Скачать презентацию DPR for KS-3 — Development Wistron Corporation Jeffrey Скачать презентацию DPR for KS-3 — Development Wistron Corporation Jeffrey

614551c1ebb6d1dcb8be5e2dea8b69b4.ppt

  • Количество слайдов: 40

DPR for KS-3 -- Development Wistron Corporation Jeffrey FL Wang 08/07 2006 1 DPR for KS-3 -- Development Wistron Corporation Jeffrey FL Wang 08/07 2006 1

DPR for KS-3 – Development Eng. Status 1. 2. 3. 4. 5. 6. 7. DPR for KS-3 – Development Eng. Status 1. 2. 3. 4. 5. 6. 7. 8. 2 Development Schedule Spec. Overview WW Agency Approval Plan Ro. HS Compliant Plan New FRU/ CRU plan Supplier selection plan EC Release Plan Quality Development Process

1. Development Schedule 3 1. Development Schedule 3

Development Schedule Notes: DV 1/DV 2/SIT/SVT planar assembly and box build at WKS. SOVP Development Schedule Notes: DV 1/DV 2/SIT/SVT planar assembly and box build at WKS. SOVP date depends on Merom for Santa Rosa processor launch date. 4

2. Specification Overview 5 2. Specification Overview 5

Kabuki / Sumo 3. 0 Offering Definition June 26, 2006 Time: SOVP: 4/09/07 Announce Kabuki / Sumo 3. 0 Offering Definition June 26, 2006 Time: SOVP: 4/09/07 Announce & GA: 4/24/07 Ship Support: 4/23/07 6

