Building a world without wires October 6 2000

Building a world without wires! October 6, 2000 Kichul Chang Principal Engineer LG Innotek Co. , Ltd. kcchang@lginnotek. com http: //carpc. co. kr

AGENDA n Bluetooth Introduction n Future of Bluetooth n Market Overview n Chipset & Module Trend n Conclusion

Bluetooth Introduction

Bluetooth Vision n The best low-cost radio link technology n Perfect for mobile devices – small, low power, and low cost, but good performance n Open, royalty free specification Cable Replacement Landline Data/Voice Access Points Personal Ad-hoc Connectivity -3 -

Bluetooth SIG History n Ericsson Invented the Concept - '94 n Invited Other Industry Leaders to Help Develop the Concept - '97 n Technology Announced - May '98 n Nine Lead Promoter Companies - Ericsson, Nokia, Toshiba, Intel, IBM - Microsoft, Motorola, 3 Com, Lucent (Dec '99) n Unprecendented Industry Acceptance of the Bluetooth Wireless Technology - Over 2000 Adopter and Associate Companies Have Joined the SIG! - Many Market Segments and Usage Models Have Been Defined n v 1. 0 Specification Published - July '99 n v 1. 0 b Update Published - Dec '99 n v 1. 1 Update will be Published - Nov '00 - New Member Web-Site Opened (http: //www. opengroup. org/bluetooth) n Products Are Starting to Enter the Market Now - Mobile Phones, Headsets, Mobile PCs, Data Access Points -4 -

Korean SIG Members n Total 62 Company/University/Institute (19/July/'00) n About 200+ Companies participate in Bluetooth Developments. n Main Application is Mobile Phone and Accessary • Advanced Semiconductor Business Inc. • Belco International Co. , Ltd • Bellwave, Inc. Bellwave, • C&S Technology • Commax. co. ltd • Cyberbank • D. O. Tel • Dacom Corp • Daewoo Telecom LTD • DAIC Microsystems • Doshin Electroniks Corp. • Dream. Tel • DSI Inc. • EST(Embedded Solution Technology Inc. ) • ETRI • Flinston • Gmate, Inc. / ASIC design Lab. Gmate, • Hanchang Corp • Hansei University • HASSNet • HC Telecom Co. , Ltd. • Hutel Inc. • IWingz • JATY ELECTRONICS CO. , LTD • Joohong Information and communication • JTEL Co. Ltd • Keti • Ki. Ryung Electronics Co. , Ltd • Korea Electronics Technology Institute • Kortronics Enterprise Co. , Ltd • LG Electronics Inc. / Media-Communication Lab. • LG Information & Communications, Ltd • LG Innotek Co. , Ltd. • LG Telecom • Maxon Electronics • Miengine • MMC Technology, Inc. • N 3 Technologies Inc • Navtron • Netnaru Ltd. • Nexcell Telecom CO, Ltd • Nong Shim Data System Co, Ltd. • Nu. Ark Co. , Ltd. • Open Solution -5 - • Opentech Inc. • Powerlink Corp. • Radionix Inc. • RFSS • S&S Technology, Inc. • Samsung • SANION CO. , LTD. • Sejin Electron Inc. • SENA Technologies, Inc. • SEWON TELECOM LTD • Simplex Investment • SK Telecom • Sys. On. Chip, Inc. Sys. On. Chip, • Tele. Tek Inc. • Telian Corporation • Tescom co. ltd. • UNO Systems Co. , Ltd • Wide Telecom, Inc.

