http www TEAsystems com Weir TR Temporal and

http: //www. TEAsystems. com Weir TR Temporal and Sequential Data Analysis and Performance Matching Interfaces of Thermal, Probe and CD Uniformity data Improvements with Release 2. 0 n n Data Loading speed increase 5 x to 8 x Improved wafer modeling Improved intra-site data interpolation Wafer-Contour plot speed improvement 12 x to 20 x Terrence E. Zavecz tzavecz @TEAsystems. com

Weir TR Product Features Range response by sensor over time Weir TR Sequence & Weir TR Matching o Requires Weir TR version 2. 0 or later. o Product has two interfaces Ø Weir TR; Sequence Analysis Ø Time dependent analysis of Temperature or any metrology variable Ø Derives critical phase elements of the cycle Ø Weir TR: Matching Ø Two dataset/system matching of Ø Thermal-to-Thermal Ø Thermal-to-Metrology Ø Metrology-to-Metrology Weir TR: Matching Temperature-to-BCD Feature Ø Can use Weir TR Temporal Analysis calculated variables Ø Example: Ø Cumulative-Energy vs feature size Ø Match any metrology, probe or sequence data 2 TEA Systems Yield Enhancement thru Modeling

Weir TR Time Response Analysis Data sources Weir PW Process Derived Analyses & Variables Wafer & Substrate Sensor Scanner log and metrology Clean-Track, Develop & In-line Data Metrology & Probe Data CD-SEM and Scatter Accept sequenced or time based data from any metrology source TEA Systems 3 Yield Enhancement thru Modeling

Sensor change-rate vs Temperature Weir TR Temporal Analysis Product Features Ø Weir TR; Temporal Analysis Ø Ø Ø Ø Time or Sequence dependent analysis of Temperature or any metrology variable Automated time-phase deconvolution of constant and rise/fall segments Energy or (Time* Temperature) calculation with temperature threshold Local velocity or rate-calculations of rate of local change with time Automated whole-substrate or individual sensor response Critical cycle-point analysis Substrate contour mapping/vectoring Ø Matrix display Ø Single time-slice Ø Animation of contour response Ø Variables used and derived include temperature, rate-of-change, acceleration-ofchange, Energy, Cumulative Energy 4 TEA Systems Yield Enhancement thru Modeling

Thermal response ranges n Displays variation at each sensor relative to average temperature of wafer 5 TEA Systems Yield Enhancement thru Modeling

Average times for each phase n Data is saved in Weir Data Workbook 6 TEA Systems Yield Enhancement thru Modeling

Automated Phase Deconvolution Max Temp Phase change Range n Statistics show four thresholds which are plotted as yellowfilled squares. n Range of data across wafer @ time is plotted by blue circles Min Temp 7 TEA Systems Yield Enhancement thru Modeling

Critical phase evaluation by sensor point n Customize the sampling or graphic to zoom-in on time/sequence critical segments 8 TEA Systems Yield Enhancement thru Modeling

Cumulative Energy Graphics selection interface tabs n Integrated energy at each sensor shown · n Graphics are provided by: · · · 9 and the phase in which it occurred Sensor/phase Rise time/sensor & phase Substrate Response as a function of Radius TEA Systems Yield Enhancement thru Modeling

Temperature Mean, Rise, Phase Length, Start Value 10 TEA Systems Yield Enhancement thru Modeling

Local Rate Change Variation rise n n 11 Local Rate Change plotted at 8 times over critical final rise Notice initial rise on left side of wafer at 2295 seconds with a slope range from 0. 217 to 0. 256 dec/sec TEA Systems Yield Enhancement thru Modeling

Vector/Contour mapping of user selected time-slices Three vector plots of accumulated energy 12 TEA Systems Yield Enhancement thru Modeling

Local Acceleration, Temperature & Rate-of-Change n Data taken at 2370 seconds 13 TEA Systems Yield Enhancement thru Modeling

Localized Rise/Fall Plot vs Variable Raw Temp vs Time Cycle Mouse-zoomed response at critical settling point n Details process-critical response to any variable such as temperature TEA Systems 14 Yield Enhancement thru Modeling

Threshold Analysis data Temperature variation n Data from the “Rise. Times. Phase” worksheet for 16 sensors n Transition points are marked on thermal curve as black squares with a yellow center (previous slide) n Data stored on Weir TR Spreadsheet in data workbook TEA Systems 15 Yield Enhancement thru Modeling

Separate window display of Thermal variation n Matrix view n Animation also provided 16 TEA Systems Yield Enhancement thru Modeling

Across-Wafer Modeled Bottom CD Variation Across two Bake Plates Weir TR Matching Product Features Ø Weir TR; Matching Ø Match any two Temporal/Metrology/Log sources Ø Match Bake, Temperature, Cumulative Energy , Process etc uniformity Ø Infinitely-Variable Rotation and Notch Alignment Controls Ø Features Includes: Ø Automated data culling Ø Histograms, contour, vector, XY, etc plots. Ø Individual time-slice or integrated analysis Ø Model across-wafer variation Ø User-customized graphics Ø Easy plot/copy into reports/html interfaces Ø Reports and data stored in standardized workbook format 17 (Scatter data) TEA Systems Yield Enhancement thru Modeling

