1 System IC Product Short Form Catalog

1

System IC Product Short Form Catalog Dec. 1999 2

PRODUCT INDEX 3 System IC SBU ( Dec. 1999 / Rev. 01 )

1 PRODUCT LINE - UP 1 0 DIGITAL MEDIA 2 0 MCU 3 0 MIXED SIGNAL 4 0 IMAGING TECHNOLOGY 5 0 MERGED MEMORY LOGIC 6 0 FOUNDRY & ASIC 7 0 SALES NETWORK 8 4 System IC SBU ( Dec. 1999 / Rev. 01 )

PRODUCT LINE UP DIGITAL MEDIA DIGITAL TV/ Front-End Chipset Back-End JAVA TM PROCESSOR ARM PROCESSOR USB MCU QPSK NIM HD Video 3 Chips VSB SD Video Processor * DTV MCU MJ 501 ARM 7201 USB Memory Controller Remote Controller 8 bit General Purpose TV (OSD) 32 bit MIXED SIGNAL * Audio Decoder RISC CPU MCS-51 Compatible Series RISC CPU + DSP CDMA * Base Band Analog * Voice Band Codec LOGIC Micro Peripheral Super I/O SCSI Line Driver Telecom LCD CMOS Image Sensor Gate Driver TV Remocon ELB Monitor Audio IMAGING TECHNOLOGY Source Driver Miscellaneous PC Sound Karaoke VCD MP 3 Color VGA Color CIF B/W SVGA CCD Image Sensor Color SVGA B/W SVGA 1/3” B/W 250/290 K Pixels Color 250/290 K Pixels 1/3” Color 330 K Pixels 1/3” * 1/4” B/W 250/290 K Pixels Color 250/290 K Pixels 1/4” Color 330 K Pixels * 1/4” * CMIC & BE Chipset CIS ISP Comp. & USB VD * 2’nd VD B/W TG B/W SP Color 1’st CDC * Color 2’st CDC Color TG MERGED MEMORY LOGIC FOUNDRY & ASIC Technology FOUNDRY ASIC Color 1’st ISP USB Interface * 2’st ISP for USB * Color 2’st ISP HDL 350 A HDL 351 HDL 250 HDL 180 0. 25 um 0. 35 um 0. 6 um CELL-BASED 0. 25 um 0. 35 um 0. 5 um GATE-ARRAY 0. 5 um 0. 65 um 0. 8 um 5 0. 8 um 0. 6 um 0. 8 um * Coming Soon System IC SBU ( Dec. 1999 / Rev. 01 )

0 PRODUCT LINE - UP 1 1 DIGITAL MEDIA 2 0 MCU 3 0 MIXED SIGNAL 4 0 IMAGING TECHNOLOGY 5 0 MERGED MEMORY LOGIC 6 0 FOUNDRY & ASIC 7 0 SALES NETWORK 8 6 System IC SBU ( Dec. 1999 / Rev. 01 )

Digital TV Tuner DTV Front-End I/F Demod. (LA 7785 M) VSB Receiver ADC 8 M Byte SDRAM 4 M bit DRAM (GDC 21 D 003) DTV Back-End Video Decoder (GDC 21 D 401 B) Transport 8 M Byte SDRAM HDTV Video Signal Output VDP (GDC 21 D 701 C) (GDC 21 D 301 A) Audio Decoder (GDC 23 D 801) 5. 1 Ch. Audio DTV MCU (GDC 21 D 601) 7 System IC SBU ( Dec. 1999 / Rev. 01 )

Digital TV DEVICE PACKAGE GDC 21 D 003 (VSB Receiver) 128 HQFP - 10 bit internal ADC - Synchonizer & Equalizer - VSB Channel Decoder OWN GDC 21 D 301 A (Transport Demultiplexer) 176 TQFP - MPEG-2 transport & PES layer handling. - Identify & Extract TS packet PIDs OWN GDC 21 D 401 B (Video Decoder) FUNCTION REF. MPEG 2 MP@HL decoder 240 HQFP - 3: 2 Pull Down - Macroblock format out - Format Conversion : All ATSC, NTSC & VGA input , 1080 60 I Output, Digital/Analog GBR/YPb. Pr - PIP & Display Control - Internal 3 Ch. DAC - 1, 2, 4, 8 bit/ pixel OSD OWN GDC 21 D 701 C (Video Display Processor) 304 QFP(PQ 2) GDC 23 D 801 (Audio Decoder) 128 MQFP - Dloby AC-3 / Pro-logic/ MPEG Decoding - 3 D Virtual Surround OWN GDC 21 D 601 (ARM RISC) 240 MQFP 32 bit ARM 720 T Core 0~60 MHz Operation OWN 8 OWN System IC SBU ( Dec. 1999 / Rev. 01 )

