FPI Training Material New Product Development Group 1

FPI Training Material New Product Development Group 1 2015. 05. 25

Ⅰ What is Fingerprint? The definition of minutia feature is made from modern fingerprint method by E. R. Henry, a British scholar, which is Henry System Classification. He classified the fingerprint as 2 parts and 8 types. If there are 13 features matching, Henry will consider they are same fingerprint. The gap between 2 ridges are between 300 to 500 μm, while the height difference are between 100 to 400 μm. In order to get enough feature points for identification, the size and resolution of the fingerprint image should be 1 cm x 1 cm and 500 dpi.

Ⅰ What is Fingerprint?

Ⅰ What is Fingerprint?

Ⅱ Fingerprint Identification System and Application

Ⅱ Fingerprint Identification System and Application • ENROLMENT: Extraction of biometric data and construction of template • FTE: Failure To Enrol Template • Verification (1: 1): • User: “I am Christian” • System: “Yes you are” or “No, you are not” • Identification (1: n) or (1: many): • User: “Here I am” • System: “You are Christian” or “I do not know you”

Ⅱ Fingerprint Identification System and Application • VERIFICATION: Comparison of captured biometric data with one predetermined stored template • FRR: False Rejection Rate • FAR: False Acceptance Rate

Ⅱ Fingerprint Identification System and Application IDENTIFICATION: Comparison of captured biometric data with many stored template in database

Ⅱ Fingerprint Identification System and Application Fingerprint Identification provides a safe and convenient method for ID Verification and Management Cellphone/PAD Unlocking App. Access Control Folder Encryption Fast Logging(alternative for digital code) Quick Launch and Logging Express Payment

Ⅲ Fingerprint Sensoring Principle • Capacity Type Trans Capacitive Self Capacitance • Optical：Illuminant+CMOS+Lens • Ultrasonic：determine the distance • Two types: Area vs. Swipe Sensor

Ⅲ Fingerprint Sensoring Principle • Self Capacitance Sapphire Cover Lens Exciter Ring Sense Pixel Array

Ⅲ Fingerprint Sensoring Principle Valley Ridge Finger is TX Driven by Exciter Each square is pixel RX § Excitation voltage ~1 MHz coupled into finger via Exciter Ring or Bezel § Sense Amps at each pixel measure capacitance between finger and pixel § Very good sensitivity, but active circuitry at each pixel needed

Ⅲ Fingerprint Sensoring Principle • Trans Capacitive Valley Ridge RX TX § Very fine Touch. Pad § Sense trace spacing typically 70 -110 um § 16 MHz 3 V RF placed onto successively-scanned TX rows

Ⅲ Fingerprint Sensoring Principle • Swipe Type Sensor Host Platform Sensor Reconstruct Image Extract Minutiae M 1={x 1, y 1, a 1, z 1) M 2={x 2, y 2, a 2, z 2} . . . Raw Image Data Fingerprint Template

Ⅲ Fingerprint Sensoring Principle • Area Type Sensor

Ⅳ FPI Module Structure and Sensor List I Molding + Ultra thin cover lens II Molding+Thick Cover. Lens

Ⅳ FPI Module Structure and Sensor List III Molding+Coating IV Cover. Lens（Independent)

Ⅳ FPI Module Structure and Sensor List V Under Glass FPI Module Road. Map MP PP MP MP PP R&D MP PP PP MP

Ⅳ FPI Module Structure and Sensor List Molding+Coating Structure FPI Appearance and Surface Magnification Features Coating Sapphire Lens Glass(thick) Lens Glass(thin) Lens Goodix、Silead、 Micro. Array Goodix、Silead Appearance Hardness Cost IC Compatibility MP Capacity IC Sources for Truly

Ⅳ FPI Module Structure and Sensor List FPI Solutions IC Supplier IC P/N GF 616 0. 26 mm Saphire/Glass Cover Lens Goodix GF 816 GF 818 IC Packaging IC Size Pixels COB+Trench+Exposed Molding 4. 2*12*0. 47 68*118 COB+Trench++Exposed Molding 96*96 GF 516 COB+Molding GF 518 M COB+Molding 96*96 GSL 6163 DPR Die 109*123 AFS 120 TVS 　 68*118 Goodix 0. 2 mm Glass Cover Lens Silead Micro. Array 　 Square GSL 6162 MSB 110*118 GSL 6162 MRB 0. 05 mm Ultra-thin Glass Cover Lens /Coating COB+Trench++Molding 110*118 GSL 6162 EM COB+Trench++Exposed Molding 110*118 GSL 6172 MTB COB+Trench++Molding 80*200 Silead GF 316 Goodix GF 318 COB+Molding 68*118 96*96

Ⅴ Production Capacity Plan

Ⅵ Market Information Smart Phone Apple i. Phone 6/Plus Hua. Wei Mate 7 OPPO N 3 Meizu Mx 4 Pro Guan. Qun 3022 Type Sapphire Cover Lens Coating Sapphire Cover Lens Ultra-thin Glass Cover Lens Sensor Authentic FPC Goodix Silead Module Vendor Taiwan ASE A-Kerr Truly Cost 13 USD 11 USD 10 USD Korea Crucial. Tec 8 USD

• LENS Manufacturing Process： Substrate Cleaning→Silkscreen/Ink Spraying →Solidification→AF Evaporation→Cutting →Splintering→LENS QC • Assembly Process： FPC Baking→Solder Paste Printing→Chip Mounting →Reflow Soldering→Gel Filling →Solidification →Washing→LENS Lamination→Autoclave→ Solidification→Semi-finished Product Electrical QC→Holder Attaching→ Solidification →Label Printing →Splintering→Silicone Pad Attaching →Finished Product Electrical QC →Protective Film Attaching→Visual Inspection→OQC→Shipping

Sensor Supplier Qualification List √ Qualified Class ×Total Rejected Updated by 2015/03/15 Customer FPC Goodix VIVO √ √ x OPPO √ √ x Huawei √ ZTE √ Xiaomi √ 2 nd and 3 rd Tier Brand Le. TV √ K-Touch √ TCL √ Gionee √ Design House Ragentek SIMCOM 1 st Tier Brand √ Synaptics √ Silead Qualcomm (Ultrasonic) x √ √ √ √ √

FPI Module Manufacturing Ability Matrix 20150430 　 Molding Coating Optical Bonding Sensor Resources Truly × √ √ Goodix, Silead, Micro. Array O-Film √ √ × FPC, Goodix A-Kerr 　 　 √ Goodix, Micro. Array WLCSP √ √ × Silead Crucial Tec √ √ 　 FPC, Idex

• Notes for Design Stage 1. Independent power for FPI Module to make sure pure AVDD without noise. 2. If the FPI module is placed on the back of smartphone, and the rear cover is made of metal(connected to GND), customer need to contact the sensor supplier need to confirm the potential risk. 3. If the FPI module is placed on the front side, and the middleframe is made of metal(connected to GND), customer need to contact the sensor supplier need to confirm the potential risk.

• Debugging Notice • Silead Sensor Debugging Suite. • The debugging suites for Android 4. 2/4. 4 are OK • The debugging suite for Android 5. 0 will be OK by the end of this month.