Industry Terminology 业术语 IPC Market Research
EMS (Electronics Manufacturing Services) EMS--电子制造服务 Provides assembly services for which you do not own the intellectual property 提供组装服务， 但不拥有自主知识产权的公司、企业 IPC Market Research
Original Design Manufacturer (ODM) ODM--原始设计制造商 Provides assembly and system builds services for which the company owns the intellectual property. 提供组装和系统构建服务， 且拥有自主知识产权的公司、企业 IPC Market Research
Vertical EMS Company An EMS company which owns their supply chain – PCB manufacturing. Sanmina-SCI 纵向EMS公司-- 拥有自己供应链的EMS公司 如PCB制造。Sanmina-SCI Virtual EMS Company An EMS company which outsources material. Jabil EMS公司 -- 其材料均外购的EMS公司。Jabil IPC Market Research
EMS Size Based on Sales Dollar 按销售额EMS公司分为： • Large (Tier I) ---- 大型（1级） ØGreater than $3 billion---- 大于30亿美元 Mid (Tier II) ---- 中型（2级） Ø$400 million to $3 billion ---- 4亿--30亿美元 Small (Tier III) ---- 小型（3级） Ø$100 million to $400 million---- 1亿--4亿美元 Micro (Tier IV) ---- 微型（4级） ØBelow $100 million ---- 小于1亿美元 • • • IPC Market Research
EMS Stock Highlights Q 3 2006年第 3季度EMS股市指数 • Large Index has increased +6. 7% from last quarter 大型公司指数比上一季度升高了+6. 7% • Mid Index has decreased (19. 4%) from last quarter 中型公司指数比上一季度降低了(19. 4%) • Small Index has decreased (4. 2%) from last quarter 小型公司指数比上一季度降低了(4. 2%) • Micro Index has increased +33. 7% from last quarter 微型公司指数比上一季度升高了+33. 7% IPC Market Research
Global EMS Market Status 全球EMS市场状况 IPC Market Research
2005年全球各区域EMS/ODM市场份额及2010年预测 IPC Market Research
北美及全球EMS/ODM 市场增长预测 IPC Market Research
＊Revenue by Country—-国家税收 ＊CAGR----年均复合增长率 IPC Market Research
全球EMS/ODM 市场预测 * EMS – Served available market EMS—部分现有市场 * OEM – Available total market OEM—全部现有市场 IPC Market Research
Status of EMS Market in North America 北美EMS市场状况 IPC Market Research
北美EMS/ODM 全部现有市场潜力 IPC Market Research
北美组装市场历史、预测及发展走势 IPC Market Research
北美EMS企业数量（估计） IPC Market Research
人均销售额历史数据（来源：IPC统计项目部） IPC Market Research
北美所有参与公司收入来源走势 IPC Market Research
2005 收入百分比（北美所有参与公司） IPC Market Research
北美所有参与公司所服务 业市场走势（2004 -2006） IPC Market Research
2005 面向主要 业市场的公司销售百分比 IPC Market Research
2005 客户合作期 ---- 北美所有参与公司 IPC Market Research
2005 及2006年订单规模占所有定单总值百分比 IPC Market Research
2004 及2005年订单规模占所有定单总值百分比 IPC Market Research
北美所有参与公司资产设备占总销售额的百分比 IPC Market Research
2004 -2005北美所有参与公司安装在电路板上的元件类型及百分比 IPC Market Research
Status of EMS Market in China 中国EMS市场状况 IPC Market Research
2005亚洲所有参与公司收入百分比 IPC Market Research
亚洲所有参与公司所服务 业市场走势（2004 -2006） IPC Market Research
2005公司销售占主要 业市场的百分比 （亚洲所有参与公司） IPC Market Research
2005 客户合作期 -- 亚洲所有参与公司 IPC Market Research
2004 -2005亚洲所有参与公司安装在电路板上的元件类型及百分比 IPC Market Research
Global Lead Free Implementation 无铅在全球的实施 IPC Market Research
OEM—无铅实施准备状况 全部实现 无铅组装 尚未 准备 选择了焊 料，但未 用于生产 选择了焊 料和涂层 IPC Market Research 完成了无铅 样品生产
EMS--无铅实施准备状况 全部实现 无铅组装 尚未 准备 选择了焊 料，但未 用于生产 选择了焊 料和涂层 IPC Market Research 完成了无铅 样品生产
OEM—无铅实施中的最大成本 IPC Market Research
EMS—无铅实施中的最大成本 IPC Market Research
OEM — 无铅实施中的主要障碍 IPC Market Research