Sumo 3. 0 – X 61 Offering Definition (Concept Exit) System is not. . Sumo 3. 0 – X 61 Offering Definition (Concept Exit) System is not. . . System is. . . Form Factor Ÿ 12. 1" XGA TFT (150 nit) – Standard (275 g) only Ÿ 3. 15 lbs; 10. 5” x 8. 3” x. 96 -1. 36” Ÿ 2. 5” System SATA HDDs; Customer upgradeable Ÿ 1 Spindle HDD Ÿ Think. Light (white ) Ÿ 4 cell cylindrical or 8 cell cylindrical Li. Ion Battery Ÿ NV, 2. 5” HF, Standard Display Battery Life: Ÿ Hr (4 cell cyl); 8. 8 hr (8 cell cyl) 4. 4 Ÿ 2 nd Li. Ion Battery support (external battery pack on system or one bay battery option for Ultra. Base Dock) Ÿ ISO Standard full size keyboard (18. 5 mm pitch) Ÿ Trackpoint IV push-to-select ; In-line scroll/mag Ÿ 1 Think. Pad key + 3 audio keys; Ÿ Mono Speaker in system (0. 5 watt) Ÿ Integrated Microphone Ÿ Integrated dual band+ wireless antenna Ÿ Kensington lock Ÿ Fingerprint Reader (select models) Ÿ Integrated WWAN and WWAN-ready (select models) Ÿ 802. 11 n(abg) MIMO wireless with 2 x 2(entry), 2 x 3 capability Ÿ Optional K/S Ultrabase (Slice) (for optional 2 nd spindle) Ÿ 65 w AC Adapter Ÿ Ports on System/ Slice Ÿ 7 x USB 2. 0 ports (3 system, 4 slice) Ÿ 1 x T 2 PCMCIA Card. Bus/ USB Based Express. Card (System) Ÿ IEEE 1394 (system) Ÿ RJ 11, RJ 45 Ÿ Parallel, Serial (Slice) Ÿ VGA (Both) Ÿ Headphone-out, Mic-in (Both) Ÿ Slice connector (System) Ÿ Warm/Hot swap bay (Slice) Ÿ Keylock/cable lock slot (Slice) Ÿ PATA bay support (Slice) Ÿ Compliance Ÿ TCG Compliant Secure Chip Crypto-3 (Intel compliance) Ÿ Energy. Star Ÿ Ro. HS Ports Ÿ PS/2 Port (System) Ÿ FDD port connector Ÿ SPDIF (AC 3 audio) Ÿ Ultrabay 2000 Ÿ NEST Communications Calexico b Calexico 2 b/g, a/b/g Clymer b/g Bartlett a/b/g MDC I, II BMDC II, III UWB CPU: Intel Merom T 7300, T 7000, and T 5500 P NV CPU’s Panel: 12. 1” XGA TFT Standard (275 g) HDD: 40, 60, 80, 100, 120, 160 GB/ 5400 rpm 60, 100 GB /7200 rpm Memory: 256 MB, 512 MB, 1 GB, 2 GB Mini. PCIe: Think. Pad Gwinett 802. 11 a/b/g, Think. Pad 802. 11 n(abg), Intel Kedron n(abg) and Kedron abg (with b/g sku’s for select countries only), Golan abg, Mini. PCIe: Verizon(EV-DOrev. A), Vodafone(HSDPA 3. 6), Cingular, T-Mobile, Telus CDC: Modem, Bluetooth Battery: 4 cell(c), 8 cell (c) Operating Systems: XP Pro, Vista (Basic 32, Business 32/64, Ultimate 64) Integrated Graphics Ÿ GEN 4 fx(DX 10) graphics with up to 256 MB memory Ÿ Intel Merom with EMT 64 T processors (dual core 800 MHz FSB) Ÿ DDR 2 -667 PC 2 5300 memory Ÿ 2 x SO-DIMM /4 GB max Ÿ 2 x Mini-PCIe Slot (WLAN, WAN ) Ÿ 1 x Cardbus/ Express. Card Universal slot (with support for Express. Card 34 mm via USB interface adapter card) Red – Work Items Blue – New Open Bay Odyssey Building Blocks (Tested thru SIT) HDD: 40, 60, 80, 100, 120, 160 GB/ 5400 rpm 60, 100 GB/7200 rpm Memory: 512 MB, 1 GB, 2 GB Mini. PCIe: Think. Pad Gwinett 802. 11 a/b/g, Think. Pad 802. 11 n, Intel Kedron n(abg) and Kedron abg (with b/g sku’s for select countries only) Battery: 4 cell (cyl), 8 cell(cyl) Operating Systems: XP Pro, Vista IBM Confidential 7 Planar Ÿ 10/100 Ethernet Ÿ Mini PCI slot Ÿ DVI on System/Slice Ÿ Discrete Graphics Ÿ 128 MB memory Ÿ TV Out (S-Video) Ÿ LV/ULV processors Ÿ Infrared Ÿ No TAA Offering OS Support • See SW Support OD System Building Blocks (Tested thru SIT) Ÿ Planar Ÿ Intel Crestline GM / ICH 8 M & ICH 8 M Enhanced core chipset with Ÿ Gigabit Ethernet LOM (all models) Ÿ 3 x USB 2. 0 Ÿ IEEE 1394 Ÿ 1 x SD slot Ÿ Serial ATA Ÿ Soft audio / Microphone Ÿ TCG Compliant Secure Chip Crypto-3 (all models) Ÿ Wireless Upgradeable (all models) Ÿ V 92 designed Modem Ÿ Bluetooth in display bezel (select models) Ÿ Accelerometer / Shock Mounted Hard Drive Form Factor Ÿ Two spindle Ÿ 1. 8” HDD’s Ÿ Integrated touchpad Ÿ Slice dock to Port Replicator or Docking