Satellite Digital Set Top Box ! HYUNDAI Solution NIM RF Tuner HDM 8513 A (QPSK & FEC & ADC) Common Interface SERIAL INPUT MPEG 2 Decoder Transport Demux I 2 C BUS I/R Remote Key Pad Interface Sub MCU External MCU SYSTEM ROM 9 Video Decoder Audio Decoder Video Encoder Analog Video Analog Audio DAC SYSTEM RAM System IC SBU ( Dec. 1999 / Rev. 01 )

8513 A Features & Benefits SECTION DEVICE PACKAGE QPSK HDM 8513 AP 100 PQFP HMD 8513 AT 64 TQFP FUNCTION • Fully DVB&DSS compliant REF. OWN • Dual 6 bit A/D converters • Continuously variable symbol rate from 1 Msps to 55 Msps (75 MHz clock) • Internal digital root raised cosine filter • Less than 0. 5 d. B implementation loss • Frequency multiplexing capability • Automated frequency search • Internal bias cancellation • Both wide band narrow band AGC • Noise calibration for antenna steering • Output data rate as high as 68 Mbps • Fixed frequency sampling clock • Simple interface with tuner and analog processing • Micro controller interface • Eight bit parallel or I 2 C monitor and control interface • I 2 C by-pass mode • Two package types 10 System IC SBU ( Dec. 1999 / Rev. 01 )

NIM Module Products Line Up PRODUCT NIM Module Product SPECIFICATION PART NUMBER PACKAGE 115 -T-7121 TP Module 115 -T-7211 TP FEATURE DBS Module ( Tuner + HDM 8513 A) - ZIF Vertical type, 3 voltage input, loop-through AVAILABILITY NOW DBS Module ( Tuner + HDM 8513 A) - ZIF Horizontal type, 3 voltage input, loop-thgh 11 System IC SBU ( Dec. 1999 / Rev. 01 )

Java Processor - enabled STB , POS , I - TV Design(Full Features) Flash ROM Up to 64 MB CRT Monitor ( POS ) Up to 64 MB SDRAM Up to 256 MB Video DAC MJ 501 TV Monitor ( TV, STB ) Audio CODEC Java Processor Speaker Line-In Ethernet Card Printer keyboard/ Mouse Fax/ Modem 12 Smart Card System IC SBU ( Dec. 1999 / Rev. 01 )

Java. TM Processor SECTION MJ 501 Java. TM Processor DEVICE GMJ 30501 SB PACKAGE FUNCTION REF. 352 SBGA • MJ 501 is a device targeted for network consumer applications such as Web browser for TV, POS and other various consumer applications. • Designed for an integrated embedded system controller incorporating Pico. JAVA-IITM. • 100 MHz @ 2. 5 V • Integrates various I/O peripherals such as memory controller, 2 D graphics engine, CRT controller, TV encoder, PCI controller, UART, ECP, CODEC interface for audio, keyboard and mouse controller, GPIO and smart card interface in a single chip. OWN 13 System IC SBU ( Dec. 1999 / Rev. 01 )

ARM Processor - enabled Data Terminals, PDA, CNS, Web Phone Design Speaker & MIC. Parallel Port Serial Ports VGA Ir. DA LCD Serial Ports USB Power Super I/O GM 82 C 803 SDRAM 32 MB 7201 Multi ICE Expansion Connector EPROM 512 KB Flash ROM SRAM Embedded ICE 2 MB 8 MB MMC KBD 14 PCMCIA Type 2 System IC SBU ( Dec. 1999 / Rev. 01 )