EMS — 无铅实施中的主要障碍 IPC Market Research
OEM—无铅与锡铅之比 IPC Market Research
EMS—无铅与锡铅之比 IPC Market Research
Threats to EMS companies EMS企业面临的挑战 Lead Free 无铅 IPC Market Research
It is estimated that lead free will increase assembly cost by at least 10% 据估计无铅将使组装成本至少增加 10% IPC Market Research
Threats to EMS companies EMS企业面临的挑战 Lead Free Technology 无铅技术 IPC Market Research
Solectron Recommendation for Lead Free Solectron公司关于无铅的建议 • Solder paste • • 焊膏 Wave solder – Sn 3 Ag 0. 5 Cu 波峰焊用焊料 Hand solder 手 焊用焊料 • – Sn 3 Ag 0. 5 Cu BGA rework BGA返 – 96. 5 Sn 3. 5 Ag rework wire – 95. 5 Sn 3 Ag 0. 5 Cu solder paste or paste flux. 焊膏或膏状助焊剂 IPC Market Research
Solectron Recommendation for Lead Free Solectron公司关于无铅的建议 Today’s situation 目前状况 1. Tin-lead solder paste with tin-lead components: Generally O. K. 锡铅焊膏与锡铅元件：通常不会发生问题 2. Tin-lead solder paste with lead-free components: 锡铅焊膏与无铅元件： § Danger with assembly of lead-free CSP/ BGAs: Insufficient collapse/realignment/ opens due to low temperature tin-lead assembly profile 组装无铅CSP/BGA时会有危险----由于锡铅组装曲线温度 较低，会导致坍塌不充分/自对准/开路 IPC Market Research
Solectron Recommendation for Lead Free Solectron公司关于无铅的建议 Tomorrow’s situation 未来状况 3. Lead-free solder paste with tin-lead components: 无铅焊膏与锡铅元件： § § 4. Danger with tin-lead CSP/BGAs: Voiding/ bridging (CSP/BGA sphere reflows before solder paste) 对锡铅元件比较危险：空洞/桥接 Are tin-lead and lead-free components and boards rated to higher lead-free soldering temperatures 锡铅元件同无铅元件及板子一样要经受较高的无铅焊接温度 Lead-free solder paste with lead-free components. 无铅焊膏与无铅元件： § Are lead-free components and boards rated to higher lead-free soldering temperatures 无铅元件及板子要经受较高的无铅焊接温度 IPC Market Research
Solectron Recommendation for Lead Free Solectron公司关于无铅的建议 Designated production areas for lead-free wave and rework 指定无铅波峰焊和返 生产区域 • • Dedicated lead-free wave solder machine 指定无铅波峰焊设备 § Logistics to separate lead-free Sn. Ag. Cu and Sn. Pb solder bar (including triangular shaped bar for lead-free) 在物流方面要分开放置无铅SAC和锡铅焊料棒 Rework solders must be compatible with the manufactured solder – need separate designated lead-free rework area in production and methods to deal with field returns. 返 焊料必须与制造所用焊料兼容 — 必须区分生产中所指定的无 铅返 区域和处理现场返回的方法 IPC Market Research
Solectron Recommendation for Lead Free Solectron公司关于无铅的建议 Designated production areas for lead-free wave and rework 指定无铅波峰焊和返 生产区域 • Lead-free component and board labeling will be needed to differentiate between Sn. Pb and lead-free assemblies for assembly, repair and rework (Refer to JEDEC standard, JESD 97: Marking, Symbols and Labeling for lead-free assemblies, components and devices and IPC 1066 standard for lead-free labeling) 为了便于组装、返修和返 ，在锡铅与无铅组件之间必须区分无铅元件 和板子标签（可参考JEDEC标准-JESD 97和IPC标准IPC-1066 ） • Planning of production line is essential for lead-free assembly. 规划无铅组装生产线是无铅组装必需的。 IPC Market Research