Kabuki 3. 0 – X 61 s Offering Definition (Concept Exit) System is not. Kabuki 3. 0 – X 61 s Offering Definition (Concept Exit) System is not. . . System is. . . Form Factor Ÿ 12. 1" XGA TFT (150 nit) – Standard (275 g) & TMD (205 g) select models, or LED backlit display (185 g) Ÿ 2. 6 lbs; 10. 5” x 8. 3” x. 083 - 1. 1” Ÿ 2. 5” SATA HDDs; (SATA are Customer upgradeable) Ÿ 1 Spindle (HDD) Ÿ Think. Light (white ) Ÿ 4 cell prismatic, 4 cell cylindrical, 8 cell cylindrical Li. Ion Battery. Ÿ Battery life with ULV CPU, TMD or LED Display: Ÿ 3. 3 Hr (4 cell pris); 4. 4 hr (4 cell cyl); 8. 8 hr (8 cell cylindrical) Ÿ 2 nd Li. Ion Battery support (external battery pack on system or one bay battery option for Ultra. Base Dock) Ÿ ISO Standard full size keyboard (18. 5 mm pitch) Ÿ Trackpoint IV push-to-select ; In-line scroll/mag Ÿ 1 Think. Pad key + 3 audio keys; Ÿ Mono Speaker in system (0. 5 watt) Ÿ Integrated Microphone Ÿ Integrated dual band+ wireless antenna Ÿ Kensington lock Ÿ Fingerprint Reader (select models) Ÿ 802. 11 n(abg) MIMO wireless with 2 x 2, 2 x 3 capability Ÿ Integrated wireless WAN and WAN-ready (select models) Ÿ Optional K/S Ultrabase (Slice) (for optional 2 nd spindle) Ÿ 65 w AC Adapter Ÿ Ports on System/ Slice Ÿ 7 x USB 2. 0 ports (3 system, 4 slice) Ÿ 1 x T 2 PCMCIA Card. Bus/USB based Express. Card (System) Ÿ IEEE 1394 (system/) Ÿ RJ 11, RJ 45 Ÿ Parallel, Serial (Slice) Ÿ VGA (Both) Ÿ Headphone, Mic (Both) Ÿ Slice connector (System) Ÿ Warm/Hot swap bay (Slice) Ÿ Keylock/cable lock slot (Slice) Ÿ PATA bay support (Slice) Ÿ Compliance Ÿ TCG Compliant Secure Chip Crypto-3 (all models) Ÿ Energy. Star Ÿ Ro. HS Integrated Graphics for LV Ÿ Intel Calistoga GM/ ICH 7 core chipset with Integrated Graphics f/ULV Ÿ GEN 4 fx(DX 10) graphics Ÿ Intel Merom with EMT 64 T processors (dual core LV(800 MHz FSB, 15 W) and single core ULV (533 MHz FSB ) Ÿ DDR 2 -667 PC 2 5300 2 x SO-DIMM /4 GB max Ÿ 2 x Mini-PCIe Slot (WLAN, WAN) Ÿ x Cardbus/ Express. Card Universal slot (with support for Express. Card 1 34 mm via USB interface adapter card) 8 Planar Ÿ 10/100 Ethernet Ÿ Mini PCI slot Ÿ DVI on System/Slice Ÿ Discrete Graphics Ÿ 128 MB memory Ÿ TV Out (S-Video) Ÿ NV processors Ÿ Infrared Ÿ No TAA offering OS Support • See SW Support OD Ports Ÿ PS/2 Port (System) Ÿ FDD port connector Ÿ SPDIF (AC 3 audio) Ÿ Ultrabay 2000 Ÿ NEST Communications Calexico b Calexico-2 b/g, a/b/g Clymer b/g Bartlett a/b/g MDC I, II BMDC II, III UWB System Building Blocks (Tested thru SIT) CPU: Intel Merom L 7500 and L 7300, Yonah U 1400 ULV Panel: 12. 1” XGA TFT – Standard & TMD HDD: 40, 60, 80, 100, 120, 160 GB/ 5400 rpm (2. 5” SATA) 60, 100 GB 7200 (2. 5” SATA) WW Memory: 256 MB, 512 MB, 1 GB, 2 GB Mini. PCIe: Think. Pad Gwinett 802. 11 a/b/g, Think. Pad 802. 11 n(abg), Intel Kedron n(abg) and Kedron abg (with b/g sku’s for select countries only) , Golan abg Mini. PCIe: Verizon(EV-DO rev. A), Vodafone(HSDPA 3. 6), Cingular, TMobile, Telus CDC: Modem, Bluetooth Battery: 4 cell(prismatic), 4 cell (cyl), 8 cell (cyl) Operating Systems: XP Pro, Vista (Basic 32, Business 32/64, Ultimate 64) Ÿ Planar Ÿ Intel Crestline GM / ICH 8 M & ICH 8 M Enhanced core chipset with Ÿ Gigabit Ethernet LOM (all models) Ÿ 3 x USB 2. 0 Ÿ IEEE 1394 Ÿ 1 x SD slot Ÿ Soft audio / Microphone Ÿ TCG Compliant Secure Chip Crypto-3 (all models) Ÿ Wireless Upgradeable (all models) Ÿ V 92 designed Modem Ÿ Bluetooth in display bezel (select models) Ÿ Accelerometer / Shock Mounted Hard Drive Form Factor Ÿ Two spindle Ÿ 1. 8” HDD’s Ÿ Integrated touchpad Ÿ Slice dock to Port Replicator or Docking Red – Work Items Open Bay Odyssey Building Blocks (Tested thru SIT) HDD: 40, 60, 80, 100, 120, 160 GB/ 5400 rpm (2. 5” SATA) Memory: 512 MB, 1 GB, 2 GB Mini. PCIe: Think. Pad Gwinett 802. 11 a/b/g, Think. Pad 802. 11 n(abg), Intel Kedron n(abg) and Kedron abg (with b/g sku’s for select countries only), Golan abg Battery: 4 cell(pris), 4 cell (cyl), 8 cell (cyl) Operating Systems: XP Pro, Vista Dock/Slice: X 6 Ultra. Base (slice)

