Developing a Design Simulation Framework A Workshop with CPDA s

Developing a Design/Simulation Framework A Workshop with CPDA's Design and Simulation Council April 6, 2005 Atlanta, Georgia www. cpd-associates. com Backup Slides Achieving Fine-Grained CAE-CAE Associativity via Analyzable Product Model (APM)-based Idealizations Topic Area: Design-Analysis Interoperability (DAI) Russell. Peak@marc. gatech. edu http: //www. marc. gatech. edu/ http: //eislab. gatech. edu/projects/ Synopsis: This talk overviews a simulation template methodology based on analyzable product models (APMs) that combine design information from multiple sources, add idealization knowledge, and bridge semantic gaps to enable advanced DAI. Copyright © All Rights Reserved. Permission to reproduce and distribute without changes for non-commercial purposes (including internal corporate usage) is hereby granted provided this notice and a proper citation are included.

Constrained Objects: A Knowledge Representation for Design, Analysis, and Systems Engineering Interoperability Students: Manas Bajaj, Injoong Kim Faculty: Russell Peak, Miyako Wilson Chip Package Stress Analysis Template Objectives Contributions & Benefits Develop better methods of capturing engineering knowledge that : Are independent of vendor-specific CAD/CAE/SE tools Support both easy-to-use human-sensible views and robust computer-sensible formulations in a unified manner Handle a diversity of product domains, simulation disciplines, solution methods, and leverage disparate vendor tools Apply these capabilities in a variety of sponsor-relevant test scenarios: Proposed candidates are templates and custom capabilities for design, analysis, and systems engineering To Scholarship Develop richer understanding of modeling (including idealizations and multiple levels of abstraction) and representation methods To Industry Better designs via increased analysis intensity Increased automation and model consistency Increased modularity and reusability Increased corporate memory via better knowledge capture Constrained Object (COB) Formulations Approach & Status Collaboration Needed Approach Extend apply the constrained object (COB) representation and related methodology based on positive results to date Expand within international efforts like the OMG UML for Systems Engineering work to broaden applicability and impact Status Current generation capabilities have been successfully demonstrated in diverse environments (circuit boards, electronic chip packages, airframes) with sponsors including NASA, Rockwell Collins, Shinko (a major supplier to Intel), and Boeing. Templates for chip package thermal analysis are in production usage at Shinko with over 75% reduction in modeling effort (deformation/stress templates are soon to follow) Additional Information: 1. http: //eislab. gatech. edu/projects/ 2. Response to OMG UML for Systems Engineering RFI: http: //eislab. gatech. edu/tmp/omg-se-33 e/ 3. Characterizing Fine-Grained Associativity Gaps: A Preliminary Study of CAD-E Model Interoperability http: //eislab. gatech. edu/pubs/conferences/2003 -asme-detc-cie-peak/ Support for 1 -3 students depending on project scope Sponsor involvement to provide domain knowledge and facilitate pilot usage XML UML COB-based Airframe Analysis Template 2

Standards-based Simulation Templates for Electronics AP 210 -based PCB Stackup Design and Warpage Analysis Students: Manas Bajaj, Injoong Kim Objectives Develop methodology for information-hungry analysis templates to leverage rich product models Application: Enable detailed thermo-mechanical warpage of printed circuit boards (PCBs) Implement the methodology as automated design, analysis and enrichment activities in standards-based engineering frameworks Approach & Status Approach Use STEP AP 210 -based electronics product model for high fidelity representation of the PCB geometry Identify key design aspects (stackup, metallization features, etc. ) that concern warpage behavior of PCBs Evaluate warpage vulnerability of PCBs: locate deformation “hot-spots” and suggest design improvements Status Completed prototype implementation with initial idealizations (including COTS tool web services) Under development: next level of idealizations Project seed funding provided by NIST Collaborators: Akro. Metrix, Inter. CAX/LKSoft, Rockwell Collins Publications Zwemer, D. , Bajaj, M. , Peak, R. S. et al. , PWB Warpage Analysis and Verification Using an AP 210 Standards-based Engineering Framework and Shadow Moiré. To be presented at Euro. Sim. E 2004 (May, 2004) Brussels. http: //eislab. gatech. edu/projects/nist-warpage/ Faculty: Russell Peak, Miyako Wilson Contributions & Benefits To Scholarship Develop smart, custom algorithms for processing, analyzing and deducing complex thermo-mechanical behavior of PCBs at different stages of their life cycle To Industry Richer design and analysis models in PLM contexts Ability to publish behavioral design requirements for PCBs to circuit board manufacturers without sharing proprietary assembly processes Increased yield and quality, and reduced costs Collaboration Needed Explore possibilities of integrating efficient knowledge management, smart product representation to support detailed design-analysis integration as a part of standards-based engineering framework Support for 1 -3 students depending on project scope STEP AP 210 -based Manufacturable Product Model 1 3 Multi-Representation Architecture Template for Model Transformation Analysis Building Block Model Warpage Profile …… 2 3