Solectron Recommendation for Lead Free-- Site Transition Solectron公司关于无铅的建议—现场转换 1. Site must run qualification test vehicle 现场必须进行资格测试 1. a. SMT 2. Process (Training/ Support) 艺（培训/支持） 3. Equipment 设备 4. b. Wave b. 波峰焊 5. Process (Training/ Support) 艺（培训/支持） 6. Equipment 设备 2. Product Review 产品审核 1. Complexity of Product and End-Of-Life of Product (2006) 产品复杂性和产品的（2006） 2. SMT (Quantity and Type) SMT（数量和类型） 3. Wave (Quantity and Type) 波峰焊（数量和类型） 4. PCB (Material and Surface Finish) PCB（材料和表面涂层） 5. Components (Material and Surface Finish) 元件（材料和表面涂层） IPC Market Research
Solectron Recommendation for Lead Free-- Site Transition Solectron公司关于无铅的建议—现场转换 3. BOM Component Scrubbing (Temperature rating, lead-free specifications) BOM元件整理（温度等级、无铅技术规范） Global Materials Component Engineering Support (Supplier Development Engineering), 全球材料元件 程支持（供应商开发 程） 2. Consigned/ Turnkey 委托/总承包 4. Prototype Builds (Manufacturing and reliability trials) 原型构建（制造和可靠性试验） 5. Pilot Builds (Manufacturing and reliability trials) 试生产（制造和可靠性试验） 6. Production 批量生产 1. IPC Market Research
Solectron Recommendation for Lead Free-- Production Settings Solectron公司关于无铅的建议—生产设置 • • All Builds on Production Lines using Standard Assembly and Inspection Equipment 采用标准组装和检测设备构建生产线 Approximately 2000 Sn. Ag. Cu and 200 Sn. Pb boards built evaluating PCB supplier, solder paste lot and production line 生产约 2000块SAC板和200块Sn/Pb板，评价PCB供应商、焊膏批 次、 和生产线 Printing: No issues (Solder Paste Height within specification for tin-lead and lead-free solder paste) 印刷：无问题（焊膏高度在锡铅及无铅焊膏技术规范范围内） Placement: No issues 贴装：无问题 IPC Market Research
Solectron Recommendation for Lead Free-- Production Settings Solectron公司关于无铅的建议—生产设置 • • • Reflow: No issues (higher temperature profile needed for leadfree Sn. Ag. Cu paste). Used nitrogen reflow atmosphere (< 100 ppm O 2) in 10 zone convection oven 再流焊：无问题（无铅SAC焊膏需要较高温度的曲线）。在 10温区 的再流焊炉中使用氮气再流气氛 （O 2< 100 ppm ） Rework: No issues (higher temperature profile needed for leadfree Sn. Ag. Cu BGA rework) 返 ：无问题（无铅SAC BGA返 需要较高温度的曲线） Visual Inspection: Joint Appearance Related to IPC-610 and Customer Workmanship Standard Acceptance Criteria 目检：焊点外观应符合IPC-610和客户质量标准验收准则 IPC Market Research
Solectron Recommendation for Lead Free - Summary of Assembly and Reliability Results Solectron公司关于无铅的建议—组装概况及可靠性结果 • The solder joint quality is within acceptable limits based on IPC 610 and customer product visual inspection standard 焊点在IPC-610和客户产品目检标准的可接收范围之内 • Reliability testing (Temperature and Humidity, Temperature and Voltage, ATC, Unpackaged shock, Unpackaged vibration) indicated the lead-free Sn. Ag. Cu assembled and reworked boards were as reliable as tin-lead 可靠性测试（温度及湿度、温度及电压、ATC、无包装冲击、无包装振动 ） 显示用无铅SAC组装和返 的板子与用锡铅组装及返 的板子一样可靠 IPC Market Research
Lead Free Technology - Voiding 无铅技术—空洞 IPC Market Research
Lead Free Technology - Voiding 无铅技术—空洞 IPC Market Research