Sumo-3 X 61 – MTs 7673/7674 -Easy Access Elements (At Announce) Customer Feature Choice Sumo-3 X 61 – MTs 7673/7674 -Easy Access Elements (At Announce) Customer Feature Choice (CFC’s) Mandatory Select Lenovo Confidential Optional Select Ethernet (GB) Wireless • Wireless LAN Ready (Yes) • Wireless WAN (Yes/No) • Bluetooth (Yes/No) System HDD (2. 5”) « 40 GB/5400 « 60 GB/5400 « 80 GB/5400 « 100 GB/5400 « 120 GB/5400 « 160 GB/5400 « 100 GB/7200 « 60 GB/7200 Security Ÿ ESS Secure Chip (Yes) Ÿ Fingerprint Reader (Yes/No) CFC Memory Choices + Mandatory Select Filter Item Planar, Processor, 1394, SD Ÿ Merom T 5500 P NV DC ($195) Ÿ Merom T 7000 NV ($225) Ÿ Merom T 7300 NV ($275) + Battery «Li-ion 4 cell Cylindrical «Li-Ion 8 cell Cylindrical OS + Drivers + Utilities «Win XP Pro (SP 2) «Vista = Derived Shells All with 12. 1” TFT Ÿ TBD see initial Shell Plan Warranty / Service Offerings « 3 year depot (GAV/EZA) « 3 year on-site (GAV/EZA) « 4 year depot (MTM only) « 4 year on-site (MTM only) « 1 yr Express (GAV only) « 3 yr Express (GAV only) Expansion Memory «(256, 512, 1024 or 2048 MB Base Memory) «Plus(1 x SODIMM socket) Ø 0 Ø 256 MB Ø 512 MB Ø 1024 MB Ø 2048 MB « 4 GB Max Memory Additional Features Standard Feature Elements « 12. 1” XGA TFT «GB Ethernet «Utra. Connect Wireless Antenna «Secure Digital Slot « 3 x USB 2. 0 «AC Adapter (65 W) «APS « 1394 Mini PCIe «Wireless Upgradeable « 802. 11 abg (Golan) « 802. 11 a/b/g (Kedron) « 802. 11 a/b/g (Think. Pad) «Intel Kedron n (abg) «Think. Pad n (abg) Docking • X 6 Ultra. Base • UB 6 with DVD • UB 6 with Combo • UB 6 with Multi-Burner SW Applications • See Software Plan Accelerometer on every system Modem on every system Secure Chip on every system + Options (Easy Access Elements) See options plan Miscellaneous Options Red – Work Items 9

