set up machines for sample manufacturing in the identified area of responsibility. Good team-working shown within internal team members and production floor personnel. Able to understand interpret technical specifications and documentation. Line Technician (multiple positions) Production Technician (ES) 3/19/2018 AS SO AS ME G 2 For internal use only Copyright © Infineon Technologies 2008. All rights reserved. Page 4

Note : Complete Job Description can be obtained from the relevant HR Business Partners Internal Vacancies – MAL Dept/ Segment GG Scope Requirement Package Development Engineers DS 10/11 Lead equipment purchase, material selection, process development activities to meet project schedule. Degree with at least 3 years experience in FOL/ EOL process engineering/ development. Maintenance Engineer DS 10/11 Manage tooling activities, maintenance upgrade modification, new equipment set up. Degree with 3 years experience in semiconductor equipment maintenance. DS 9/10 Monitor performance, quality and reliability of testing process. Identify problems or unfavourable deviations. Design and recommend and execute corrective actions. Support new test/ product introduction. Degree in engineering with 3 years test process experience. SENS 10/11 Enhance and develop new process control excellent. Define control parameter and control limits. Drive improvement activities in FOL/EOL area. Support in solving chronic issues. Degree in mechanical / electronic engineering with 3 years working experience in semiconductor. Position Test Process Engineers Manufacturing Engineer To drive “Productivity Improvement”, e. g. HC efficiency, RPT improvement, OEE, Mat-Con efficiency. Planning Engineer SENS 11 Lean Manufacturing by driving for process optimisation Degree in engineering with 5 years relevant experience in semiconductor. d 2 p support for all projects/products. Controlling & Monitoring of KPI’s actual vs plan. Assistant System –system support 3/19/2018 SENS For internal use only G 1 PC coordination for production, maintain in server, window migration & to maintain BI-portal. Copyright © Infineon Technologies 2008. All rights reserved. Diploma in IT with 2 years relevant experience Page 5

Internal Vacancies – MAL Position Total Productivity Manager System Engineer Dept GG/ Level PO PO 12 Scope Drive & lead TPM projects across PO production to enhance productivity and profitability. Drive & co-ordinate D 2 P projects & TCR cost down activities. Drive quality focus projects to enhance shop floor quality Enhance total productivity by means of installing appropriate management tools & systems 10/11 Perform daily support on Planning and Production system related tasks and activities Manage and improve WIP ( Work In Progress ) system. Analyze user requirement, coordinating IT related request ( including reporting ) and work closely with IT department for solution delivery Requirement Degree in with minimum 8 years working experience in semiconductor industry, esp. in Industrial Engineering. Degree in IT-related discipline or equivalent. Possess know-how in manufacturing systems and process Industrial Engineer PO 10/11 Optimized planning of resources inclusive of production capacity, capital investment, manpower requirement, and asset management to ensure competitive cost. Manage capacity & resources (manpower, investment, area etc) ramp up and transfer activities in accordance with production strategy. Dev. Engineer (Material) PO 10/11 Responsible for development of metallurgical materials such as soft solder, wires, leads plating, & etc. Lead crossfunctional teams in the qualification and release of materials Degree in with minimum 3 years working experience in semiconductor industry. Familiar with phase diagram and ability to interpret it. 10/11 Source, characterize, develop and implement new interconnect technologies in Wire Bond processes. Working in global teams / environment to deliver committed project targets. Degree in with minimum 3 years working experience in semiconductor industry. Must possess detailed knowledge in wire bond processes and hand-on experience in thermo sonic Au or Cu wire bond process. 10/11 Re-engineer and optimize existing simulation tests to meet new industrial/legislation requirement. Trouble-shoot and solve technical and manufacturing issue by simulation. Perform in depth simulation analysis. Degree in with minimum 3 years working experience in semiconductor industry. Practicing fact-base techniques in problem solving. Experience in material/process/analytical characterization. Development Engineer (Wire Bond) Development Engineer (Simulation) PO PO For internal use only Copyright © Infineon Technologies 2008. All rights reserved. Degree in with minimum 2 years working experience in esp. in Industrial Engineering Page 6

