3 CEMS DMS R D Service Introduction DMS RD

3 CEMS DMS R&D Service Introduction DMS RD Dept. Updated Date: May, 2012 Confidential

Overview l DMS Team has over 10 years of experience in Industrial PC Field. l We provide industrial grade products and solutions to meet the different extreme and tough environmental conditions. l We specialize in fanless and wide temperature solutions. Our heat dissipation structure has U. S. patent. (Patent No. US 7, 468, 555 B 2) It makes our products 100% Fanless. 2

EMS+DMS Client Input From Kickoff to NPI Service DMS Design & Verification NPI EMS Build, QC & Deliver 3

Supportable DMS Project Type Board Build (x 86 architecture, ARM architecture or others TBD) Chassis Build (Chassis, enclosure, housing or others TBD) System Build (GP computer, embedded system or others TBD, without OS basically) • EE+ME team will be involved • Average developing period: 3~4 months • ID+ME team will be involved • Average developing period: 3~5 months • ID+ME+EE team will be involved • Average developing period: 6 months 4

DMS R&D Design Introduction 5

Top-grade Products Design Others Material Requirements Wide Temperature Design System Test Layout System Design Requirements Signal P. C. B Measure Requirements 6

Design Overview • Components selection • Layout • PCBA Conformal Coating – Silicone for Anti-vibration, Wide Temp in Vehicle Computer • Wide Temperature Design • Wide Voltage Design (9 -32 V) • Water /Dust/ Salt Fog Resistance(Environmental) – Passed MIL-STD-810 G Tests • Sunlight Readable Solution • Fanless / Cableless Embedded System Design • Anti-shock & Vibration Embedded System Design 7

Material Requirements Quality Improvment l Wide temperature components selection (-30~+70) Passive parts Active parts Peripheral Others Resistor Easy Diode Easy Memory Selection Cable Easy Inductor Easy Transistor Easy Flash Selection Connector Selection Capacitor POSCAP/TAN MOSFET Easy HDD/SSD Selection Switch Selection 　 　 CPU & ASIC Selection PANEL Selection 　 　 Ensures all of the components can work in a wide-temp environment Design phase 8

Wide Temperature Design Quality Improvment l Wide Temperature Design High efficient PWM design Sensitive PLL circuit design Hi-speed circuit design Balance performance and power consumption Design phase Talented Engineer 9

P. C. B Requirement Quality Improvment l Checks all of the impedance to fit requirements Make PCB phase Slice PCB 10

Thermal Design Truly FANLESS, Patent for Thermal Design

Material Technology Nano Paint: Water proof & Anti-heat Ceramics Paint

Anti-vibration & Drop Design Anti-Vibration, Removable HDD Design Anti-Vibration, Anti-Shock System Design n Fanless(Wide Temp. ) n Anti-Vibration(Rugged/IP) MIL-SDT-810 F C 3 Pass (Operational Vibration)

Crash & Shock 14

Vibration – Vehicles MPC 900 Embedded computer 15

Vibration – Wheeled Trailer / Truck 16

Vibration – Wheeled Trailer / Truck 17

Industrial Grade Product Design for Mission Critical 18

Dust & Water Resistance 19

Sunlight Readable n Core Technology (Increase Contrast Ratio) n Increase LCD Brightness n Normally, the utilization rate from light bar to surface is only 5% Ø Increase light bar brightness n Change materials n. Decease the sunlight reflection Ø Add Anti-Reflection and ¼ lambda Films Ø Change materials 20

Signal Measure Quality Improvment l Critical signal’s eye pattern check During system design 21

Verification Requirement Burning & Memory Test Burning Test 22

Verification Requirement Power Cycle Test Power Cycle 23

R&D Design Verification Testing Facility 24

Compelete RD Testing Equipments 25

IR Thermal Image Scan l IR camera: FLIR Thermal CAM SC 2000 l Hot spots identified as the monitor points in system thermal test l Hot spots are all under the components thermal specs 26

Climatic Stressing l To simulate the worst environmental conditions with regard to temperature, humidity, etc. 27

Safety pre-test u Dielectric Withstand/Insulation Resistance Test (Hi-Pot test) u Ground Bond Tester u limited power sources test u Touch current test u Steady force test u Reflection test u Enclosure opening test u Accessibility test u Impact test u Stability test 3 CEMS Confidential 28

Transprotation Simulation l To simulate transportation impact to provide system /device within good condition during shipping Ø Vibration Ø Shock impact Ø Handling impact 29

Manufacturing Capabilities n Advanced Process Technology n Surface Mounting Technology Process Large Scale SMT Capacity Double Side Component Capability VAD & RAD Capabilities High Speed & Efficient Machine Multiple & Flexible M/C Combination n Circuit Board Fabrication n Material Bar-Coding System n Automated & Manual Insertion n Automated Conformal Coating n Clean & Lead-Free (Ro. HS) Process n Specific Testing Service tailored for customers n Full System Assembly 30

Manufacturing Capabilities World-Class Production Facilities Latest Manufacturing Techniques + State-of-the-Art Test Equipment = Top-Grade Products 31

DMS Design Capability – ID & ME Embedded Computer / Controller Mobile DVR Digital Signage Rugged Fanless Embedded Computer Rugged Fanless I/O Controller Design Capability for Rugged, Fanless, Cable less, Industrial Embedded I/O Controller & Computers.

DMS Design Capability – ID & ME Panel PC / POS / IPC Monitor Design capability for Rugged, Industrial Panel PC, POS System & IPC Monitor

Panel PC Product 12” - 15” 8” - 10” Robust Panel PC/POS, Monitor, ARM HCI Mobile handheld for Mission Critical in Military, Medical, Outdoors.

Panel PC Product Panel Size : 17” Maritime Panel PC For Offshore, Cruise, Oil drill platform applications. Use for Sea Map, Navigation Monitors or Bridge Controller display Applications: River Cruise 35

Optional Features Sunlight Readable Smart Panel Module 36

DMS Design – ID Design External HDD Enclosure Multimedia Door Phone

DMS Design Capability – ID & ME Panel PC/POS/IPC Monitor Strong R&D experiences to fulfill customize needs

On-going Project – 12” Panel PC (ODM) Delicate experienced R&D center locate in Taiwan System Design Capability: SAVE Manpower resources = SAVE COST One Stop Service Changeable Decoration Front Bezel • Design Quality Assurance • Fast and quick response • Testing Labs, Verifications • Tooling Molding benefits • Local supply chain links • One stop manufacturing 39

DMS Design – ID & ME Design Medical Equipment Direct phone in emergency With fingerprint module, control board, batteries, motor and mechanical linkage structure

DMS Design – ID & ME Design Thermostat / LED Bulb Thermostat Battery charger LED bulb with heat spreading cooler Expansion card module