Lead Free Technology - Voiding 无铅技术—空洞 Reliability Research from the IPC Solder Products Value Council IPC焊料产品评估委员会的可靠性研究结果 Based on the number and comparison of solder joint voids to thermal cycle interconnection failure data, there is no evidence that soldering joint voiding has any significant impact on solder joint reliability 根据热周期互连失效数据中的焊点空洞数量及其对比， 没有证据表明焊接点空洞对焊点可靠性有显著影响 IPC Market Research
Lead Free Technology –Tin Whiskers 无铅技术— 锡晶须 • Many component manufacturers are changing from tin-lead (90 Sn 10 Pb) to pure tin (100%Sn) and high-tin (>95%Sn) lead-free alloy solderable leadframe/ termination coatings 很多元件制造商将锡铅（90 Sn/10 Pb）引线框架/端子可焊涂层改为了纯 锡（100%Sn）涂层和高含量锡（Sn含量>95%）涂层 • Pure tin and high-tin lead-free coated components raise concerns about tin whiskers 纯锡涂层和高含量锡无铅涂层元件会产生锡晶须问题 • Standardized accelerated tin whisker test method and whisker length acceptance criteria is needed 急需标准化的加速锡晶须测试方法和晶须长验收准则 IPC Market Research
Lead Free – Inspection 无铅 – 检验 Sn. Pb joint: 锡铅焊点 semi –smooth and shiny 光滑发亮 SAC joint: SAC 焊点 Grainy and shiny IPC Market Research 灰暗
Addressing Lead Free Component Issues by Solectron正在解决无铅元件问题 IPC Market Research
Solectron Recommendation for Lead Free - Components • • Solectron公司关于无铅的建议—元件 Tier 1 manufacturers have the infrastructure (resources, capital, etc. . ) to support Ro. HS transition 1级制造商具备了支持Ro. HS转换的基础结构（资源、资金等） Part numbers are changing for Ro. HS compliance depending on commodity and manufacturer 为符合Ro. HS, 正在改变部件号, 但取决于具体部件和制造商 No standard method of identification (marking/labeling) of Ro. HS compliant components 尚无识别符合Ro. HS元件的标准方法（标识/标签） No standard method of reporting Ro. HS environmental data (IPC-1752 materials declaration standard now released) 尚无报告Ro. HS环境数据的标准方法 (IPC已发布IPC-1752 材料声明标准) IPC Market Research
Solectron Recommendation for Lead Free - Components Solectron公司关于无铅的建议—元件 IPC Market Research
Solectron Recommendation for Lead Free - Components Solectron公司关于无铅的建议—元件 Solectron has created new site part numbers for all Ro. HS compliant assemblies and all of their BOM components, regardless of the actions of component manufacturers or customers. Solectron已经对所有符合Ro. HS的组件及所有 其BOM上的元件建立了新的现场部件号，无论 元件制造商或客户是否针对Ro. HS采取了行动。 IPC Market Research
Solectron Recommendation for Lead Free Solectron公司关于无铅的建议 • • Clear physical and financial separation of the supply chain (i. e. Inventory, Demand, Supply) 从物流上和财政上明确区分供应链(如库存、要求、供应) Fully utilize MRP (Material Requirement Planning) System 全面采用MRP（材料需求计划）系统 • Will be able to use effective dates to phase in/ phase out part numbers 能够利用有效日期使用或淘汰部件号 • Clean BOMs (Bill of Materials), AMLs (Approved Materials Lists) and Orders 整理BOM（材料清单）、AML（经认可的材料表）及定单 • Lowest risk of mixing inventory in warehouses 使仓库中物料混存风险最低化 • Easier to capture and recover E & O (Excess and Obsolete) created by the switchover 简化由于转换而产生的E&O(过剩和废弃)元件的收集和回收 IPC Market Research
