IBM System x Systems Overview: System x 3400 M 3 and System x 3500 M 3 XTW 1010 q This presentation is intended for the education of IBM and Business Partner sales personnel. It should not be distributed to customers. © 2006 IBM Corporation IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
Topic Overview Upon the conclusion of this topic, you should be able to : > Describe the attributes of the IBM System x 3400 M 3 and x 3500 M 3 servers > Identify and describe the subsystem components that make up the IBM System x 3400 M 3 and x 3500 M 3 servers > Identify and describe the systems management tools available for the System x 3400 M 3 and x 3500 M 3 servers IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
Topic Agenda > *IBM System x 3400 M 3 and x 3500 M 3 Product Overview* § § x 3400 M 3 and x 3500 M 3 At a Glance x 3400 M 3 Product Overview x 3500 M 3 Product Overview Feature Comparison > IBM System x 3400 M 3 and x 3500 M 3 Architecture Overview § Processor Subsystem § Memory Subsystem § Disk Subsystem > IBM System x 3400 M 3 and x 3500 M 3 System Management § § § u. EFI Integrated Management Module Systems Director 6. 1 Active Energy Manager IBM Preboot Dynamic System Analysis Operating Systems IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 – At a Glance > Introducing the x 3400 M 3 and x 3500 M 3 § Dual Socket § Choice of Dual, Quad or Six Core Intel® Xeon 5500 and 5600 series processor § Up to 3. 33 GHz and 12 MB cache. (Model dependent). § 4. 8 GTS, 5. 86 or 6. 4 GTS Intel Quickpath Interconnect (QPI) support > Large capacity high-performing memory § Supports DDR-3 Low voltage 1. 35 V Memory DIMMs – – IBM x 3400 M 3 Up to sixteen DIMM slots Up to 128 GB on x 3400 M 3 and 192 GB* on x 3500 M 3 maximum Memory Mirroring Chipkill > Up to twenty four hot-swap SAS or SATA HDDs § Up to sixteen hot-swap SAS or SATA on x 3400 M 3 > IMM and u. EFI BIOS > Operator Information Control Panel > High-availability features § Redundant power/cooling optional IBM x 3500 M 3 IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 - Product Overview (1 of 2) 5 UP Tower with flexible configuration options for business growth Processor >Up to two processors – 1 standard >Choice of dual or quad core Intel Xeon 5500 and 5600 series processor §Up to 2. 66 GHz standard; up to 2. 93 Ghz via CTO § 4 or 12 MB L 2 cache. §Up to 5. 86 GTS with Intel Quick. Path Interconnect (QPI) standard ; up to 6. 4 GTS via CTO Memory >16 DIMM sockets § 8 DIMM per processor §Up to 128 GB RDIMMs memory §Up to 48 GB* UDIMM memory >1 GB, 2 GB, 4 GB, 8 GB RDIMM memory options § 2 or 8 GB Standard (model dependant) – 800/1066/1333 MHz DDR 3 SDRAM >1, 2, or 4 GB* UDIMM memory options >Memory Mirroring >Chipkill IBM x 3400 M 3 * Maximum UDIMM support for 48 GB when 4 GB DIMMs are available 2 Q 2010. IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 - Product Overview (2 of 2) Storage Capacity >Four 3. 5 -inch hot-swap or simple-swap OR Eight hot-swap drive bays (Model dependent) § Up to 16. 0 TB total capacity using eight 2 TB SATA 3. 5 -inch HS HDD options § Up to 4. 8 TB total capacity using eight 600 GB 3. 5 inch SAS HS HDDs options >Up to eight OR Sixteen 2. 5 -inch hot-swap drive bays (Model dependent) § Up to 8 TB total capacity using sixteen 500 GB 2. 5 -inch SAS or SATA SFF slim-line HDDs § RAID Support > Serv. RAID-BR 10 il v 2 on four SAS/SATA 3. 5 inch HS Models supports RAID 0/1/1 E > Serv. RAID-M 1015 on eight SAS/SATA 2. 