Knowledge-based FEA Modeling Electronic Chip Package Applications Students: Sai Zeng, Injoong Kim Faculty: Russell Peak, Miyako Wilson, Robert Fulton Objectives Contributions & Benefits Provide seamless integration between design and analysis in distributed environments To Scholarship Integration method to bridge systems across disciplines, domains, and functions within PLM environments To Industry Automated FEA modeling process for chip package design Reduced FEA modeling time from days/hours to minutes Increase knowledge capture during integration Enhance FEA model generation and reusability Approach & Status Collaboration Needed Approach Perform systematic process design Capture analysis concepts as rich, reusable information models Deploy web services Status Completed for chip package manufacturer (Shinko) Software tool In production usage Usage extension in additional organizations Development to extend beyond chip package applications Support for 1 -3 students depending on project scope Additional information: http: //eislab. gatech. edu/projects/shinko/ 182 input bodies Auto-Chopping Tool Usage View Example Chip Package Products 9056 decomposed bodies 4

VTMB = variable topology multi-body technique [Koo, 2000] Pilot & Initial Production Usage Results Product Model-Driven Analysis u u Reduced FEA modeling time > 10: 1 (days/hours minutes) References [1] Shinko 5/00 (in Koo, 2000) Reduced simulation cycle > 75% [2] Shinko evaluation 10/12/00 Enables greater analysis intensity Better designs Leverages XAI / CAD-CAE interoperability techniques – Objects, Internet/web services, ubiquitization methodology, … 5

Knowledge Representation Elements Structure/Content Definition Languages Graphical Representations Knowledge Representation Meta-Model Protocol Operations/Methods 6

COB Modeling Languages Lexical and Graphical Formulations Structure Level (Template) Instance Level OWL, XML, and UML formulations are envisioned extensions 7

COB Structure: Graphical Forms Tutorial: Triangle Primitive a. Shape Schematic-S c. Constraint Schematic-S b. Relations-S Basic Constraint Schematic-S Notation d. Subsystem-S (for reuse by other COBs) Aside: This is a “usage view” in AP 210 terminology (vs. the above “design views”) 8

COBs as Building Blocks Tutorial: Triangular Prism COB Structure a. Shape Schematic-S c. Constraint Schematic-S b. Relations-S e. Lexical COB Structure (COS) COB triangular_prism SUBTYPE_OF geometric_shape; length, l : REAL; cross-section : triangle; volume, V : REAL; RELATIONS r 1 : " == * "; END_COB; d. Subsystem-S (for reuse by other COBs) 9

Example COB Instance Tutorial: Triangular Prism Constraint Schematic-I Lexical COB Instance (COI) example 1, state 1. 1 state 1. 0 (unsolved): INSTANCE_OF triangular_prism; cross-section. base : 2. 0; cross-section. height : 3. 0; length : 5. 0; volume : ? ; END_INSTANCE; Basic Constraint Schematic-I Notation state 1. 1 (solved): INSTANCE_OF triangular_prism; cross-section. base : 2. 0; cross-section. height : 3. 0; cross-section. area : 3. 0; length : 5. 0; volume : 15. 0; END_INSTANCE; 10