Bluetooth SIG Structure BQRB = Bluetooth Qualification Review Board BTAB = Bluetooth Technical Advisor Board BQA = Bluetooth Qualification Administrator BQB = Bluetooth Qualification Body -6 -

Spec Overview Applications RFCOMM Audio ol Data Application Framework and Support Co ntr TCP/IP HID L 2 CAP Link Manager Host Controller Interface Link Manager and L 2 CAP Baseband Radio & Baseband RF Test Specification -7 -

Spec Overview (Radio) n Frequency band & Channel Arrangement : ISM Band - USA 2. 4000 - 2. 4835 GHz f = 2402 + k MHz, k=0, … 78 - Europe 2. 4000 - 2. 4835 GHz f = 2402 + k MHz, k=0, … 78 - Spain 2. 4450 - 2. 4750 GHz f = 2449 + k MHz, k=0, … 22 - France 2. 4465 - 2. 4835 GHz f = 2454 + k MHz, k=0, … 22 n Transmitter Power - 0 d. Bm (Class 3) - 4 d. Bm (Class 2) - 20 d. Bm (Class 1) n Power Consumption - 0. 3 m. A (Standby mode), 30 m. A (Operating Mode) n Modulation - GFSK (BT = 0. 5; 0. 28 < h < 0. 35) - 1 MSymbols/s n Receiver Sensitivity - -70 d. Bm @ 0. 1% BER -8 -

Spec Overview (Baseband) n Channel - Data channel + 3 Voice Channel - Data Rate : 723. 2 kbps / 57. 6 kbps (Asymmetric), 432. 6 kbps / 432. 6 kbps (Symmetric) - Voice : 64 kbps for each channel n FEC (Forward Error Correction) - 1/3 Rate FEC, 2/3 Rate FEC - ARQ scheme for the data n Security - Robust Authentication and Encryption : Key Length up to 128 bits - Fast Frequency Hopping : 79 channels - Low transmission Power : Range typically 10 meters n Audio - CVSD (Continuous Variable Slope Delta Modulation) - 64 k samples /s linear PCM data n Support up to 8 devices / piconet, Max 10 piconet (71 devices) -9 -

Spec Overview (Link) n. SCO (Synchronous Connection Oriented) - 1대1의 대향 Link를 형성. 1 Packet / 1 Slot n. ACL (Asynchronous Connection-Less) - Packet 교환형, 1, 3, 5등 3종류의 Slot 점유 - 10 -

Piconets & Scatternets n A master and up to 7 slaves from a Piconet n Up to 10 Piconets in a Scatternet before performance starts to degrade n Master controls the Piconet n Slaves only communicate with the master Slave 4 Slave 1 Slave 3 Slave 5 n Total 71 devices can be connected together (= 7*9 + 8) Master Piconet 2 Slave 6 Master Piconet 1 Slave 7 Master Piconet 3 Slave 2 Slave 8 - 11 -

Bluetooth Profile n Profiles provide a vertical slice through the protocol stack - Each profile defines mandatory and optional features of each protocol One profile defined per usage model Profiles are the basis for interoperability and logo requirements Each Bluetooth device supports one or more profile Applications Protocols n n n Profiles - 12 -

Bluetooth Profiles Intercom Image Equipments Cordless Telephone Handset, CT Phone Intercom Dial-up Networking Modem FAX Headset LAN Access Router, Gateway File Transfer PC, Notebook Object Push Handset, PC Synchronization PDA, Notebook VOICE Handset, CT Phone Mobile Phone Dialup Networking Image DATA Mobile Phone Generic OBEX Profile Serial Port Profile SDP (Service Discovery Profile) GAP (Generic Access Profile) Modem - 13 - DATA

Bluetooth Qualification Goal : To ensure interoperability between different Bluetooth devices even from different vendors Product tested Declaration and documentation review USA Qualified products lists BQA Manufacturer FCC Part 15 EMC FCC Part 15 SAR BQB RF FCC Part 2 RF Test report checked by BQB : 6 Week Cost : USD 10 k EUROPE BQTF Documents pulled from web side Delivery Qualification Program Documents Qualification Program (Bluetooth Identity) ETS 300328 EMC ETS 300826 SAR ES 59005 Deliverry : 5 Week Cost : : USD 15 k Regulatory Type Approval (License to sell) - 14 -