5 -inch HS Models supports RAID 0/1/10 optional 5 > Optional Serv. RAID-M 5015/1014 SAS § RAID 0/ 1/ 10/ 5/ 50 optional 6/ 60 IMM with remote presence enabled via optional hardware key Six to Eight expansion slots > Five PCI Express Gen 2 x 8 slots § One x 16 § Four x 8 § Optional extender board supports two-PCI-X or one PCI-E slot > One PCI 32 -bit/33 MHz slot Dual port Gigabit Ethernet > Wake on LAN > Without TOE supported Optical Drives > One half-high DVD-ROM drive installed. § Optional one full-high internal tape drives OR § Two half-high internal tape drives Fixed Power Supply > One 670 or 920 Watt (model dependent) > Active Energy Manager (AEM) Three speed-controlled hot-swap fans IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3500 M 3 - Product Overview (1 of 2) 5 U Tower with flexible configuration options for business growth Processor >Up to two processors – 1 standard >Dual, Quad or Six-core Intel Xeon 5500 and 5600 series processor with Quick Path Interconnect (QPI) architecture §Up to 3. 33 GHz §Up to 12 MB cache. §Up to 6. 40 GTS with Intel Quick. Path Interconnect (QPI) Memory >16 DIMM sockets § 8 DIMM per processor §Up to 128 GB RDIMM memory with future support for 192 GB §Up to 32 GB UDIMM memory with future support for 48 GB >1 GB, 2 GB, 4 GB, 8 GB, 16 GB* RDIMM memory options § 4 or 8 GB Standard (model dependant) – 800/1066/1333 MHz DDR 3 SDRAM IBM x 3500 M 3 >1, 2 or 4 GB* UDIMM memory options >Memory Mirroring >Chipkill * Maximum RDIMM support for 192 GB when 16 GB DIMMs are available 2 Q 2010 * Maximum UDIMM support for 48 GB when 4 GB DIMMs are available 2 Q 2010. IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3500 M 3 - Product Overview (2 of 2) Storage Capacity > Up to twenty four 2. 5 -inch SAS/SATA HS Seven to Eight expansion slots > Five PCI Express Gen 2 x 8 slots § one x 16 § four x 8 § Up to 12 TB using twenty four 500 GB 2. 5 -inch > One PCI Express Gen 1 x* slots SAS SFF slim-line HDDs (model dependent) > One PCI 32 -bit/33 MHz slot OR > Optional extender board supports two-PCI-X > Up to eight 3. 5 -inch, SAS/SATA HS HDD § Up to 16. 0 TB total capacity using 2 TB SATA 3. 5(CTO only, need to remove 1 PCIe x 8) HDDs inch HS HDDs (model dependent) RAID Support (Model dependent) > Serv. RAID-M 1015 supporting RAID 0/1/10 optional 5 > Serv. RAID-M 5014 supporting RAID 0/1/10/5/50, Optional 6, 60 with 256 MB cache > Serv. RAID-M 5015 supporting RAID 0/1/10/5/50, Optional 6, 60 with 512 MB cache Media Support > DVD-ROM standard > Two 5. 25 -inch half-high support tape backup or other devices 920 -watt Hot-swap Power Supply and three hot-swap fans standard § Optional hot-swap redundant power and cooling with hot-swap upgrade § Active Energy Manager (AEM) IMM with remote presence Standard Integrated Dual Gigabit Ethernet IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 Feature Comparison x 3400 M 3 x 3500 M 3 Intel® 5520 Chipset Processor Intel 5500 and 5600 series dual, quad and sixcore Intel 5500 and 5600 series quad and six-core Memory DDR III : 16 DIMM / 128 GB maximum - Up to 48 GB UDIMM memory DDR III : 16 DIMM / 128 GB maximum with future support for 192 GB - Up to 48 GB UDIMM memory Tape Support One half-high DVD-ROM drive installed. Optional one full-high internal tape drives OR Two halfhigh internal tape drives One half-high DVD-ROM drive installed. Optional one fullhigh internal tape drives OR Two half-high internal tape drives Hard Disk Drives 4 SS/HS SAS/SATA OR 8 HS HS SAS/SATA 8 or 16 HS SFF SAS/SATA 4 SS/HS SAS/SATA OR 8 HS HS SAS/SATA 8, 16, or 24 HS SFF SAS/SATA RAID Supporting H/W RAID 0, 1, 5, 6, 10, 50, 60 - (model dependent) Ethernet Integrated Dual Gigabit Ethernet without TOE Integrated Dual Gigabit Ethernet with TOE PCI Slots One x 16, four x 8, one PCI 32 bit/33 MHz, Optional extender board supports two-PCI-X or one PCI-E slot One x 16, five x 8, one PCI 32 bit/33 MHz, Optional two 64 bit/133 MHz PCI-X slots (Requires removal of one x 8 PCIE) IMM with optional hardware key for