Convergence of Representations Software Development Database Techniques (algorithms …) (data structure, storage …) Flow Charts ER OMT EER STEP Express UML Constrained Object - like Representations Objects COBs, OCL, . . . Constraint graphs Rules Artificial Intelligence & Knowledge-Based Techniques (structure combined with algorithms/relations/behavior) 11

Parametric Diagram Firing Range Cannon Example From: Sys. ML Specification v 0. 3 (Draft 2004 -01 -12) p 66 Standardization of COB Concepts and Notation In Sys. ML 12

Contributing COB Concepts to Sys. ML Parametric Diagrams Tutorial Example: Elementary Spring Classical COB Representation Sys. ML Parametric Diagram Draft 2003 -12 from Alan Moore (www. artisansw. com) and Sandy Friedenthal (LMCO) 13

Two Spring System Example as Sys. ML Parametric Diagram Draft 2003 -12 from Alan Moore (www. artisansw. com) and Sandy Friedenthal (LMCO) 14

Constrained Object (COB) Representation Current Technical Capabilities - Generation 2 u Capabilities & features: – Various forms: computable lexical forms, graphical forms, etc. » Enables both computer automation and human comprehension – Sub/supertypes, basic aggregates, multi-fidelity objects – Multi-directionality (I/O changes) – Reuses external programs as white box relations – Advanced associativity added to COTS frameworks & wrappers u Analysis module/template applications (XAI/MRA): – – – Analysis template languages Product model idealizations Explicit associativity relations with design models & other analyses White box reuse of existing tools (e. g. , FEA, in-house codes) Reusable, adaptable analysis building blocks – Synthesis (sizing) and verification (analysis) 15

Constrained Objects (cont. ) Representation Characteristics & Advantages - Gen. 2 u Overall characteristics – Declarative knowledge representation (non-causal) – Combining object & constraint graph techniques – COBs = (STEP EXPRESS subset) + (constraint graph concepts & views) u Advantages over traditional analysis representations – Greater solution control See A for dvanc – Richer semantics Gen ed T (e. g. , equations wrapped in engineering context). 3 E o xten pics – Unified views of diverse capabilities (tool-independent) sion s – Capture of reusable knowledge – Enhanced development of complex analysis models u Toolkit status (Xai. Tools v 0. 4) – Basic framework, single user-oriented, file-based 16

COB-based Constraint Schematic for Multi-Fidelity CAD-CAE Interoperability Flap Link Benchmark Example 17

FEA-based Analysis Subsystem Used in Linkage Plane Stress Model (2 D Analysis Problem) Higher fidelity version vs. Linkage Extensional Model ABB SMM Template 18

SMM with Parameterized FEA Model Flap Link Plane Stress Model Preprocessor Model Figure ANSYS Prep 7 Template @EX 1@ = Parameters populated by context ABB !EX, NIUX, L, WS 1, WS 2, RS 1, RS 2, TS 1, TS 2, TW, TF, WF, FORCE. . . /prep 7 ! element type et, 1, plane 42 ! material properties mp, ex, 1, @EX@ mp, nuxy, 1, @NIUX@ ! geometric parameters L = @L@ ts 1 = @TS 1@ rs 1 = @RS 1@ tf = @TF@. . . ! elastic modulus ! Poissons ratio ! ! length thickness of sleeve 1 radius of sleeve 1 (rs 1

COB-based Constraint Schematic for Multi-Fidelity CAD-CAE Interoperability Flap Link Benchmark Example 20

Flap Linkage Torsional Model Diverse Mode (Behavior) vs. Linkage Extensional Model 21

Short Course: Using Standards-based Engineering Frameworks for Electronics Product Design and Life Cycle Support 22

Optimization Knowledge Graphs for Next-Generation PLM Customer/Acquisitions … Abstraction Level … Systems Engineering … … Legend Human Interfaces Structures Electronics Software Requirements Model interfaces: Fine-grained associativity relations among domain-specific models and system-level models … … … Development Process Rich models: Information objects Parametric relations Optimization clusters: “Systems of systems” model subgraphs for finding satisficing solutions … Domain 2004 -09 Models of varying abstractions and domains After Bajaj, Peak, & Waterbury 2003 -09 23