Kabuki-3 X 61 s -MTs 7666/7667 - Easy Access Elements (At Announce) Customer Feature Kabuki-3 X 61 s -MTs 7666/7667 - Easy Access Elements (At Announce) Customer Feature Choice (CFC’s) Mandatory Select Lenovo Confidential Optional Select Ethernet (GB) System HDD (1. 8” PATA) (Japan only Now removed) « 30 GB/4200 « 40 GB/4200 « 60 GB/4200 Wireless • Wireless LAN Ready (Yes) • Wireless WAN (Yes/No)) • Bluetooth (Yes/No) Security Ÿ ESS Secure Chip (Yes) Ÿ Fingerprint Reader(Yes/No)) CFC Memory Choices + Mandatory Select Filter Item Planar, Processor, 1394, SD Ÿ Yonah U 1400 ULV SC ($225) Ÿ Merom L 7300 , DC, GB ($265) Ÿ Merom L 7500 DC, GB ($295) + System HDD (2. 5” SATA) « 40 GB/5400 « 60 GB/5400 « 80 GB/5400 « 100 GB/5400 « 120 GB/5400 « 160 GB/5400 « 100 GB/7200 « 60 GB/7200 Battery «Li-Ion 4 cell Prismatic «Li-ion 4 cell Cylindrical «Li-Ion 8 cell Cylindrical OS + Drivers + Utilities «Win XP Pro (SP 2) «Vista = Derived Shells All with 12. 1” TFT Ÿ TBD see initial Shell Plan Warranty / Service Offerings « 1702 - 3 yr depot (GAV/EZA) « 1703 - 3 yr on-site (GAV/EZA « 4 year depot (MTM only) « 4 year on-site (MTM only) « 1 yr Express (GAV only) « 3 yr Express (GAV only) Expansion Memory «(256, 512, 1024 or 2048 MB Base Memory) «Plus(1 x SODIMM socket) Ø 0 Ø 256 MB Ø 512 MB Ø 1024 MB Ø 2048 MB « 4 GB Max Memory Standard Feature Elements Mini PCIe «Wireless Upgradeable « 802. 11 a/b/g (Kedron) « 802. 11 a/b/g (Think. Pad) «Intel Kedron n «Think. Pad n SW Applications • See Software Plan Docking • X 6 Ultra. Base • UB 6 with DVD • UB 6 with Combo • UB 6 with Multi-Burner Additional Features « 12. 1” XGA TFT «GB Ethernet «Utra. Connect Wireless Antenna (x 3) «Secure Digital Slot « 3 x USB 2. 0 «AC Adapter (65 W) «APS « 1394 Accelerometer on every system Modem on every system Secure Chip on every system + Options (Easy Access Elements) See options plan Miscellaneous Options Red – Work Items 10

SPEC Overview ( • Remark which “ CPU/ Intel chipset comparison) ” is defined SPEC Overview ( • Remark which “ CPU/ Intel chipset comparison) ” is defined in KS 2/ KS 3 notes. 11 • KS 2 support Yonah & Merom Processor.

SPEC Overview 1 (Basic function) KS 2 KS 3 Processor Yonah-2 M NV/LV/ULV Merom SPEC Overview 1 (Basic function) KS 2 KS 3 Processor Yonah-2 M NV/LV/ULV Merom NV/LV, 4 MB / 2 MB cache 667/533 MHz FSB Merom for Santa Rosa SV/LV, 4 MB / 2 MB cache 800 / 667 MHz FSB Chipset Calistoga- GM/ ICH 7 M Crestline/ ICH 8 M Memory 2 DIMM Slot (Max: 4 GB currently validated at 533 MHz only )) PC 2 -5300 (DDR 2 -677) 2 DIMM Slot (Max: 4 GB) PC 2 -5300 (DDR 2 -677) GRAPHIC Calistoga Integrated Graphics Crestline Integrated Graphics Audio AD 1981 HD AD 1984 On Board Ethernet Intel 82573 L Intel 82566 MM/MC IR One Port No USB 2. 0 x 3 ports, 4 portsin Slice PC Card Controller Ricoh R 5 C 843 Ricoh R 5 C 847 or better PC Card Slot T 2 x 1 with PCI Express Card USB signal capability Express Card Slot USB/ PCI, Slim (34) Express Card x 1 w/ adapter TCPA Atmel AT 97 SC 3203 (TPM 1. 2) Standard on planar Accelerometer G-Sensor ADI Finger Print Reader YES, by Model (UPEK) 12