remote presence IMM standard with remote presence (no hardware key required) Fixed one 670 Watt OR one 920 Watt hot swap Power with optional hotswap redundant power supply upgrades One 920 W hot swap Power with optional hot-swap redundant power and cooling with hot-swap upgrade Chipset Systems Management Power IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 - Executive Overview Positioning Target Markets and Industries > High performance dual, quad and six core 2 -socket tower >Distributed enterprise and mid-size environments >Small to medium businesses >Retail, Banking, Insurance, and small business server offering high availability and resiliency > Ideal for mid-size to emerging enterprise and virtualized environments Business Benefits > Delivers high availability features and integrated systems management tools to maximize uptime > Combines stability with flexible growth options for increased investment protection > Lower IT acquisition and lifecycle costs while providing outstanding performance Key Product Features Target Applications >File and print services >Email and collaboration >Distributed branch office applications Competitive Advantages > Latest generation high-efficiency Intel Xeon processors HP ML 350/370 G 5/G 6 > Up to 128 GB via 16 DIMM slots of DDR 3 memory with future >HPs comparable 1 U server to support only 4 x 2. 5” HDD > > > support for up to 192 GB memory Flexibility with up to 24 or 16 high-performance Hot swap Serial Attached SCSI (SAS) or low-cost Serial hard disk drives RAID support Hot swap/redundant power supplies Hot swap/redundant cooling Integrated Dual Gigabit Ethernet IMM with hardware key for remote presence standard with option to support additional 2 x HDD for a fee >HP does not offer a full hardware-based encryption RAID solution. >HP uses proprietary alerts forcing customers into HP SIM environment >HP lacks capability for Systems Admin’s to create bootable media for software updates >HP Insight Manager power monitoring only available at additional cost IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 - Front Bezel View Service Processor Bus Microprocessor (CPU) Voltage Regulator Module USB Ports Configure (CPU or Memory NMI (Non-Maskable Interrupt) DASD / RAID Power Supply Fan PCI Bus NMI / System Error Log Temperature System Board IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 – Front View with Bezel Removed System Indicators USB 1 - 2 DVD Drive SAS/SATA Hard Disk Drives DVD Drive HDD Activity LED SAS/SATA Hard Disk Drives 2. 5 inch SAS/SATA Hot-Swap Hard Disk Drive Model 3. 5 inch SAS/SATA Hot-Swap Hard Disk Drive Model Simple. Swap Hard Drive 3. 5 inch SATA Simple-Swap Hard Disk Drive Model IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3500 M 3 – Front View with Bezel Removed System Indicators DVD Drive USB 1 & 2 2. 5 inch Hot Swap SAS Hard Drives IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 – Component View Power Supply Cage Processors 1 & 2 Air Baffle Rear Adapter Retention Bracket Air Baffle Release Clip Hot-Swap Fans Fan Assembly Hard Drive Housing DVD Drive Housing IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM System x 3400 M 3 System-board View DIMM Slots 9 -16 Processor 2 Front Panel Connector Processor 1 Power Main Power Virtual Media Key Connector DIMM Slots 1 -8 Front USB Connector PCI-E Slots 1 -5 Simple swap SATA cable connector PCI Slots Hot Swap Main Fan Connector SATA Connectors IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM System x 3500 M 3 System-board View DIMMs slots 9 -16 Diagnostics Processor 2 Power Serial System Power Video USB DIMMs slots 1 -8 Virtual media key connector Processor 1 PCI-E slots 1 -5 Fan PCI – 32 Slot 6 SATA 2 -5 PCI-E Slot 7 Battery SATA 0 & 1 IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 - Rear View Power Connector Serial 1 Video Power Connector Video Systems Management Power LED AC / DC LED’s Power LED USB 1 - 4 AC / DC LED’s USB 1 -4 Ethernet 1 & 2 X 3400 M 3 Ethernet 1 & 2 X 3500 M 3 IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