Towards Standards-based PLM Frameworks Model-centric view (vs. Tool-centric view) Electrical CAD Tools Traditional Tools Mechanical CAD Tools Systems Engineering Tools Eagle Pro/E Doors Mentor Graphics CATIA AP 210 … Slate AP 203, AP 214 AP 233, Sys. ML Collective Product Model Standards-based Submodels AP 210 Gap-Filling Tools Xai. Tools PWA-B AP 2 xx pgef PWB Stackup Tool, Engineering … Framework Tool Building Blocks: • Information models & meta-models • International standards • Industry specs • Corporate standards • Local customizations • Modeling technologies: • Express, XML, UML, OWL, COBs, … EPM, LKSoft, … STI, … STEP-Book AP 210, SDAI-Edit, STI AP 210 Viewer, . . . Instance Browser/Editor 24

A Process Perspective Product Perspective Process = Order in which Relationships are Applied Source: Chris Paredis, 2004 25

Next-Generation PLM/SLi. M Framework PLM/SLi. M = Product/System Lifecycle Mgt. Source: Chris Paredis, 2004 26

COB-based Representation & Associativity for all Lifecycle Models Application to DH Brown’s “ 12 -Fold Way” Legend COB-based models: Information objects Parametric relations Model interfaces: Macro-level associativity Micro-level associativity 27

Security Center Dashboard Overall Status of Key Systems Main Terminal System Status Crowd Controls Passenger Screening Cargo Screening Communication Systems Electrical Systems HVAC Systems Chemical Detection Biological Detection … … Source: Russell. Peak@marc. gatech. edu 2003 -04 -24 28

Enabling Next-Generation Model-Based Security (MBS): Complex System Representation & Model Interoperability Hartsfield International Airport (HIA) Security Scenarios Utilizes generalized MRA terminology (preliminary) Source: Russell. Peak@marc. gatech. edu 2003 -04 -24 29

Abstract STEP, XML, and UML: Complementary Technologies One important aspect of product lifecycle management (PLM) is the computer-sensible representation of product information. Over the past fifteen years or so, several languages and technologies have emerged that vary in their emphasis and applicability for such usage. ISO 10303, informally known as the Standard for the Exchange of Product Model Data (STEP), contains the high-quality product information models needed for electronic business solutions based on the Extensible Markup Language (XML). However, traditional STEP-based model information is represented using languages that are unfamiliar to most application developers. This paper discusses efforts underway to make STEP information models available in universal formats familiar to most business application developers: specifically XML and the Unified Modeling Language™ (UML®). We also present a vision and roadmap for future STEP integration with XML and UML to enable enhanced PLM interoperability. http: //eislab. gatech. edu/pubs/conferences/2004 -asme-detc-lubell/ Extended version in JCISE December 2004 issue: http: //eislab. gatech. edu/pubs/journals/2004 -jcise-peak/ Notice: Commercial equipment and materials are identified in order to describe certain procedures. Some slides include product names for example purposes only (i. e. , to help clarify the concepts presented via specific instances). In no case does such identification imply recommendation or endorsement by the authors or their organizations, nor does it imply that the materials or equipment identified are necessarily the best available for the purpose. Unified Modeling Language, UML, Object Management Group, OMG, and XMI are trademarks or registered trademarks of the Object Management Group, Inc. in the U. S. and other countries. Java is a trademark or registered trademark of Sun Microsystems, Inc. Other company, product, and service names may be trademarks or service marks of others. 30

Primary Information Representation Technologies for Standards-based PLM Frameworks Information Modeling Implementation Methods Standardized Content (STEP Part 11) 31

