Global Expert Technologies
Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities
Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities
Global Expert Technologies § HK-based company with PCB manufacturing in Huizhou § Low to Medium volume production § Specialised on Technically-challenging Products § Diversified Customer base and Business segments § Stringent management in Quality and Environmental control
Company Milestone 2015 • AVI • Automatic testing machine 2002 2014 • Biochemical system upgraded • PCB ERP system 2013 • Trading, • Drilling & film plotting • Obtained UL • UL Canada certification 2012 2003 • Phase 4 expansion (inner layer) completed • Huizhou plant Phase 1 completed 2010 2004 • Accredited ISO 9001 & TL 9000 • Obtained ISO 14001 2008 2007 • Huizhou plant Phase 2 expansion completed • Phase 3 expansion completed • Roll out quick turn service • Certified to ISO/TS 16949
Corporate Culture Our Philosophy Having Quality People and Providing Quality Products Our Mission To satisfy our customer’s needs, provide highly professional service and deliver product excellence Our Environmental Commitments To produce environmental friendly products and apply comprehensive environmental protection strategies throughout the manufacturing process
The company organization structure
Account Management – One-Stop Solution Enquiry/Quotation Order Placement Customer Account Manager Technical communication Contract Review Production Delivery Follow-up Services Quality Improvement
Product Breakdown Layer Count Product Segment Data : End 2014
Sales Revenue Growth USD ‘ 000 $30, 280 15% AGR= C $26, 330 $23, 364 $21, 000 $20, 200 $18, 500 $19, 800 $16, 600 2008 2009 2010 2011 2012 2013 2014 2015
Global Business …. . Customers from more than 50 countries East Europe America Ukraine West Europe China Turkey IRAN Asia South Africa Argentina Malaysia
Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities
Quality Certificates Accredited
Environmental Protection GET is a Green PCB Enterprise Awarded “Exemplary Enterprise in Huizhou” in 2008 Set up Biochemical Waste Water Treatment plant in 2014
Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities
Huizhou Manufacturing Facility Total Floor Area Work Force Annual Capacity : : : 16, 600 m 2 350 500, 000 m 2
1. Engineering (CAD/CAM) 2. Mass Lamination 3. Automatic Optical Inspection 4. CNC Drilling 5. Automatic Panel Plating Line 6. Stripping, Etching and Tin Stripping 7. Automatic ENIG Plating Line 8. Dry Film Imaging 9. Dry Film Development 10. Flying-probe Test 11. E-Test 12. Final QC
New Facilities in 2015 AVI 更新设备 持续发展 Updating new facilities for sustainable development 自动测试机（3台）） New Mass Lamination Machine 提升效率 满足客户 improving work efficiency for meeting customers’ requirements. New Fly Probe Testing Machine
Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities
Process and Product Capabilities PRODUCT FINISHING LAMINATES BOARD THICKNESS Rigid PCB Multi-layer ≤ 26 layers Double Sided Heavy Copper PCB (6 oz finished) Hot Air Leveling /HASL (lead free) Immersion Gold, Immersion Silver Gold Fingers Carbon Ink, OSP FR-4, Roger, High TG FR-4, Halogen Free FR-4, 0. 2~5. 0 mm (8 – 200 mil) MIN FINISHED HOLE SIZE SOLDER MASK INK OUTLINE PROFILE MAX. PANEL SIZE Laser Drill: 0. 10 mm(4 mil) Tolerance: 0. 01 mm Mechanical Drilling: MIN: 0. 15 mm Tolerance: ± 0. 05 mm (PTH) ± 0. 03 mm (NPTH) Aspect rate: 1: 8 LPI Soldermask Peelable Soldermask Punching, Routing, Punch And Push Back 476 mm X 620 mm (18. 7”X 24”)
Technology research process GET have a dedicated R&D team focusing on PCB manufacturing process. TOP: 1 OZ(Base) BOT: 3 OZ(Base) The first drilling NPTH Max. : 7. 0 mm, slot hole: 5 X 10 mm Part of BGA with OSP, other SMT ENIG in one board Carbon ink on the carbon fingers is 12 mil bigger than the copper PAD 1/3 OZ(Base)Line width/space control as per 12% (5/3. 5 mil) Silk screen line width 4. 5 mil(min) 3/3 OZ(Base) line width/space 9/9 mil(min); Common code impedance board Aspect ratio 1: 12. 2 Part platting hard gold without conductive line; plugging hole with resin for thin board（board thickness: 0. 3 mm/ hole diameter : 0. 4 mm） Aspect ratio 1: 10 Quick Turn Service Plugged via-holes with resin NPG TG 150 PCB 2009 2010 2011 2012 2013 2014
Thank you!
Скачать презентацию Global Expert Technologies Contents Company Overview Commitments
5bb6aae393d5fcd411cc0665b8799014.ppt