Topic Agenda > IBM System x 3400 M 3 and x 3500 M 3 Product Overview § § x 3400 M 3 and x 3500 M 3 At a Glance x 3400 M 3 Product Overview x 3500 M 3 Product Overview Feature Comparison > *IBM System x 3400 M 3 and x 3500 M 3 Architecture Overview* § Processor Subsystem § Memory Subsystem § Disk Subsystem > IBM System x 3400 M 3 and x 3500 M 3 System Management § § § u. EFI Integrated Management Module Systems Director 6. 1 Active Energy Manager IBM Preboot Dynamic System Analysis Operating Systems IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 – 5500 Series Processor > Enhanced Micro-architecture 45 nm § Dual and Quad-core processing > Intel® 5520 Chipset § Up to 6. 4 GTs § Dual x 16 Gen 2 or quad x 8 PCI Express 2. 0 Up to 25. 6 GB/sec bandwidth per link Xeon processor graphics card support QPI Up to 16 slots DDR 3 Memory > Integrated DDR 3 three-channel memory controller processor > Two Intel® Quick. Path Interconnect (QPI) links per component § Six total High Speed Serial link between Intel 5520 Hub PCI Express Gen 1, 2 ICH CPUs/chipset > Single die quad core > Three cache levels: § 32 KB of L 1 Data cache per core § 256 KB L 2 memory cache per core § Shared 4 or 8 MB L 3 cache IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 – 5600 Series Processor (1 of 2) 32 nm Technology with 2 nd Generation High-k Process > Intel 5520 Chipset § IOH (Northbridge) + ICH 10 (Southbridge) New Processor, Proven Platform § Up to 6. 4 GT/sec speeds § Dual x 16 Gen 2 or Quad x 8 PCI Express 2. 0 graphics card support Up to 25. 6 GB/sec bandwidth per link > Integrated DDR 3 three-channel memory controller Intel® Xeon® 5600 § 2 nd CPU required to use all 18 DIMMs > Two Intel Quick. Path interconnect (Intel QPI) links per components § High Speed Serial link between CPUs/chipset § Up to 25. 6 GB/sec bandwidth per link Up to 18 slots DDR 3 Memory Intel® Xeon® 5600 QPI Intel® 5520 Chipset Intel® Data Center Manager Intel® Node Manager Technology PCI Express* 2. 0 > Single die four or six core > Three cache levels: § 32 KB data / 32 KB instruction L 1 cache per core ICH 9/10 Intel® 82599 10 Gb. E Controller § 256 KB L 2 memory cache per core § Shared 4 MB or 12 MB L 3 cache IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 – 5600 Series Processor (2 of 2) Building on Xeon® 5500 Leadership Capabilities 130 W* 95 W 80 W Intelligent Power Technology Lower Power CPUs Better performance/Watt Lower power consumption Intel® Xeon® 5600 CPU Power Management Optimized power consumption through more efficient Turbo Boost and memory power management Integrated Power Gates and Automated Low Power States with Six Cores Intel® Xeon® 5600 Lower Power DDR 3 Memory Up to 10% reduction in memory power† Nehalem Micro-architecture + 32 nm CPU + Enhanced Power Mgt = Greater Energy Efficiency IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 – Processor Options Intel® Dual, Quad and Six-core Xeon® processor 5500 and 5600 series featuring the latest generation micro-architecture technologies: > > > > Intel Quick. Path Interconnect Turbo Boot Technology Intel Hyper-threading Technology Intel Virtualization Technology Intelligent Power Technology Intel Smart Cache Intel I/O Acceleration Technology Processor Speed Link Speed Max Memory Speed TDP 6 12 3. 33 GHz 6. 4 GT/s 1333 MHz 130 w 4 12 3. 46 GHz 6. 4 GT/s 1333 MHz 130 w Intel Xeon X 5670 6 12 2. 93 GHz 6. 4 GT/s 1333 MHz 95 w 6 12 2. 80 GHz 6. 