Solectron Recommendation for Lead Free - Customers Requirements Solectron公司关于无铅的建议— 客户要求 • Do you have a clear Ro. HS roadmap? • What are your plans to migrate to ROHS 6/6 compliance? • • 你是否有清晰的Ro. HS路径图 你计划如何转向符合ROHS 6/6？ The Original Equipment Manufacturer (OEM) is responsible for Certificate of Compliance and process data to manufacture product and for liability coverage. 原始设备制造商要对制造产品所需的符合和 艺数据的证明及可靠性负责 Approved components (MPNs) on Approved Manufacturers List (AML). 经认可的材料表（AML ）内的认可元件 Existing inventory. 现有的库存 Existing inventory at EMS manufacturers. EMS制造商的现有库存 IPC Market Research
Solectron Recommendation for Lead Free - Customers Requirements Solectron公司关于无铅的建议— 客户要求 • Clear separation of compliant and non-compliant inventory 符合及不符合的库存分离 • Preferred method: change part numbers to distinguish Ro. HS-compliant components, assemblies and product 最好的方法：为了区别符合Ro. HS的元件、组件 和产品，改变部件号 • Need formal manufacturing communication process (such as an ECO/MCO) to request process and part changes rather than sending alert notices 需要正式的制造传达过程（如ECO/MCO）去申请 艺和部件改变，而 不是只送警示通知而已。 IPC Market Research
Solectron Recommendation for Lead Free - Customers Requirements Solectron公司关于无铅的建议— 客户要求 Overall Ro. HS Compliance is the Responsibility of the OEM 整个产品符合Ro. HS是OEM的责任 • Product compliance: OEM 产品符合：OEM • Process materials: EMS Provider (e. g. Solectron) 艺材料：EMS企业（如Solectron ） • Component compliance: Component Manufacturers 元件符合：元件制造商 IPC Market Research
Solectron Recommendation for Lead Free - Customers Requirements Solectron公司关于无铅的建议— 客户要求 Plan to Minimize Excess and Obsolete Component Issue 过剩和废弃元件问题最小化计划 • Change part numbers for Ro. HS compliant components 改变符合Ro. HS 元件的部件号 • Change part numbers for Ro. HS compliant product 改变符合Ro. HS 产品的部件号 • Change part numbers to distinguish between non-compliant and compliant components and product 改变部件号以区别不符合与符合元件及产品 IPC Market Research
Lead Free Component Issues 无铅元件问题 Another/Similar Approach by a Major EMS Company in Asia 亚洲一家著名EMS公司采用了 另一种/类似方法 IPC Market Research
Lead Free Component Issue 无铅元件问题 First Choice for Component Manufacturers 首先选择元件制造商 Component Suppliers will include a suffix that denotes it is a lead free part and conforms to ROHS 元件供应商应在部件号后加后缀 表明该部件是无铅部件，符合ROHS IPC Market Research
Lead Free Component Issue 无铅元件问题 Second Choice for Component Manufacturers 其次选择元件制造商 If the EMS company receives a component without a lead free suffix the component manufacturer needs to provide a certificate of compliancy 如果EMS公司收到了没有无铅后缀的元件， 元件制造商必须提供符合证明 IPC Market Research
Threats to China EMS Companies 中国EMS企业所面临的威胁 Geographic Regions 地理区域 IPC Market Research
Geographic Regions - India 地理区域– 印度 • • Strategically located as hub for services throughout Asia 从战略上讲，其位于整个亚洲的服务中心 Currently - best positioned as source for India-destined product 目前，是销往印度产品的最佳地点 Growing economic and consumer base 正成长为经济和消费基地 Limited infrastructure capabilities 有限的基础设施能力 Lack of centralized government combined with high amount of red tape 缺乏有力的政府及相应的政策支持 Some major EMS companies currently in India 一些著名的EMS公司均在印度设有 厂 Technology OEMs polled rank India highest among locations best suited for outsourcing electronics design* 技术型OEM公司对最适合于外购电子设计的地点进行投票，印度得分 最高 IPC Market Research