ARM Processor SECTION ARM Processor DEVICE GMS 30 C 7201 PACKAGE FUNCTION REF. 360 PBGA • The GMS 30 C 7201 is designed for portable devices applications such as data terminals, PDA, CNS and other various portable applications. • Incorporated into the ARM 720 T is an enhanced memory management unit(MMU) which allows for support of sophisticated operating systems like Microsoft Windows CE. • 60 MHz @ 3. 3 V • Integrates various I/O peripherals such as memory controller, LCD controller, VGA controller, 2 channel PCMCIA controller, 2 UART, 10 Bit 5 channel ADC, 8 Bit DAC for audio, keyboard controller, GPIO and JTAG debug interface in a single chip. OWN 15 System IC SBU ( Dec. 1999 / Rev. 01 )

USB Controller SECTION USB Memory Card Controller DEVICE GDS 30 C 6001 PACKAGE 32 SOP FUNCTION REF. • Complete USB Device Controller for MMC /SSFTC card interface • One-chip transceiver • Supports 3. 3 V /5. 0 V Smart media Card from 2 MB to 128 MB and MMC from 2 MB to 32 MB • Supports Windows 95 OSR 2. 1/2. 5 , Windows 98 and Mac 0 s 8. 1(i. Mac) • No external power required • Compliant to USB v 1. 1 Specification • Support 12 Mbits/s “full speed” serial data transmission • Partly programmable USB descriptors via Host ( Supports Set_Descriptor) • For MMC, Supports SPI mode and MMC mode • For SSFDC, Support 1 MByte/s data transfer • Specific Vendor commands for Card I/F OWN 16 System IC SBU ( Dec. 1999 / Rev. 01 )

USB Controller - Application 1. External Card Reader USB MMC or USB SSFDC Memory Card Socket 2. For Digital Camera, MP 3 Player , Integrated mode in the system USB USB MMC or SSFDC System MCU USB MMC Intmcu or SSFDC System MCU Memory Card Socket System Decoder 17 System IC SBU ( Dec. 1999 / Rev. 01 )

0 PRODUCT LINE - UP 1 0 DIGITAL MEDIA 2 1 MCU 3 0 MIXED SIGNAL 4 0 IMAGING TECHNOLOGY 5 0 MERGED MEMORY LOGIC 6 0 FOUNDRY & ASIC 7 0 SALES NETWORK 8 18 System IC SBU ( Dec. 1999 / Rev. 01 )

REMOTE CONTROLLER DEVICE ROM GMS 30 Ser. GMS 34 xxx. T 0. 5 -1 K 1 K(EPROM) GMS 36 Ser. 1 K GMS 36 xxx. T 1 K(EPROM) GMS 37 Ser. 1 K GMS 37 xxx. T 1 K(EPROM) GMS 810 Ser. 4, 8, 16, 24, 32 K GMS 810 xx. T GMS 81 C 5032 GMS 87 C 5032 * GMS 81 C 5108 * GMS 87 C 5108 (EPROM) PACKAGE FUNCTION GUIDE FUNCTION 8 K 8 K (EPROM) REF. Remote Control OWN Remote Control (Built in Output Tr) Remote Control Transmitter OWN Remote Control (Key Extention ver) 16 DIP/SOP 20 DIP/SOP 24 DIP/SOP 20 SSOP Remote Control Transmitter OWN Univerdal Remote Control Transmitter OWN Wireless Keyboard, Univerdal Remote Control Transmitter OWN LCD Remote Control Transmitter (For Airconditioner) OWN 20 DIP/SOP 24 sk. DIP/SOP Universal Remote Control LVD circuit 28 sk. DIP/SOP 44 PLCC 16, 24, 32 K 28 sk. DIP/SOP Universal Remote Control 40 PDIP LVD circuit 32 K (EPROM) APPLICATION 44 PLCC/QFP WDT Auto Start 80 QFP LCD Display/Controller 4 ch ADC LVD circuit * Coming Soon 19 System IC SBU ( Dec. 1999 / Rev. 01 )

REMOTE CONTROLLER APPLICATION BLOCK DIAGRAM K 0 VDD K 1 ＋ K 2 K 3 R 0 R 1 R 2 R 3 D 0 D 8 D 9 D 1 D 2 D 3 D 4 D 5 G M S 3 0 (4) X X X REMOUT RESET GND OSC 1 D 6 D 7 OSC 2 8 × 10 KEY MATRIX 20 System IC SBU ( Dec. 1999 / Rev. 01 )