4 GT/s 1333 MHz 95 w Intel Xeon X 5650 6 12 2. 66 GHz 6. 4 GT/s 1333 MHz 95 w Intel Xeon E 5640 4 12 2. 66 GHz 5. 86 GT/s 1066 MHz 80 w Intel Xeon E 5630 4 12 2. 53 GHz 5. 86 GT/s 1066 MHz 80 w Intel Xeon E 5620 4 12 2. 40 GHz 5. 86 GT/s 1066 MHz 80 w Intel Xeon E 5507 4 4 2. 26 GHz 4. 8 GT/s 800 MHz 80 w Intel Xeon E 5506 4 4 2. 13 GHz 4. 8 GT/s 800 MHz 80 w Intel Xeon E 5503 Value Cache Intel Xeon X 5660 Standard Cores Intel Xeon X 5677 Advanced Processor Intel Xeon X 5680 Usage 2 4 2. 0 GHz 4. 8 GT/s 800 MHz 80 w IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 - Memory Subsystem DDR 3 Memory technology > Twice the data rate of DDR 2 > Lower operating Voltage (1. 5 V vs 1. 8 V for DDR 2) > Lower power (30%) than DDR 2 or FBD for the same speed > Higher speed than DDR 2 (spec is 800, 1066, 1333 MHz) 16 DIMM Sockets standard > Up to 128 GB or 192 GB* maximum memory § 1 GB, 2 GB, 4 GB, 8 GB, 16 GB* memory options - PC 3 -10600 1333 MHz DDR-3 ECC - PC 3 -8500 1066 MHz DDR-3 ECC - PC 3 -6400 800 MHZ DDR-3 ECC > Up to 32 GB UDIMM § 1, 2 GB and 4 GB* UDIMM memory options Chipkill memory protection > Detects full DRAM memory errors and increases system availability Memory Mirroring > Reduces system downtime by keeping a real-time copy of data in memory * Maximum RDIMM support for 128 GB when 8 GB DIMMs are available 2 Q 2010 * Maximum UDIMM support for 48 GB when 4 GB DIMMs are available 2 Q 2010. IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 and x 3500 M 3 - Memory Population Order Notes: > Each CPU has its own memory DIMM bank and requires at least one installed DIMM per microprocessor 3 6 2 1 5 4 8 7 > For best performance, populate in order recommended in tables Ch 0 Ch 1 Ch 0 CPU 1 Ch 2 CPU 2 10 11 Ch 1 12 13 14 Ch 2 QPI 9 15 16 > Minimum of one DIMM must be installed for each microprocessor for the server to operate. Three DIMMs per microprocessor improves server performance DIMM Slots Installed microprocessors > Server supports a maximum of 16 single, dual, or quad-rank* DIMMs. > Only the x 3500 M 3 supports quadrank DIMMs the server and the maximum supported is 12. > DIMMs do not have to be added in pairs however mixing single and dual rated DIMMS within a channel is not supported DIMM Slots DIMM connector population sequence Microprocessor 1 3, 6, 8, 2, 5, 7, 1, 4 Microprocessor 2 11, 14, 16, 10, 13, 15, 9, 12 Microprocessor 1 and Microprocessor 2 3, 11, 6, 14, 8, 16, 2, 10, 5, 13, 7, 15, 1, 9, 4, 12 IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 - Memory Mirroring Memory-mirroring replicates and stores data on two pairs of DIMMs within two channels simultaneously X 3400 M 2 Memory Mirroring Sequence X 3500 M 2 Memory Mirroring Sequence DIMMs Number of installed processor DIMM Connector DIMMs Number of Processor DIMM Connector First Pair 1 3, 6 Second Pair 1 2, 5 Third Pair 1 1, 4 Fourth Pair 2 14, 11 Fifth Pair 2 13, 10 Sixth Pair 2 12, 9 NOTE: DIMM connectors 7, 8, 15, and 16 are not used in memory-mirroring mode IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 - Disk Subsystem Eight or Sixteen SAS or SATA HDD > Up to 24 2. 5 - inch bays available using upgrade option § Up to 8 TB capacity with x 3400 M 3 § Up to 12 TB capacity with x 3500 M 3 > SAS § § § 146 and 300 GB 10 K 6 Gbps SAS 2. 5" SFF Slim-HS HDD 73 and 146 GB 15 K 6 Gbps SAS 2. 5" SFF Slim-HS HDD 146 GB 15 K 6 Gbps SAS 2. 5" SFF Slim-HS SED 500 GB 7200 6 Gbps NL 2. 5“ SFF Slim-HS HDD 73, 146 and 400 GB 15 K 3. 5" Hot-Swap SAS 300, 450 and 600 GB 15 K 6 Gbps SAS 3. 5" Hot-Swap HDD RAID Support > Serv. RAID-M 1015 supporting RAID 0/1/10 optional 5 > Serv. RAID-M 5014 supporting RAID 0/1/10/5/50, Optional 6, 60 with 256 MB cache > Serv. RAID-M 5015 supporting RAID 0/1/10/5/50, Optional 6, 60 with 512 MB cache > SATA § § § 160 and 500 GB 7200 NL 2. 5" SATA SFF Slim-HS HDD 250 and 500 GB 7200 RPM 3. 5" Simple-Swap SATA II 250 and 500 GB 7200 RPM 3. 5" Hot-Swap SATA II 1 TB 7200 SATA 3. 5'' HS HDD 2 TB 7200 NL SATA 3. 5" HS HDD IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