Geographic Regions – Mexico • • • 地理区域– 墨西哥 Close to the United States, same time zone 接近美国，时区相同 Shift from low-mix, high-volume to high-mix low volume capabilities 正从少品种、大批量转向多品种、小批量 Companies are realizing the importance of applying lean principles 公司正认识到政策倾斜的重要性 Good location for companies with high transportation costs or quick turnaround requirements 对于运输成本较高或要求快速响应的公司是不错的地点 Shortages of skilled management and specialized, technical employees exist 缺乏有经验的管理人员和专门的技术人员 Technology OEMs polled recognize Mexico as a better destination source for outsourcing electronics manufacturing than design* 技术型OEM公司投票认为墨西哥更适于作为外购电子制造的地点 IPC Market Research
Geographic Regions – Russia 地理区域– 俄罗斯 • • • Driven by market liberalization & European integration 市场自由化及欧洲一体化 Low trade barrier & low wages 较小的贸易障碍且 资较低 Infrastructure requires upgrades 基础设施需要升级 Supply chain not as developed as in China 供应链的开发不如中国 Technology OEMs polled rank Russia relatively low among countries best suited for outsourcing electronics design and manufacturing* 技术型OEM公司对最适合于外购电子设计和制造的地点进行投票，俄罗 斯得分较低 Corruption 贪污腐败 IPC Market Research
Geographic Regions – Thailand • • 地理区域 – 泰国 Quality workforce, low attrition 劳动力素质高、低耗损 Country recognizes the importance of electronics manufacturing as a doorway to prosperity 国家认识到电子制造是走向繁荣重要性路径之一 Active government involvement to protect the EMS industry 政府积极干预保护EMS行业 EMS providers polled rank Thailand as the second best location for cost-effective outsourcing manufacturing* EMS供应商投票认为泰国是外购制造的第二最佳地点 Extra incentives in place to promote R&D projects 额外的激励以推进R&D项目 Difficult foreigners to own local firms 外国人难以拥有当地公司 Seems to be a lack of cooperation among the various state agencies 各种国家机构似乎缺乏合作 IPC Market Research
Geographic Regions – Vietnam 地理区域 – 越南 • • • Late-comer to the global EMS stage 全球EMS舞台的后来者 National IT strategy different from that of Singapore and South Korea in the 60 s and 70 s 国家IT策略与60、70年代新加坡和韩国有所不同 Vietnam’s industry set up its industry through different sourcing arrangements based on varying stages of production 根据生产的各个阶段，通过不同的资源配置安排建立自己的 业体系 Good location for systems integrators and computer re-sellers 系统集成商和计算机销售的良好地点 Lack of same-level assembly technology for SMT, circuit assembly vs. other low-cost regions. 与其他低成本区域相比，缺乏相同水平的SMT、电路组装用组装技术 IPC Market Research
Threats to China EMS Companies 中国EMS企业所面临的威胁 Cost of Raw materials 原材料成本 IPC Market Research
Cost of Raw Materials 原材料成本 IPC Market Research
Cost of Raw Materials 原材料成本 IPC Market Research
Cost of Raw Materials 原材料成本 IPC Market Research
Cost of Raw Materials 原材料成本 IPC Market Research
Cost of Raw Materials 原材料成本 IPC Market Research
Cost of Raw Materials 原材料成本 IPC Market Research
Cost of Raw Materials - Solder 原材料成本 – 焊料 263% cost of metals increase IPC Market Research