Weir TR Time Response Analysis Data sources Weir PW Process Derived Analyses & Variables Weir TR Temporal Analysis Variables Clean-Track, Develop & In-line Data Scanner log and metrology Wafer & Substrate Sensor Metrology & Probe Data CD-SEM and Scatter Any metrology, sequenced or log based data 18 TEA Systems Yield Enhancement thru Modeling

Basic Operation of Weir TR Matching n Wafers from two separate bake plates shown n Provides a basic visual & statistical match comparison n Covariance matching over time/space n Compare static or sequential data · 19 For example; Bottom CD to Temperature or Cumulative Energy on the substrate TEA Systems Yield Enhancement thru Modeling

n Variable Culling n BCD based culling removed 309 data points to properly display wafer-graphic shown on left Easily removed Intra-Field variation and improves accuracy Original BCD data distribution Command used to generate histogram And then apply the wafer model 20 TEA Systems Yield Enhancement thru Modeling

Individual graphics n Comparison of BCD variation for wafers generated on two separate hotplate Post Exposure Bakes 21 TEA Systems Yield Enhancement thru Modeling

Variation by X-location on wafer Vector Contour Radial XY Horizontal XY Vertical VS Time/sequence Data here not modeled, this is raw data 22 TEA Systems Yield Enhancement thru Modeling

Modeled wafer variation n BCD Modeled variation due to slow across-wafer changes n Data from two bake plates 23 TEA Systems Yield Enhancement thru Modeling

BCD wafer fit to temperature n n n Response as a function of X position on the wafer On-Wafer Temperature at 135. 52 sec vs final Wafer-Modeled BCD 2 nd order line fitted to each 24 dataset using mouse interface TEA Systems Yield Enhancement thru Modeling

Weir TR calculated Cumulative Energy and BCD Variation n Contour grid (left) can be turned on/off 25 TEA Systems Yield Enhancement thru Modeling

Thermal-Time Cycle & BCD Information 26 TEA Systems Yield Enhancement thru Modeling

Thermal Energy & wafer-modeled BCD n Problem · On. Wafer probe and CDSEM oriented wafer differently n Left=Thermal vector plot n Right= Scatter-tool Contour 27 TEA Systems Yield Enhancement thru Modeling

Thermal rotated by – 135 degrees n Data Rotation interface allowed thermal data to be rotated by – 135 degrees to provide improved alignment 28 TEA Systems Yield Enhancement thru Modeling

PEB and feature- BCD as contour plots n Weir TR calculated Accumulated Energy from PEB cycle matched to BCD variation n Performed after rotation 29 TEA Systems Yield Enhancement thru Modeling

Radial Variation 30 TEA Systems Yield Enhancement thru Modeling

Horizontal Variation: Temperature vs BCD modeled 31 TEA Systems Yield Enhancement thru Modeling

Modeled Comparison of Temperature & Top CD (TCD) n Analysis used the BCD variable to remove “poor” metrology · 32 Any variable such as MSE, TCD, BARC, SWA etc can be used to cull data TEA Systems Yield Enhancement thru Modeling

Thermal and Feature Distributions Temperature @ 30 sec BARC SWA 1 (Side Wall Angle) Top Feature Size (TCD) 33 SWA 2 (Side Wall Angle) Bottom Feature Size (BCD) TEA Systems Yield Enhancement thru Modeling

http: //www. TEAsystems. com Weir TR: Matching Thermal Response Comparison of two hot plates Comparison of two separate PEB bake plates Terrence E. Zavecz tzavecz @TEAsystems. com

Time sequence for two bake plates 35 TEA Systems Yield Enhancement thru Modeling

Timed Response of Temperature 36 TEA Systems Yield Enhancement thru Modeling

Temperature response at curve peak 37 TEA Systems Yield Enhancement thru Modeling

Temperature at 148. 77 Sec 38 TEA Systems Yield Enhancement thru Modeling

Horizontal variation across plate n Hot-plate comparison for two PEB sequences n Temperature variation at 148. 77 seconds n Fitted curves up to 4 th order can be mouse-added to plots 39 TEA Systems Yield Enhancement thru Modeling

Total cumulative Energy @ end of cycle 40 TEA Systems Yield Enhancement thru Modeling

Summary n Two very-unique companion products are offered · · n Weir TR: Time Response · · n Weir TR – Time/Sequence Response Analysis software Weir TR – Matching for any sequence, probe or metrology data Goes beyond thermal sensor software provided by On. Wafer & Sens. Array Automated · Sequence Phase extraction · Process-Energy Injection calculation · Localized Rise/Fall calculation & plotting · Individual phase and sensor analysis Vector, histogram and XY plots of any time/sequence slide Matrix, Animation and visualization plots Weir TR: Matching · · Matching software for Critical Features and metrology elements · Similar to historic overlay matching methods Includes ability to match time/sequenced data · Such as Post-Exposure Bake, scanner logs, On. Wafer & Sens. Array data Match · Time-to-time · Time-to-Feature distribution · Feature-to-Feature Automated · Data culling · Wafer Model · Data Rotational Alignment 41 TEA Systems Yield Enhancement thru Modeling