SPEC Overview 2 (Subsystems) KS 2 KS 3 LCD 12. 1”XGA/ SXGA+ Integrated Dual-Band SPEC Overview 2 (Subsystems) KS 2 KS 3 LCD 12. 1”XGA/ SXGA+ Integrated Dual-Band Antenna Customized Bluetooth Antenna YES by Model on BDC card in LCD Asm WAN Antenna YES by Model FDD USB FDD support (option) HDD SATA I/F: 2. 5” SATA & 1. 8”PATA 5400 rpm: 40 GB/ 60 GB/ 80 GB/ 100 GB/120 GB 7200 rpm: 80 GB/ 100 GB SATA I/F: 2. 5” SATA 5400 rpm: 40 GB/ 60 GB/ 80 GB/ 100 GB/120 GB/160 GB 7200 rpm: 80 GB/ 100 GB Bay ODD PATA I/F: 8 x DVD-ROM (de-functioned Combo drive) 24 x 24 x 8 x DVD/CD-RW Combo Rambo 4 DVD-RW/CDRW Combo WLAN Intel 802. 11 a /b/g (Golan) Foxconn 802. 11 a/b/g (Gwinett) Foxconn 802. 11 a/b/g/draft n (Nelson) Support 2 X 3 MIMO, exclusive WWAN. Intel 802. 11 a/b/g (Golan) Intel 802. 11 a/b/g (Kedron) Intel 802. 11 a/b/g/ draft n (Kedron) Foxconn 802. 11 a/b/g (Gwinett) Foxconn 802. 11 a/b/g/draft n (Nelson) WWAN Verizon / Vodaphone / Cingular Modem/ Bluetooth 2 slots MDC 1. 5 MDC (Adonis) for all models BDC (Callisto) in LCD Asm w/ Bluetooth Antenna by Model 13

SPEC Overview 2 (Subsystems) KS 2 KS 3 Keyboard NMB/ Chicony Touchpad No Think SPEC Overview 2 (Subsystems) KS 2 KS 3 Keyboard NMB/ Chicony Touchpad No Think Light Yes (White) Battery Li- lon Battery 4 C, 4 P, 8 C 2 nd Battery (Bay Battery) Yes Long Life Battery (Extend) Yes Docking No Docking Support. Slice support AC Brick 65 w 14

SPEC Overview (X 6 Slice) 15 SPEC Overview (X 6 Slice) 15

3. WW Agency Approval plan 16 3. WW Agency Approval plan 16

WW Agencies Plan (KS-3) SIT Exit: 3/19/2007 SVT Exit: 4/27/2007 SOVP: 5/09/2007 Ann/ GA: WW Agencies Plan (KS-3) SIT Exit: 3/19/2007 SVT Exit: 4/27/2007 SOVP: 5/09/2007 Ann/ GA: 5/22/2007 Notes: 1. CB report and Simplified Chinese Manual are requested for CCC submission 2. Traditional Chinese Manual is requested for BSMI submission 17

4. Ro. HS Compliant Plan 18 4. Ro. HS Compliant Plan 18

Ro. HS Compliant plan 19 Ro. HS Compliant plan 19

5. New FRU/ CRU Plan 20 5. New FRU/ CRU Plan 20

FRU/ CRU Plan Common parts similar with KS 2, FRU is able to follow. FRU/ CRU Plan Common parts similar with KS 2, FRU is able to follow. Such as: LCD, HDD, KB, Adapter, P/C, MDC, B/T, WLAN, WWAN, Memory module, ODD, Battery. Below Mechanical parts needs assign new FRU, - Planar - Rear Cover - LCD Bezel - Keyboard Cover - Base Cover) - LCD FPC - FPR Board - WWAN Antenna 21

6. Supplier Selection Process 22 6. Supplier Selection Process 22

Supplier Selection Process Lenovo: • Buy/ Sell parts following Lenovo rule. Wistron determinable: • Supplier Selection Process Lenovo: • Buy/ Sell parts following Lenovo rule. Wistron determinable: • • • 23 Sourcer refer to Wistron QVL list Judge suppliers developing capability and production capacity to select candidates Release spec. requirement & RFQ to candidate suppliers Compare cost, experience and service Decide award suppliers Depends on demand to judge if need 2 nd or 3 rd source

Supplier Selection Process Current mechanical parts vendor candidates : 24 Supplier Selection Process Current mechanical parts vendor candidates : 24

7. EC Release Plan 25 7. EC Release Plan 25

EC Release Plan Based on KS-3 Schedule as of Jul. 14, 2006 26 Plan EC Release Plan Based on KS-3 Schedule as of Jul. 14, 2006 26 Plan Exit Pre-DV DV 1 DV 2 SIT SVT SOVP SS ANN/GA 08/18/2006 08/28/2006 - 09/11/2006 09/12/2006 - 10/30/2006 10/31/2006 - 12/18/2006 12/26/2006 - 02/26/2007 03/05/2007 - 03/30/2007 04/09/2007 04/23/2007 04/24/2007

