Скачать презентацию DAC 99 Panel Proposals 506 507 509 Andrew Скачать презентацию DAC 99 Panel Proposals 506 507 509 Andrew

8b10363f33159a8f53f69f2b7f7036d8.ppt

  • Количество слайдов: 8

DAC 99 Panel Proposals 506, 507, 509 Andrew B. Kahng January 14, 1999 DAC 99 Panel Proposals 506, 507, 509 Andrew B. Kahng January 14, 1999

Cell Libraries - Build vs. Buy, Static vs. Fluid • Background • cell libraries Cell Libraries - Build vs. Buy, Static vs. Fluid • Background • cell libraries determine ASICdie size, performance, power • factors: routing access/pitch, drive strengths, common logic functions, … • choices: silicon vendor (cost, comfort), 3 rd-party (migration, better capacity-to-cost), internal (control, as well as project-specific, on-the-fly) • key questions: (1) pros and cons of different libraries, library sources? (2) technical and business criteria for library strategy? (3) business and technology trends that will change/improve libraries in future? • interests: users, library vendors, silicon foundries, EDA • Structure • (10) moderator: cell libraries’ role in design flow; alternatives • (35) panelists: best source of libraries for different customer types; own library strategy; what to consider/measure in selecting library • (30) moderated discussion; (15) audience Q&A

Cell Libraries - Build vs. Buy, Static vs. Fluid • Panel Composition – Organizer: Cell Libraries - Build vs. Buy, Static vs. Fluid • Panel Composition – Organizer: Emil Girzcyc, ex-Cadabra – Moderator: Kurt Keutzer, UC Berkeley – – – – Jeff Lewis VP Mktg, Artisan ((free) library vendor) Martin Lefebvre President, Cadabra (build your own library to fit product) Kurt Wolf Dir Mktg for EDA / library relationships, TSMC (foundry) Tony Waitz Dir Library Development, Synopsys (service + EDA tools i/f) Jeff Burns IBM Austin (dynamic, on-the-fly libraries for max perf) Dave Pietromonaco Eng Mgr internal cell library group, HP (system house) Jay Maxey MTS, TI (silicon vendor provides process-tuned lib, correctness)

Design-Manufacturing Interface in DSM Era: Is Tech-Independent Design Dead? • Background • process capability Design-Manufacturing Interface in DSM Era: Is Tech-Independent Design Dead? • Background • process capability (gates, interconnect) must be abstracted, consistent with design parameters and complexity of (e. g. , SOC) design tasks • factors: reuse and increasing role of foundries for complex SOCs; shrinking design and yield ramp-up times (TTM); reality of design and showstoppers in design for leading-edge technologies • key questions: (1) how to design cell/IP libraries? (2) design for a technology that is being developed? (3) what design flow minimizes iterations? (4) can one design robustly enough to be immune to technology changes? (5) how to take interconnect into account in SOC? • interests: IDMs, ASIC, foundries, fabless, CAD

Design-Manufacturing Interface in DSM Era: Is Tech-Independent Design Dead? • Structure • (30) moderator Design-Manufacturing Interface in DSM Era: Is Tech-Independent Design Dead? • Structure • (30) moderator and panelists: 5 -minute statements of perspectives – designer (both SOC and high-perf microprocessor) – foundry (hand-off issues) – 3 rd-party library vendor (process-specific cell library design) – analysis tool vendor (interconnect challenges) – process modeling, yield learning (examples of des-mfg I/F in action) • (60) moderated and audience Q/A

Design-Manufacturing Interface in DSM Era: Is Tech-Independent Design Dead? • Panel Composition – Organizer Design-Manufacturing Interface in DSM Era: Is Tech-Independent Design Dead? • Panel Composition – Organizer and Moderator: Andrzej Strojwas, CMU – Joseph Borel Exec VP R&D, ST Microelectronics (requirements for SOC and concurrent technology / library design issues) – M. Kakumu GM, Custom LSI/ASIC Div, Toshiba (interplay (e. g. , yield ramping) between design and process) – John Kibarian Pres/CEO, PDF Solutions (real-life yield ramp / des cycle) – Resve Saleh Chaiman, Simplex (role of interconnect in design cycle) – Mark Templeton Pres/CEO, Artisan (need to tune IP libs to DSM process) – Ping Yang VP Design Services, TSMC (foundry viewpoint, design rule reqs for conservative and aggressive design scenarios)

Parasitic Extraction Accuracy: How Much Is Enough? • Background • how does the designer Parasitic Extraction Accuracy: How Much Is Enough? • Background • how does the designer choose the parasitic extraction solution that is best for the design? where should effort be spent? • example perspectives: – 3 -D, silicon-exact accuracy is always essential – accuracy requirement is determined by the overall design process and is less than you think – methodology (e. g. , net filtering from upstream analyses) efficiently provides the required accuracy • key questions: (1) how much accuracy is really necessary? (2) how to reconcile accurate extraction with process variations? (3) where is/should parasitic extraction be used and how important are speed, resource reqs? (4) other (inductance? relative vs. absolute? floating vs. grounded? …) • Structure • short statements (background, perspective as to key issues), mostly Q/A

Parasitic Extraction Accuracy: How Much Is Enough? • Panel Composition – Organizers: Mark Basel, Parasitic Extraction Accuracy: How Much Is Enough? • Panel Composition – Organizers: Mark Basel, Cadence and Paul Franzon, NCSU – Moderator: Paul Franzon, NCSU – Mark Basel Architect, Cadence (what is the meaning of accuracy? larger picture: combination with other analyses in a PV methodology) – Ron Preston Circuit designer, Compaq Alpha (extraction requirement from circuit designer’s perspective) – Robin Sarma TCAD support, TI DSP group (absolute accuracy is not the only way to achieve desired results – Marty Walker VP Eng, Frequency (accurate extraction is essential) – Sharad Mehrotra CAD R&D, IBM Austin (captive CAD perspective)