Topic Agenda > IBM System x 3400 M 3 and x 3500 M 3 Product Overview § § x 3400 M 3 and x 3500 M 3 At a Glance x 3400 M 3 Product Overview x 3500 M 3 Product Overview Feature Comparison > IBM System x 3400 M 3 and x 3500 M 3 Architecture Overview § Processor Subsystem § Memory Subsystem § Disk Subsystem > *IBM System x 3400 M 3 and x 3500 M 3 System Management* § § § u. EFI Integrated Management Module Systems Director 6. 1 Active Energy Manager IBM Pre. Boot Dynamic System Analysis Operating Systems IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
u. EFI – Unified Extensible Firmware Interface The Next Generation of BIOS Allows OS’s to take full advantage of the hardware > Architecture Independent > Modular § 64 bit code architecture § 16 TB of memory can be addressed More functionality > Adapter vendors can add more features in their options (e. g. , IPv 6) > Design allows faster updates as new features are introduced > More adaptors can be installed and used simultaneously > Fully backwards compatible with legacy BIOS Better user interface > Replaces ctrl key sequences with a more intuitive human interface > Moves adaptor and i. SCSI configuration into F 1 setup > Creates Human readable event logs Easier management > Eliminates “beep” codes; all errors can now be covered by Light Path > Reduces the number of error messages and eliminates out-dated errors > Can be managed both in-band out of band IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
Integrated Management Module More Management Features – Fewer Parts > Combines multiple functions on IMM single chip § BMC / RSA-II functionality § Video controller § Remote Presence/c. KVM function § Super. IO § Common SP hardware across all USB 1. 1/2. 0 Devices CPU Core Super I/O Crypto AES platforms Video Controller § One IMM firmware applies to all BMC I/O Video Comp. DDR 2 Memory Controller servers § IMM can update other server firmware components > Additional benefits: § No IBM drivers required § Improved error logging § Configurable both in and out of band Components § § § § MIPS 4 KEc 300 MHz 32 -bit Processor BMC I/O Matrox G 400 Video Core DDR 2 -250 MHz Memory Controller USB 1. 1 and 2. 0 Configurable Peripherals Hardware Digital Video Compression 128 -bit AES Hardware Encryption Engine Super I/O IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
Virtual Media Hardware Key Remote Presence capability and Blue-screen Capture Features: Virtual Media Key > Remotely viewing video with graphics resolutions up to 1280 x 1024 at 75 Hz, regardless of the system state > Remotely accessing the server, using the keyboard and mouse from a remote client > Mapping drives that are available for use by server. § § CD or DVD drive Diskette drive USB flash drive on a remote client ISO and diskette image files as virtual drives > Uploading a diskette image to the IMM memory and mapping it to the server as a virtual drive IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM System Director 6. 1 Easier and more efficient management > Simplified deployment, installation and update process > Access anywhere with a consistent, web-based user interface > Easy-to-learn new tasks with intuitive wizards, tutorials and integrated help > Broad portfolio of systems managed by a single tool reduce 3 s staff training and operating expenses > Monitoring and managing of energy usage can lower costs with more efficient use of available energy > Integration of virtual and physical infrastructure management and decrease administrative costs Potential cost savings using IBM System Director 6. 