8. Quality Development Process 27 8. Quality Development Process 27

Quality Dev. Processes Quality improvement activities are planned as follows: Maximize the common design Quality Dev. Processes Quality improvement activities are planned as follows: Maximize the common design for support new function - Follow the KS-1/2 design as much as possible, such as HDD/ Battery/ Slice support/ Keyboard e. t. c. - Minimize the modification for supporting new function - Improvement WWAN performance. - > LCD rear cover is common except MIMO support. - Support MIMO 3 rd antenna with WWAN. - > One new opening on LCD rear cover on top side. Other portion is same as KS-1. - Improvement palmrest thermal performance. - > New 2 nd FAN solution without any height change of Keyboard/ Bezzel/ Bottom case. 28

How to set design or quality criteria/targets Followed by KS-3 design target Thermal design How to set design or quality criteria/targets Followed by KS-3 design target Thermal design of Palmrest during communication <1> KS-1: No criteria during development phase during file transfer. Define the test procedure and criteria after SIT. -> Deviation. <2> KS-2: Improve thermal performance of Palmrest. <3> KS-3: Support 2. 5 W MIMO without deviation. - 2 nd FAN solution for palmrest. WWAN performance - KS-1/2 WWAN performance is not so good. And carrier will not allow this performance on KS-3 will use new WWAN antenna concept, Rod Antenna. It will be met the carrier’s required performance. MIMO + WWAN support - 29 KS-1 does not support MIMO. KS-2 supports MIMO without WWAN. KS-3 will support MIMO with WWAN. - 3 rd antenna for support MIMO.

KS Note-3 DPR Planar Design/Layout w/Lesson Learned Jacky Chang 2006/08/02 KS Note-3 DPR Planar Design/Layout w/Lesson Learned Jacky Chang 2006/08/02

Agenda • System Block Diagram • Component Layout • Lesson Learned 31 Agenda • System Block Diagram • Component Layout • Lesson Learned 31

Kabuki/Sumo 3 System Block Diagram ver 0. 2 Keyboard Light SMBus Intel Merom NV/LV/ULV Kabuki/Sumo 3 System Block Diagram ver 0. 2 Keyboard Light SMBus Intel Merom NV/LV/ULV Processor Clock Generator CKEX 505 (MLF 64) Reserved Bluetooth Finger Print USB Conn-3 Media Slice USB-HUB CRT CH-0 CH-2 CH-4 SATA HDD CH-5 CH-6 CH-7 ATA/100 HDD Subcard CH-8 CH-9 SPI Ultra Slim Bay USB MAX 3243 Super I/O NS PC 87392 Parallel CRT LPC Bridge Winbond WPCN 385 TCPA Chip SD Slo t Head Micro Stereo Speaker phone Thermal Sensor MAX 6602 IR USB (x 1), IDE, LPC, CRT, RJ 11, RJ 45, CD Audio In, Speaker Out, Mouse, Keyboard, 2 nd Batt. Robson Mini Card Wireless WAN Mini Card Mouse KBD I/F Mono Speaker (0. 5 W) USB CH 2 Gb. E Intel RU 82566 MM RJ 45 Switch Internal Mic Head Micro phone APS sensor Media Slice DC-IN (x 1) GLCI/LCI Azalia Codec AD 1984 139 4 Embedded Controller FAN Media Slice Connector RJ 11 RJ 45 R 5534 V LPC Bus 33 MHz USB CH 6 (x 1) Audio AMP MAX 9789 A Second Battery USB Hub SMSC USB 2504 USB Card Bus Ricoh R 5 C 847 CB/US B Slot SPI G/A ATA 100 MDC PCI Bus 33 MHz PCI Express 6 Ports Azalia Intel ICH 8 -M Li Battery 802. 11 a/b/g 802. 11 n Mini Card Wireless WAN Antenna SMBus USB CH 3 ATMEL SMBus AT 8356908 Power Button 32 SATA RJ 11 Optional SO DIMM (x 1) Thermal Sensor LM 75 USB 2. 0 x 10 Ports CH-3 802. 11 a/b/g Antenna Optional SO DIMM (x 1) Dual channel DDR-II SO 667/533 MHz DIMM DMI X 2/X 4 Analog RGB Switch CH-1 CS-2 X Media Slice Serial Intel Crestline (Int. GFX) CRT I/F for Slice USB Conn-1 USB Conn-2 Mini. Card Ricoh R 5 C 843 Reserved USB New Device PSB 800/667 MHz INVERTER DC-IN Internal Connector u. FCBGA 12. 1" XGA LCD Bluetooth Antenna External Connector Thermal Sensor LM 26 RJ 45 Port RJ 45 for SLICE CPU VR Intel IMVP-VI DC-DC Converter (G/A) MAIN BATTERY Second Battery