8 BIT MICROCONTROLLER DEVICE ROM PACKAGE GMS 81504 T 4 K EPROM 30 SDIP/28 SOP 30 SDIP GMS 81604 FUNCTION GUIDE FUNCTION APPLICATION REF. 4 K Fan, Rice Cooker, Vacuum Cleaner, Air Cleaner, etc. GMS 81608 T 8 K EPROM * GMS 82512 12 K * GMS 82516 16 K 40 PDIP/42 SDIP/ 44 PLCC GMS 82524 * GMS 82524 T 42 SDIP/44 PLCC/ 44 QFP Refrigerator, Air Conditioner, Microwave Oven, Rice Cooker, SVR, etc. OWN 24 K EPROM GMS 81508 A ADC (4 CH~8 CH), Timer Watchdog Timer Programmable Buzzar Driving Port Power Saving Mode 8 K * GMS 81516 AT 16 K EPROM GMS 81508 B 8 K CHIP/64 SDIP 64 QFP/64 LQFP CHIP/64 SDIP 64 LQFP ADC(8 CH), SCI(1 CH), PWM(2 CH), Timer Watchdog Timer Programmable Buzzar Driving Port Power Saving Mode Refrigerator, Air Conditioner, Washing Machine, Fan Heater, Camcorder, VCR etc. * Coming Soon 21 System IC SBU ( Dec. 1999 / Rev. 01 )

8 BIT MICROCONTROLLER DEVICE ROM GMS 81516 BT 16 K EPROM GMS 81524 BT 24 K EPROM GMS 87 C 1102 GMS 81 C 1102 GMS 87 C 1202 GMS 81 C 1202 GMS 87 C 1101 GMS 81 C 1101 GMS 87 C 1201 GMS 81 C 1201 GMS 87 C 1404 GMS 81 C 1404 FUNCTION GUIDE PACKAGE FUNCTION APPLICATION CHIP/64 SDIP 64 LQFP ADC(8 CH), SCI(1 CH), PWM(2 CH), Timer Watchdog Timer Programmable Buzzar Driving Port Power Saving Mode REF. Refrigerator, Air Conditioner, Washing Machine, Fan Heater, Camcorder, VCR etc. 16 PDIP/16 SOP 2 K EPROM 20 PDIP/20 SOP 16 PDIP/16 SOP 1 K EPROM ADC(8 CH), PWM(1 CH), Timer Watchdog Timer Oscillator(Crystal, Ceramic Resonator, RC) Power Saving Mode (Stop, Wake-Up, RC) Battery Charger, Car Alarm, Toy, Rice Cooker, Booster, Boilor, ABS, Air Bag, Temp Controller, etc. 20 PDIP/20 SOP 28 SKDIP/28 SOP ADC(8 CH), PWM(2 CH), Timer Watchdog Timer, SCI(1 CH) Oscillator(Crystal, Ceramic Resonator, RC) Power Saving Mode (Stop, Wake-Up, RC) 18 PDIP/18 SOP Timer, Watchdog Timer High Speed, Low Power 4 K EPROM GMS 87 C 1408 GMS 81 C 1408 8 K EPROM GMS 77 C 1000 512× 12 bit EPROM OWN 22 System IC SBU ( Dec. 1999 / Rev. 01 )

8 BIT MICROCONTROLLER FUNCTION GUIDE DEVICE ROM PACKAGE FUNCTION APPLICATION GMS 77 C 1001 1024× 12 bit EPROM 18 PDIP/18 SOP Timer, Watchdog Timer High Speed, Low Power Battery Charger, Car Alarm, Toy, Rice Cooker, Booster, Boiler, ABS, Air Bag, Temp Controller, etc. GMS 84512 T 12 K EPROM GMS 84524 T 24 K EPROM 52 SDIP GMS 81 C 4040 40 K GMS 87 C 4060 20 K EPROM TV 60 K EPROM GMS 87 C 2020 * GMS 81 C 2020 ADC, SCI(1 CH), PWM(9 CH) Timer, Watchdog Timer OSD * * GMS 81 C 2012 GMS 81 C 2112 REF. OWN 64 SDIP/64 QFP/ 64 LQFP 12 K GMS 87 C 2120 * GMS 81 C 2120 20 K EPROM 40 PDIP/42 SDIP/ 44 QFP GMS 81 C 3004 4 K CHIP/80 QFP ADC(12 CH), SCI(1 CH), PWM (1 CH) , Timer, Watchdog Timer, High Voltage Port, Programmable Buzzar, Driving Port, Power Saving Mode ADC(4 CH), PWM(1 CH), Timer, Watchdog Timer, LCD MWO, VCR, Audio, Fan Heater Hand-Held Game, Caller ID, Intelligent LCD Panel, Time Piece, etc. * Coming Soon 23 System IC SBU ( Dec. 1999 / Rev. 01 )