Cost of Raw Materials – PCBs 原材料成本 – PCB • Due to yield improvements, material costs and productivity, ½ oz foil is now lower cost than 1 oz. (Heavy copper detrimental to productivity) 由于产量提高、材料成本及生产效率，1/2盎司铜箔的成本低于1盎司 • Japanese laminate producers raised Fr 4 pricing on average 30% in June 日本层压板生产商在今年 6月将FR 4的价格平均提高了30% • Glass Suppliers forecasting ~ 3% - 10% additional price increases for Q 306 玻璃供应商预测06年第三季度玻璃的价格会增加 3%-10% • Resin Suppliers forecasting ~ 3% - 5% additional price increases for Q 306 树脂供应商预测06年第三季度树脂的价格会增加 3%-5% IPC Market Research
Cost of Raw Materials – PCBs 原材料成本 – PCB Laminate Price Trend IPC Market Research
Financial View of EMS Industry EMS行业的金融纵览 IPC Market Research
Financial View of EMS Industry EMS行业的金融纵览 § Cyclicality: High 周期性：长 § Visibility: Low 透明度：低 § Competition: High 竞争性：激烈 § Outlook: Uncertain 前景：不确定 IPC Market Research
Financial View of EMS Industry - Cyclical EMS行业的金融纵览 — 周期 § Need to Control Cash Flow 需要控制现金流转 § Critical to Manage Balance Sheet 严格管理资产负债表 § Maintain Breakeven as Low as Possible 尽可能维持低亏损 § Investors Try to Time the Market IPC Market Research
Financial View of EMS Industry – Low Visibility EMS行业的金融纵览 — 低透明度 Conservative Financials 保守金融 ü Secure Cash Flow 可靠的现金流转 ü Right-Size Balance Sheet 适当的资产负债表 Potential Improvements 潜在的改善 ü Customer Relationships 客户关系 § Long-Term Contracts § Upselling ü Better Forecasting 更好的预测 IPC Market Research
Financial View of EMS Industry – Highly Competitive EMS行业的金融观点 — 高竞争性 • Overcapacity 产能过剩 • Power could reside with ODMs • OEMs may bring work back in-house OEM可能会自己完成制造 • Bubble Infrastructure 泡沫基础结构 • Easy Money and Credit Delayed Natural Cleansing Process • Not getting paid for services – lead free IPC Market Research
Opportunities for EMS Companies EMS企业的机遇 IPC Market Research
Opportunities for EMS Companies EMS企业的机遇 Lead Free 无铅 IPC Market Research
Opportunities for EMS Companies – Lead Free EMS企业的机遇 — 无铅 Market differentiator for your company 无铅是划分市场标杆 Validate your companies ability to meet lead free requirements: 证明你的公司能够满足无铅要求 Certification? 认证？ Materials Declaration? 材料声明？ IPC Market Research
IPC Market Research
Opportunities for EMS Companies. Materials Declaration EMS企业的机遇 — 材料声明 • • Part of a family of supplier declaration standards 供应商声明标准系列部分 Exchange of detailed materials composition throughout the supply chain 交换贯穿供应链的详细材料成份 Establish electronic data formats 建立电子数据格式 Provide a PDF-based form 提供PDF格式 • IPC MOU with Adobe IPC已同Adobe签订了协议 • Users can edit the PDF form using the free Acrobat Reader 用户可使用免费下载的Acrobat Reader编辑PDF格式 • Automated data extraction 自动数据提取 IPC Market Research
Opportunities for EMS Companies Market Forces EMS企业的机遇 — 市场推动力 IPC Market Research
Opportunities for EMS Companies EMS企业的机遇 EMS companies have 20% - 30% of total available market for electronics assembly. EMS企业占有电子组装整个现有市场的20%-30% Companies can grow market share 企业可增加市场份额 in good times and 迅速 bad more room to grow. 更多的成长空间 IPC Market Research