Note : Complete Job Description can be obtained from the relevant HR Business Partners Internal Vacancies – MAL Position Assistant Store Keeper Shipping Executive Logistics Engineer/ Executive TQM Executive Dept LOG LOG TQM GG/ Level Scope Requirement G 3/ L 4 -L 6 Support in managing customer sample units for shipments using SAP & ASSIST 4. Receive and verify incoming shipment before booking stock using SAP. Process the sample order base on FIFO. Ensure correct type and correct quantity is picked and packed for delivery for customer. Ensure the cycle time of the order is maintained. SPM or any relevant certificate. Possess knowledge in logistics activities/processes. Must have basic knowledge of Ms. Office. Candidates who possess valid forklift driving license will have an added advantage. 9/10 Support shipping functions (both inbound and outbound shipment processes). Daily administration & control of import and export activities. Monitor and manage transit cycle time. Plan, monitor and ensure on time deliveries of shipments. Assist in forwarder management and insurance claims. Support improvement projects with forwarders and transporters. Assist Customs Officer (CO) to ensure compliance to Customs requirements. Degree in relevant field with minimum 3 years working experience in logistics/shipping/ customs documentation & regulation. Posses good project management skills & knowledgeable in air freight operations. Possess good communication skills and ability to interact with all levels of employees. 10 Support planning, organising, directing & controlling the operations of the Spare Parts Centre. Responsible for the effective & efficient Management of the Spare Parts Centre. Support the full cycle of inventory maintenance/management. Responsible for maintenance for Automated Warehouse System & Equipment. Ensure the Spare Parts Centre's security and safety is maintained at all times. Assist in sourcing items as required by the guideline set down by the company/ department. Conduct exercise of non-moving items. Co-ordinate activities of supervisors, clerks & technicians. Degree in Related Engineering field (Mechanical/Electronics/Electrical). Those with non-Engineering degree but possess relevant working experience may be considered. Minimum 2 years of related experience in Spare Parts & Warehouse Management. Possess knowledge/working experience in SAP and warehouse management system. 10/11 Promote, co-ordinate and facilitate the philosophy and practices of TQM, both internally and externally. Support management activities (Business Excellence Culture) such as Annual Management Self-Assessment and Management workshops. Support people management activities. Support in managing awards and competition such as SGA projects. Support external communications with external bodies/ government agencies and other related activities pertaining to branding and networking. Drive the YIP programme to achieving the targets set. Support plantwide activities in organising events and other projects assigned by superior. Degree in relevant field with at least 5 years or working experience in TQM environment. Those with technical experience will be of added advantage. Possess good interpersonal skills, good conceptual thinking and good communication skills. Well versed with award assessment criterias. Possess good organising and co-ordination skills with event management capabilities. For internal use only Copyright © Infineon Technologies 2008. All rights reserved. Page 7

Note : Complete Job Description can be obtained from the relevant HR Business Partners Internal Vacancies – MAL Position Dept ER Executive HR GG/ Level 9 Systems Engineer (Desktop & office automation) IT 11 System Engineer/ Asst. Eng. – End User Support IT 9 /G 1 Scope Requirement Responsible for administration of Employee Relations and employee support. Prepare monthly report on ER issues, eg. Transportation, canteen. Maintain and implement ER policies & employee handbook. Responsible for managing ER services such as canteen, company transport and other relevant tasks assigned by superior. Manage DOA related projects including Fab and Equipment PC. Lead local client services and demand management team and be responsible for deployment, troubleshooting and supporting of computer clients - desktop and notebooks. First level support for hardware, network, operating systems and software application. Degree in Human Resources/Business Administration or other relevant academic qualification. Good knowledge of state and federal labour laws and regulation. Minimum 1 year of related experience in ER. Good communication skills in English and Bahasa Malaysia & good interpersonal skills. Proficient in Microsoft office packages. Those with solid experience in ER & HR Services is highly preferred. Degree in IT. Working experience with 4 to 5 years proven successful proficiency in Windows environment. Ability to install and troubleshoot Windows 7 client at Operating System level. Degree /Diploma in IT. graduate. Fresh Contact Person/s HR BPs E-Mail Contact Number Arulkumar. Singaraveloo@infineon. com 06 -2325266, Ext 8404 Wan Norrazah. Wan@infineon. com 06 -2325266, Ext 8402 For internal use only Copyright © Infineon Technologies 2008. All rights reserved. Page 8

Jointly organised by: INDUSTRIAL SKILLS ENHANCEMENT PROGRAM (INSEP) Infineon Melaka is working together with Selangor Human Resource Development Centre (SHRDC) to offer Competency Development Program for the following areas/programs: 1. Chip Testing Technologies (Semiconductor chip testing) 2. Advanced Packaging Technologies (Semiconductor chip packaging) The selected participants will initially undergo an intensive classroom technical training on the selected program. During this stage; the participants shall be equipped for the on-job industrial training. Upon successful completion of the classroom technical training; the participants shall be placed in Infineon Melaka for On-The-Job Training as to further enhanced their capabilities and competencies. Requirements ■ Malaysian Candidates only, below 28 years of age. ■ Fresh graduates/Entry level applicants with Degree in Mechatronics / Electronic & Electrical/ Mechanical / Material Engineering / Applied Physics from a recognized university. ■ CGPA : 3. 0 and above. ■ Unemployed at the time of application. ■ Good interpersonal skills, written and verbal communication skills and a good team player. Benefits ■ Employment with Infineon Melaka. ■ Ready-to-work in the industry. ■ Competitively paid while training. ■ Industry recognized competencies. To apply, please log on to ■ REAL LIFE WORK projects and thus it will contribute greatly to your work experiences. www. infineon. com/careers/malacca ■ And many more benefits. Closing date : 11 th June 2010 Only shortlisted candidate will be notified. Apply now! For internal use only Copyright © Infineon Technologies 2008. All rights reserved. Page 9