8 BIT MICROCONTROLLER FUNCTION GUIDE DEVICE ROM PACKAGE FUNCTION APPLICATION HU 80 C 500 32 K 80 TQFP ADC(8 CH), Built-In PLL, SIO (3 CH), Timer Car Audio , Home Audio 44 TQFP MP 3 Decoding, ADPCM, 8 -Band Digital Equalizer Built-In PLL, I 2 C Interface MP 3 Player , Car Audio HU 61 C 930 REF. HU 16 CF 84 HU 16 CF 44 OWN HU 16 CF 24 HU 16 CF 14 HU 16 CF 82 HU 16 CF 42 16 K COB SIO, E 2 PROM(0. 5 K, 1 K, 2 K, 4 K, 8 K, 16 K) Bank Credit, Debit Card, Electroni Commerce, Transportation, Hearth Care cards, Communication, Electronic ID card HU 16 CF 22 HU 16 CF 12 24 System IC SBU ( Dec. 1999 / Rev. 01 )

TV APPLICATION BLOCK DIAGRAM Audio amplifier Tuner SIF/PIF AV S/W Speaker Tunning Video S/W EEPROM Key input Chroma CRT Data store Audio control On screen display Picture control GMS 84512/24 Remote control 25 System IC SBU ( Dec. 1999 / Rev. 01 )

BATTERY CHARGER APPLICATION BLOCK DIAGRAM GMS 81504 (30 SDIP/28 SOP) 8 bit T/C 2 Ch PHONE Interval Timer SUB BATTERY CPU 8 bit A/D Converter 4 ch 23 I/O LED TR POWER TR DC 26 System IC SBU ( Dec. 1999 / Rev. 01 )

AIR CONDITIONER Sensor(room temp. ) APPLICATION BLOCK DIAGRAM TEMPERATURE DISPLAY Sensor(humidity) room A/D converter Function 1. A/D converter 2. Operating S/W input 3. Remocon decoding 4. Display signal output 5. Compressor motor output 6. Fan motor output 7. 4 way valve control (cool & warm change) operating S/W Remote control transmitter set LED G M S 8 1 5 1 6 Vdd Compressor motor M Fan motor(room) M remote control receiver M Fan motor(out door) 4 way valve (cool & warm) 27 System IC SBU ( Dec. 1999 / Rev. 01 )