Opportunities for EMS Companies – Market Forces EMS企业的机遇 – 市场推动力 Market/Customers will reward: 市场/客户回报： • • • Virtual versus Vertical EMS companies 纵向EMS企业 ODMs may alienate some OEMs which could be positive for smaller EMS companies ODM可能会疏远积极寻找小型EMS企业的OEM Large EMS companies/ODMs have a hard time working with industrial and medical markets 大型EMS/ODM企业在 业/医疗市场会有一段艰难时期 IPC Market Research
Opportunities for EMS Companies EMS企业的机遇 Design is Critical To Success and Market Differentiation 设计对于成功及市场划分非常关键 IPC Market Research
Opportunities for EMS Companies – Design EMS企业的机遇 – 设计 According to Dr. Dongkai Shangguan, Senior Director, Flextronics International: • • • 伟创力国际的高级主管上官东恺博士说： Approximately 80% of the product’s cost is determined in the design stage. 约 80%的产品成本决定于设计阶段 Up to 80% of the total cost of a product is determined in the New Product Introduction process 在新产品导入过程中可确定达 80%的产品总成本 Leveraging EMS involvement early on in the design stage can result in a 25% reduction in product cost and 25% reduction in time to market. EMS尽早渗入设计阶段会使成本降低25%，上市时间缩短 25% IPC Market Research
Opportunities for EMS Companies – Design EMS企业的机遇 – 设计 Dr. Shangguan: What happens when design is ignored. 上官东恺博士说：忽视设计会导致 • Resolving issues can require substantial changes to the design. 需要改变设计来解决问题 - Cost 成本 - Cost of product development 产品开发成本 - Cost of quality 质量成本 - Time to Market 上市时间 - Lost Opportunities 贻误商机 The more competitive the market the higher the risk 竞争越激烈，风险越高 IPC Market Research
Opportunities for EMS Companies – Design EMS企业的机遇 – 设计 Dr. Shangguan: What happens when design is ignored. 上官东恺博士说：忽视设计会导致 • As technologies continue to increase in complexity, the grater the changes for divergence between whit is designed and what get manufacturered. 技术复杂程度的提高，导致设计者和制造商的摩擦不断增加 - Unless companies make specific efforts to reduce this effect through design/manufacturing collaboration. 除非企业做出针对性的努力来减少这种设计/制造摩擦 IPC Market Research
Opportunities for EMS Companies – Design EMS企业的机遇 – 设计 Product development requires much more manufacturing involvement than in the past. 与过去相比， 产品开发要求更多地涉及制造 IPC Market Research
Opportunities for EMS Companies EMS企业的机遇 North America and Europe IPC Market Research
Opportunities for EMS Companies – Partnerships EMS企业的机遇 – 合作 China EMS can be low cost/volume provider • • 中国EMS企业是成本低/产量高的供应商 However: 但是 Strong communication necessary 必须加强沟通 Reluctance because of quality issues 质量问题导致不愿和中国的EMS企业合作 Reluctance because China EMS can take away customer 不愿和中国的EMS企业合作 – 可能带走客户 Can establish their own plant in China IPC 会建立自己在中国的 厂Market Research
Opportunities for EMS Companies – Other Considerations EMS企业的机遇 –其他需要考虑的事项 Workforce Training 人力培训 Productivity 生产力 Quality 质量 IPC Market Research Intellectual Property 知识产权
Opportunities for EMS Companies EMS企业的机遇 Understand IPC Standards and Certification Programs 了解IPC标准及认证课程 IPC Market Research
Questions 提问 IPC Market Research
Скачать презентацию Industry Terminology 业术语 IPC Market Research EMS
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