Un. Plug. Fest-4 n DATE: 5 - 9 th November 2000 (Sunday - Thursday). n LOCATION: Bellevue, Washington, U. S. A (located near Seattle on the North West coast of the USA. Hosted by Microsoft). n WHO IS INVITED? Engineers who meet ALL of the following criteria: - Are developing Bluetooth components, firmware or software - Have a unique implementation - Are able to fix problems with the portion of the product that they are testing - Are members of the Bluetooth SIG n THOSE **NOT** INVITED: - System integrators who are bringing third party products for evaluation - Marketing Staff - Observers, Press, Sales Representatives, Students n HOW WILL TESTING BE CONDUCTED - Category-1 (RF, BB, LM), - Category-2 (L 2 CAP, SDP, RFCOMM, TCS) - Category-3 (Application profiles). - 15 -

Bluetooth Software v. Card/v. Cal WAE OBEX WAP TCP IP PPP SD Client Virtual OS Layer Application Software UDP AT Commands SD Server SCM TCS BIN DBM RFCOMM L 2 CAP Audio HCI - Host Driver HCI Transport/Drivers USB Serial PCMCIA HCI Baseband Firmware HCI Transport/Drivers Host Controller SSI Flash Loader Link Manager RTOS LC Driver Timer Driver Baseband w/ Link Controller ASIC Bluetooth RF Module - 16 - IRQ Driver Flash Driver

Future of Bluetooth

Comparsion with Other Spec. Bluetooth Major Company Status Technology Power Symbol Rate Range Standard Topology Security Freq HOP MAC Protocol Voice Modulation Application Time to Market Home. RF Ericsson, Intel, IBM Nokia, Toshiba Microsoft, Intel, IBM HP, Compact SIG 1. 0 b SWAP 1. 11 (‘ 99. 6) RF 2. 4 GHz, FHSS 0 ~ 20 d. Bm (1 m. W ~ 100 m. W) RF 2. 4 GHz, FHSS < 20 d. Bm (100 m. W) 1 MS/s 10 m 100 m(Optional) 8 (Piconet), Ponit-to-Multi 0. 8/1. 6 MS/s 2 GFSK Mobile Phone Mobil Computer Harris, 3 COM, Lucent Symbol, Aironet, IEEE 802. 11 Rev D 10 RF 2. 4 GHz FHSS, DSSS, ir. DA < 20 d. Bm (100 m. W) 11 MS/s 50/100 m 128 CSMA 30 m 128 CSMA Optional, WEP 79 ch, 50 hop/sec 79 ch, 2. 5 hop/sec Ethernet DECT 6 Ch, 32 Kbps ADPCM 2 GFSK 4 GFSK X Authentication Encryption 79 ch, 1600 hop/sec Link Management L 2 CAP 3 Ch, 64 kb/ch CVSD, Log PCM IEEE 802. 11 Home WLAN ? Q 3, 2000 - 18 - FHSS(2 GFSK, 4 GFSK) DSSS(DBPSK, DQPSK) WLAN On Market

IEEE 802. 15 WPAN n Task Group 1 (TG 1) - Bluetooth - IEEE Standards making efforts - To publish an approved standard early next year n Task Group 2 (TG 2) - Coexistence between 802. 11 and 802. 15 Wireless Network - Target Completion Date : Mar 2001 n Task Group 3 (TG 3) - High Rate Study Group (>20 Mbps) - Target Completion Date : Nov 2001 n MC (Marketing Committee) n R 2 SG (Radio 2 Study Group) n LRSG (WPAN Low Rate Study Group) - 19 -

Bluetooth Spec 2. 0 (Radio 2) n Improved Mode : 2 Mbps n Higher Rate Mode : 10 Mbps n Fully backward interoperable with Bluetooth Specification 1. 0 n To meet cost/power requirements, SIG did not want larger bandwidth application n Conflict with IEEE 802. 15. 3 (TG 3) Radio 1 Radio 2 Bluetooth 2. 4 G, 1 Mbps 2. 4 G, 2~10 Mbps 802. 15 2. 4 G, 1 Mbps 2. 4 G, 20 Mbps - 20 - Radio 3 5 G(? ), 20 Mbps