STEP, XML, UML Capabilities regarding Engineering/Technical Domains Characteristic Aspect Classical STEP Information Modeling Capability: Popularity: Implementation Methods Capability: Popularity: Standardized Breadth: Content Depth/Richness: Coordination: Usage: High (+) u Narrow u High (-) u Narrow: preweb u High u Broad (MCAD), plus Limited / Emerging (others) u Note: “Next-wave STEP” is adding XML and UML implementation methods (a. k. a. Parts 28 and 25) XML UML High (-) u High u Medium+ u Low (islands) u Broad (some), plus Emerging u High (-) u High u Medium (s/w+) u Medium+ u Medium u Broad (some), plus Emerging u Complementary Strengths 32

“STEP on a Page” Application Protocols (APs) Source: “STEP on a Page” by Jim Nell. 2003 -April-07 version. http: //www. mel. nist. gov/sc 5/soap/ p. 1 of 3 33

STEP on a Page - IRs, etc. 34

STEP on a Page - App. Modules (AMs) 35

What is the context of Systems Engineering? User/Owner/Operator Management Marketing Acquisition Authority Business Strategy Concept RFP Proposal Systems Engineering Management Info Contract Management Info Specifications Digital Chemical Maintenance Mechanical Communications 2002 -04 - Mike Dickerson, NASA-JPL Civil STEP ISO SC 4 Logistics Controls Electrical UML ISO SC 7 Software Engineering Disciplines Manufacture 36

Complementary Usage of STEP, UML, and XML for Systems Engineering: Envisioned AP 233 -Sys. ML Relationship Source: www. Sys. ML. org 2003 -12 37

AP 212: Electrotechnical Design and Installation Electrotechnical Systems • Buildings • Plants • Transportation Systems Equipment Coverage • Power-transmission • Power-distribution • Power-generation • Electric Machinery • Electric Light and Heat • Control Systems Data Supporting • Terminals and Interfaces • Functional Decomposition of Product • 3 D Cabling and Harnesses • Cable Tracks and Mounting Instructions Electrotechnical Plant • Plant, e. g. , Automobile • Unit, e. g. , Engine Control System • Subunit, e. g. , Ignition System Electrotechnical Equipment in Industry 38

The Cable/Harness Problem 2003 -11 - from Northrop Grumman Corp. (NGC) Need to coordinate E-MCAD designs, … MCAD (UG) ECAD (LCable**, Capital. H, …) ? ? ? ? In collaboration with www. Inter. CAX. com 39

Sample Solution Elements LKSoft IDA-STEP and related AP 212 converters (EPLAN, Lcable, …) n Possible extensions to fulfill particular company needs w Ex. - merging/difference tool n AP 212 standard: www. ap 212. org ECAD Cable/Harness Tools (e. g. EPLAN, LCable) AP 212 model interaction in IDA-STEP v 1. 3. 1 In collaboration with www. Inter. CAX. com 40

AP 214: Core Data for Automotive Mechanical Design Processes Geometry • Solids Data • Surface Data • Wireframe • Measured Data Pro. STEP Presentation • Drawing • Visualization Manufacturing Analysis • NC-Data • Process Plans • Simulation Technology Data Specification/Configuration • Product Structure Data • Management Data • Material Data • Form Features • Tolerance Data • Surface Conditions 41

IDA-STEP Overview Example end-user tool for viewing and editing rich product models in an open standards-based PLM environment u IDA-STEP Viewer (v 1. 2 - May, 2004 - free download) – Supports AP 203, AP 212, AP 214 – Downloadable from www. ida-step. net u IDA-STEP Center version – Adds editing and transformation/export capabilities – Supports repository interfaces 42

Linking Intelligent 3 D with Product Structure 43

Process Plan - Tree Read Only, data generated in e. M-Planner. TM / Tecnomatix 44

Linking Intelligent 2 D (e. g. Factory Layout) with Product Structure 45

Example Features and Usage of Standards-based Tools for Rich Product Models (IDA-STEP v 1. 2) u u u u AP 203, AP 212, AP 214 and PDM-Schema support Viewing 2 D & 3 D geometry and intelligent schematics Creation and editing of rich PLM information Single user versions (PC, Workstation) Multi-user environments: STEP database using My. SQL and Oracle Target Usage Standards-based PLM for SMEs Prime-SME collaboration via rich product models The Adobe Acrobat / pdf equivalent for rich product models 46