1 of up to 34. 5 percent for Windows and 43. 8 percent for Linux x 86 servers IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM Active Energy Manager Manage actual power consumption and resulting thermal loads > Control and manage datacenter server power utilization > Hardware, embedded management logic > Sensors and alerts to warn the user if limiting power to this server is affecting performance > More accurate data center planning: § Actual power draw instead of conservative “label/spec power” estimates IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM Pre. Boot Dynamic System Analysis > Provides problem isolation, configuration analysis, error log collection §Collects information about: – System configuration – Network interfaces and settings – Installed hardware – Light path diagnostics status – Service processor status and configuration – Vital product data, firmware, and UEFI configuration – Hard disk drive health – RAID controller configuration – Event logs for Serve. RAID controllers and service processors IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
IBM x 3400 M 3 / x 3500 M 3 - Supported Operating Systems Microsoft® Windows® > Windows Server 2003 R 2, Standard edition > Windows Server 2003 R 2, Enterprise edition > Windows Server 2003 R 2, Web edition > Windows Server 2003 R 2, Data Center edition > Windows Server 2008, (32 bit and EM 64 T) > Windows Server 2008 R 2, (64 bit) Redhat > Red Hat Enterprise Linux 4 AS for AMD 64/EM 64 T > Red Hat Enterprise Linux 4 ES for AMD 64/EM 64 T > Red Hat Enterprise Linux 4 WS for AMD 64/EM 64 T > Red Hat Enterprise Linux 5 Server Edition > Red Hat Enterprise Linux 5 Server x 64 Edition > Red Hat Enterprise Linux 5 Server Edition with Xen > Red Hat Enterprise Linux 5 Server with Xen x 64 Edition SUSE Linux > SUSE Linux Enterprise Server 10 for AMD 64/EM 64 T > SUSE Linux Enterprise Server 10 with Xen for AMD 64/EM 64 T > SUSE Linux Enterprise Server 11 with Xen for AMD 64/EM 64 T IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
Course Summary Upon the conclusion of this module, you should be able to : > Describe the architecture attributes of the IBM System x 3400 M 3 and x 3500 M 3. > Identify the subsystem components that make up the IBM System x 3400 M 3 and x 3500 M 3. > Describe the attributes and advantages of the Intel 5500 and 5600 series processor. > Describe the systems management options available for the IBM System x 3400 M 3 and x 3500 M 3. IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
Glossary > > > > Intel® Quick. Path Interconnect (Intel QPI) Active Energy Manager (AEM) Memory Mirroring Chipkill TCP Offload Engine (TOE) Wake on LAN DDR 3 memory Virtual media key Serve. RAID-MR 10 is Simple Swap Unified Extensible Firmware Interface (u. EFI) Dynamic System Analysis Diagnostics Baseboard Management Controller (BMC) Integrated Management Module (IMM) IBM® Systems Director IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
Additional Resources IBM STG SMART Zone for more education: > http: //lt. be. ibm. com/smartzone IBM System x Enterprise Servers > http: //www-03. ibm. com/systems/x/hardware/enterprise/index. html IBM Server. Proven > http: //www-03. ibm. com/servers/eserver/serverproven/compat/us/ IBM Redbooks – System Technical Introduction > http: //www. redbooks. ibm. com/abstracts/redp 4260. html IBM System x Support > http: //www-304. ibm. com/systems/supportsite. wss/brandmain? brandind=5000008 IBM Systems & Technology Group Education & Sales Enablement © 2009 IBM Corporation
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