A/V Profile W/G n Developed by Philips, Sony, Toshiba, Ericsson and Nokia n Classes: § Sound distribution: high quality audio to headphones and speaker sets § Surround distribution: wireless surround systems § Video distribution: observation camera, video projector § Video conferencing: 3 rd generation mobile phones § Audio/video control: control signals n Key aspects: Quality of service and choice of right codecs n Audio Compression : MP 3 n Video Compression : MPEG 4 n MPEG 1(1. 5 Mbps) & MPEG 2(>5 Mbps) will realize in ver 2. 0 or higher - 21 -

Automotive W/G n Accessing the Car n Portable Device Functionality n Authorize for Car Access n Personalized Setting n Authorize car embedded equipment n Authorize for Service n Portable Smart Card n Portable Phonebook n Portable Voice Recognition Automotive & Bluetooth n Vehicle Area LAN Extension n Public Access Profile n Authorized Workshop, Gas Station, etc. n Anonymous Access - 22 -

Car Hands Free n 운전중 휴대폰 사용 금지 법제화 추진 ('01년 입법화 예정) n Headset, Ear Piece의 사용 여부 미결정 n Navigation System, A/V System 등에 장착 예정 Bluetooth Microphone Bluetooth Control Unit Bluetooth Interface Bluetooth Mobile Phone Source : Kenwood - 23 -

Bluetooth Market Overview

Bluetooth Business Model n Open, Global Market n Over 2, 000 Company Participate in Bluetooth Business Nitch Market Ericsson ALPS Lucent MACO Silicon Vendor Module Vendor Set Maker ? Modile Phone PC Maker Consumer etc. . . Philips Infineon CSR ATMEL S/W Vendor Bluetooth S/W Stack Ver 1. 0 SSL S 3 IVT Extended System Bluetooth Qualification - 25 - Salutation Con. Cetecom 7 Layer TUV

Potential Bluetooth Markets Video Projectors Office Networks Photo Printers Notebooks, HHPCs Digital Cameras Set Top Boxes FAX Desktop PCs Palm Computers Cellular/PCS Home Networking Cordless Phones Printers PBX Headsets Automotive Cellular Source : Cahners In-Stat Group, July 2000 - 26 -

Bluetooth Product Trend 2000 2001 Dongle Type Phone • 핸즈프리 • 명함 교환 BT Module 을 내장 • 데이터 교환 • 3 in 1 Phone • 인터넷연결 • 화일교환 • WLAN • 주소록교환 2003 Baseband 기능을 Host Chip 에 내장하고 RF부분만 Module화 • 리모콘 • 전자상거래 본체내 Module 내장 USB Dongle PCMCIA Card Notebook PDA • 주변기기연결 (Printer, 카메라등) 본체내 Module 내장 PC Card USB Adapter Desktop. PC • WLAN • 주소록 교환 • 주변기기연결 (Printer등, 카메라) (Printer등 카메라) 차량용/PC용 H/F 휴대폰 전용 H/F Accessary & Etc. 2002 가정용 H/F PSTN Gateway LAN Access Point BT적용 RF적용 CNS, A/V REKES - 27 - • 주변기기연결 (마우스, 키보드등) 마우스 키보드 가전, 게임기 장남감

Bluetooth Worldwide Market Growth n Europe and Japanese Markets take off faster than in North America. n Total 1, 375 Million Unit in 2005 Million Unit 1, 375 811. 0 442. 4 166. 7 0. 06 2. 49 30. 6 Source : Cahners In-Stat Group, July 2000 - 28 -