Component Layout • Component Layout on TOP side • Component Layout on BOTTOM side Component Layout • Component Layout on TOP side • Component Layout on BOTTOM side 33

Component Layout on TOP side CPU VR Intel IMVP-VI LCD CONN RTC BAT Track Component Layout on TOP side CPU VR Intel IMVP-VI LCD CONN RTC BAT Track Point KB CONN SIO DCDC area KBC PCMCIA / Card. Bus USB Express Card Finger print Robson 2 nd FAN On board WLAN MDC Speaker 34 WWAN Robson INT MIC Ir. DA

Component Layout on BOTTOM side BAT Conn HDD Card Conn CPU VR USB Intel Component Layout on BOTTOM side BAT Conn HDD Card Conn CPU VR USB Intel IMVP-VI Slice Conn CPU CRT Merom RJ 45 Audio DCDC area Jacks USB 1394 DDR 2 SO-DIMM Socket Crestline GFX VR ICH-8 M MAX 9789 A AD 1984 RINKAN SIM conn PMH 7 SPI CLKGEN R 5534 V R 5 C 847 Flash Wireless Disable SW 35 North Bridge SD Socket Gb. E

Lesson Learned from KS Note-1 • • Name: 77328 f_1 Abstract: W 2 K: Lesson Learned from KS Note-1 • • Name: 77328 f_1 Abstract: W 2 K: USB Rambo can't be recognized when hot-undock on slice [Problem Description] Self-powered Sony Rambo Drive can not be recognized if this ODD has been attached before Hot-Dock action. [Root Cause] • Some leakage current may come from external USB device via USB data signals (USB_D+/D-) if the external USB device is self-powered. In this case, the measured voltage on USB_D+ is 1. 2 V. • If Media Slice in power-off state and some leakage current on USB data signals, the leakage current will go through SMSC USB 2504 to the VDD power rail. In this case, the measured voltage on VDD power rail is 0. 95 V. • In KS-1 Media Slice, RC circuit is used to generate a RESET# signal for USB 2504. And RC circuit is tied to VDD at 0. 95 V level. But RESET# must be less than 0. 8 V for 1 us. • Therefore, “USB 2504 is not reset well!!” 36

Root Cause VCC 3_USB_HUB 0. 95 V 1. 2 V 0. 95 V RESET# Root Cause VCC 3_USB_HUB 0. 95 V 1. 2 V 0. 95 V RESET# SMSC USB 2504 USB_D+/D- USB 2504 is not reset well!! 37 USB Device

Long-term solution VCC 3_USB_HUBPWR 0. 95 V 1. 2 V 0 V 38 RESET# Long-term solution VCC 3_USB_HUBPWR 0. 95 V 1. 2 V 0 V 38 RESET# SMSC USB 2504 USB_D+/D- USB Device

Preventive Action • • Leakage current on USB port has not been checked before. Preventive Action • • Leakage current on USB port has not been checked before. Afterwards, external self-powered USB device will be checked while the system is at Power-off state by the following table. (Sony USB Rambo: DRX-810 UL) Follow the essence of DQC E 12 -3: Planar Overall – Legacy 2. 04 A Power-on printer CRT and/or EXT power supply Attached to IO Ports at Power-off With Media Slice S 4/5 USB_D+ USB_DVBUS VDD (Host Controller) 39 S 3 Without Media Slice S 4/5 S 3

Cut-in Schedule 40 Cut-in Schedule 40