Top 6 Bluetooth Application n Digital Mobile Phone's Bluetooth Market grows from 45. 6% to 73. 2% n As more products integrate Bluetooth, the percentage of PC Cards/Adapters will shrink. Notebook PCs 3. 4% Desktop PCs 6. 4% Cordless Phones 2. 6% Printer & Fax 7. 0% Other 2. 1% Notebook PCs PC Cards & Adapters 3. 8% 3. 6% Printer & Fax 4. 1% Other 4. 9% Headsets 4. 6% Desktop PCs 5. 9% Mobile Phones 45. 6% PC Cards & Adapters 32. 9% 2001 = 31 M Units Mobile Phones 73. 2% 2005 = 1, 375 M Units Source : Cahners In-Stat Group, July 2000 - 29 -

Semiconductor Revenue vs. ASP n Total 6 year CAGR of 256% in revenue n 29% decline in average sales price, from 1999 to 2005 Million US$ Source : Cahners In-Stat Group, July 2000 - 30 -

Bluetooth Equipment Maker n n n n 3 Com - Bluetooth Modem Card for Notebook PCs Acer Ne. Web - licensed WIDCOMM's dongle, PCMCIA, CF Alcatel - One. Touch 500, 700 GSM Phone Axis Communications - Access Point Compaq - Psion's PC Cards, USB Dongle Dell - Psion's PC Cards, USB Dongle Motorola/Digianswer A/S - PCMCIA, USB Adapter, Car-Kit Ericsson - T 36 GSM Phone, Headset Handspring - Acer Nweb's Product IBM - Motorola and TDK's PC Card Socket Communication - Compact. Flash Card TDK - PC Cards, USB Adapter, CF, LAN Access Point Toshiba - Note Book PCs Xircom - PC Cards, USB Dongle, CF Motorola Axis IBM - 31 - TDK Widcomm

Bluetooth Chipset & Module Trend

Bluetooth Module & Components Power Mgmt PLL Clocks RF Interface PLL and control logic Transmit Buffer 1/3, 2/3 FEC Data Whitening VCO CVSD/ PCM PD BB Chip N/A Prescaler RF Chip 1/3, 2/3 FEC Clock Recovery Sliding Correlator Offset Canceller Demod A/D (RSSI) S&H LNA Data in/out Receive Buffer UART Link Controller PCM Low IF Receiver RF Module Power Management ROM Voice in/out Antenna Band Pass Filter RF Chip Balun RF Switch Substrate (FR-4) RF Shield Substrate (LTCC) Crystal BB Chip Flash Memory Radio Module Regulator Bluetooth Module - 33 -

Radio IC n Bi. CMOS Technology - Low Power Consumption n Low IF or Direct Conversion n Qualcomm MSM Interface n Blue. RF Interface n Vendor Philips (UAA 3558, Bi. CMOS) Conexant/Philsar (PH 2401, Si. Ge-Bi. CMOS) Siliconwave (Si. W 015, SOI Bi. CMOS) Broadcomm/Innovent (NVT 1003, CMOS) Infineon (PMB 6615, Bi. CMOS) Lucent (W 7020, Bi. CMOS) National Semiconductor (LMX 3162, Bi. CMOS) OKI (ML 7050 LA, CMOS) Atmel/TEMIC (T 2901, Si. Ge-Bi. CMOS) n Package TSSOP-38, BGA-48, TQFP-48 - 34 -

Baseband Structure CPU Core 16~32 bit RISC PORT LINK CONTROLLER EEPROM or FLASH DEBUG I/F XTAL SYSTEM CONTROLLER UART I/F TIMER WATCHDOG USB I/F INTERRUPT CONTROLLER PCM I/F HOST I/F CVSD ROM ADC & DAC Amp & SPK -Phone RAM RF MODULE POWER MANAGEMENT RF I/F - 35 - VOLTAGE REGULATOR

Baseband IC n Processing Power - 3 to 4 MIPS n ARM 7 Core - Ericsson & Philips, Nokia, Xircom, 3 Com, Lucent, Atmel Mitel Semiconductor, Conexant/Philsar, Alcatel Microelectronics n Other Baseband Core CSR : 16 bit RISC Broadcom(Innovent) : 8051 Hitachi : H 8 National : CR 16 Digianswer : DSP n External Flash Memory for Firmware (2 Mbits to 4 Mbits)- To reduce risk Specification is not fixed! n CMOS Technology - One Chip n Package - BGA-96, TQFP-100/144, FPBGA-96 n Include Voice Codec n Full 3 SCO Support - 36 -

Types of Bluetooth Module n RADIO ONLY § Portable phones! Phones contain powerful processors and memory capable of providing baseband control functions § A cost-effective solution is often to provide a module containing only the radio function n RADIO + BASEBAND § …. if phone processor does not have excess capacity to support Bluetooth TX data formatting and RX synchronization. n RADIO + BASEBAND + MICROCONTROLLER + MEMORY § For retrofit upgrade and unhosted applications - headsets, PC cards § Appropriate to include crystal and voltage regulation also - 37 -

Bluetooth Module Trend Low IF, Direct Conversion 기술 적용 Si. Ge-Bi. CMOS 기술-저전력화 다양한 형태의 Antenna Solution등장 CODEC, MP 3 기능 내장 다양한 Embedded Solution RF SW Rx Ballun BPF Ballun Tx Baseband Interface의 표준화 (Blue. RF) PCB내층에 Pattern으로 설계 VCO X-tal BPF 2개 사용으로 SW 삭제 Regulator PA - 38 - Flash Memory Firmware 안정화에 의한 Baseband내 내장 Host 부분과의 최대한 공 용화로 원가 절감

Bluetooth Module Maker Module& PCB Type RF Chip BB Chip Status Ericsson Components Full Module/RF Module (PCB Substrate & LTCC) Lucent Philips 출하중 '00/10 ~ 100만개/월 Lucent RF Module (LTCC) Lucent - 출하중 Ericsson 대응 MACO (마쯔시다전자부품) Full Module/RF Module (ALIVH Substrate) Philsar Mitel '00/6 Sample '01/Q 1 양산 ALPS전기 Full Module (PCB) CSR '00/5 Sample '00/12 양산 Taiyo Yuden Full Module (? ) Silicon Wave Hitachi '00/Q 3 Sample Murata 제작소 RF Module (LTCC) Lucent등 - 출하중 Atmel Full Module (PCB) Temic Atmel 2000년내 양산 Alcatel Full Module (LTCC) 자사 (One Chip) '01/Q 1 양산 JTDC Full Module (PCB) Philsar Mitel ? 미쯔미전기 Full Module/RF Module CSR '01/Q 1 양산 - 39 -

Radio Module n Substrate : LTCC (Low Temperature Co. Fired Ceramic) n Flip-Chip, Wire Bonded n BGA Packaging n Target Application : Mobile Phone, Full Module Philips Murata 10 . 2 mm Ericsson 14 mm 12 mm 10 mm (6 mm x 8 mm) - 40 -

Blue. RFTM n Standard Interface for RF and Baseband n Benefits - So. C designers need not to have expertise in RF design - So. C vendors will have confidence there will be multiple RF parts - RF designers will have one design for multiple So. C applications n Receive Path - Rx. Mode 1, 2, 3 n Transmit Path - One Configuration n Control Register Interface - JTAG, DBus n Contact to bluerf@arm. com to get the specification - 41 -

Useful Web-Site for Bluetooth n http: //www. opengroup. org/bluetooth n http: //www. palowireless. com/bluetooth n http: //developer. axis. com n http: //ne. nikkeibp. co. jp/IEEE 1394/bluetoothtop_. html n http: //grouper. ieee. org/groups/802/15/index. html n http: //new. topsitelists. com/bestsites/bluetooth/topsites. html n http: //www. egroups. com/group/bluetooth-korea n http: //www. bluetooth. or. kr - 42 -

Conclusion / Q&A n Who will be win in Bluetooth Business? n Mobile Phone Air Time Loss - 3 -in-1 Phone, WAP Kiosk etc. n Real Royalty Free Technology? Thanks for Listening! All presentation material will be hosted in my personal Homepage http: //carpc. co. kr - 43 -