8 BIT MICROCONTROLLER DEVICE ROM GMS 90 C 32 GMS 90 C 31 ROM LESS GMS 90 C 52 GMS 90 C 51 8 K 4 K GMS 97 C 52 GMS 97 C 51 (OTP) GMS 90 L 32 GMS 90 L 31 8 K 4 K EPROM GMS 90 L 52 GMS 90 L 51 GMS 97 L 52 GMS 97 L 51 (OTP) 8 K 4 K EPROM GMS 97 C 2051 GMS 97 C 1051 (OTP) 2 K 1 K EPROM GMS 90 C 58 GMS 90 C 56 GMS 90 C 54 GMS 97 C 58 GMS 97 C 56 GMS 97 C 54 (OTP) 32 K 24 K 16 K PACKAGE 40 DIP/ 44 PLCC/ 44 MQFP Oper. Voltage 32 K 24 K 16 K EPROM 20 PDIP/ SOIC 40 DIP/ 44 PLCC/ 44 MQFP FUNCTION 16 Bit Timer/Counter, USART, 4. 25~5. 5 Power Saving Mode High Speed Operation (MAX. 40 MHz, OTP : 33 MHz) ROM LESS 40 DIP/ 44 PLCC/ 44 MQFP FUNCTION GUIDE 2. 7~5. 5 4. 25~5. 5 2. 7~5. 5 APPLICATION Video-CD, SVR, MODEM, Key Phone, Cordless Phone, FAX Machine, Home Automation, Sound Card, CD-ROM, Monitor, etc. i 80 C 32 i 80 C 31, SAB-C 301 i 80 C 52/ i 80 C 51/ SAB-C 501 i 87 C 52 i 80 C 32 L i 80 C 31 L, 16 Bit Timer/Counter, USART, Power Saving Mode, Low Voltage Operation (3 V Operation) Cordless Phone, Home Appliance, Wireless Keyboard, Toy, Meter, etc. 16 Bit Timer/Counter, UART, Low Voltage Power Down Mode, Direct LED Drive Output Battery Charger, Toy, Rice Cooker, Booster, Boiler, ABS, Air Bag, SVR, Temp Controller 16 Bit Timer/Counter, USART, Power Saving Mode High Speed Operation (MAX. 40 MHz, OTP : 24 MHz) Video-CD, SVR, MODEM, Key Phone, Cordless Phone, FAX Machine, Home Automation, Sound Card, CD-ROM, Monitor, etc. 28 REF. i 80 C 52 L/ i 80 C 51 L i 87 C 52 L AT 89 C 2051 AT 89 C 1051 i 80 C 58 i 80 C 54 i 87 C 58 I 87 C 54 System IC SBU ( Dec. 1999 / Rev. 01 )

SVR APPLICATION BLOCK DIAGRAM Ant Tuner DE-EMP Video LPF CL AMP VIDEO PAL MAC AFT Audio AUDIO L Audio (PLL+DE-EMP) STEREO AUDIO R MCU Store Data EPROM Volume Stereo/Mono GMS 90 C 5 x GMS 97 C 5 x LED Display Key Matrix 29 System IC SBU ( Dec. 1999 / Rev. 01 )

32 BIT MICROCOMPUTER DEVICE GMS 30 C 710 A GMS 30 C 2132 GMS 30 C 2232 ROM PACKAGE FUNCTION - 144 TQFP 32 Bit RISC CPU, Fixed Length Instruction 40 MIPS @ 40 MHZ, 5 V Cache ( 8 K Byte-Data / Instruction ) - 144 TQFP 160 MQFP 32 Bit RISC CPU+DSP 128 Byte Instruction Cache 66 MIPS @ 66 Mhz 100 MIPS @ 100 Mhz 100 TQFP 16 Bit RISC CPU+DSP 128 Byte Instruction Cache 66 MIPS @ 66 MHZ 100 MIPS @ 100 MHz 144 TQFP 16 Bit Fixed Point DSP Unit UART x 2 CH, SIO x 2 CH ADC : 10 BIT x 8 CH On-Chip PLL Timer: 16 bit x 4 CH, 32 bit x 1 CH 360 BGA Memory Controller SCI PCMCIA Ⅱ ADC(126 bit), DAC(10 bit) PLL , PMN , DMA , JTAG GMS 30 C 2116 GMS 30 C 2216 - GMS 31 C 26128 GMS 37 C 26128 (OTP) 128 K EPROM GMS 30 C 7201 FUNCTION GUIDE - 30 APPLICATION REF. ARM 710 A DVD Driver, STB Digital TAD, GAMES CD-ROM Driver, Karaoke, DSC, PCMCIA Card etc. HYPERSTONE ARCHITECTURE E 1 -32 HPC, Wallet PC, IPC ARM 720 T System IC SBU ( Dec. 1999 / Rev. 01 )

0 PRODUCT LINE - UP 1 0 DIGITAL MEDIA 2 0 MCU 3 1 MIXED SIGNAL 4 0 IMAGING TECHNOLOGY 5 0 MERGED MEMORY LOGIC 6 0 FOUNDRY & ASIC 7 0 SALES NETWORK 8 31 System IC SBU ( Dec. 1999 / Rev. 01 )

CDMA FUNCTION GUIDE SECTION DEVICE PACKAGE *Voice Band CODEC for CDMA GM 0936 TQ 48 TQFP *BBA 3000 GDC 6 P 1310 TQ GDC 6 P 1320 TQ 48 TQFP FUNCTION • Combined A/D, D/A and Filters • Electric Microphone Bias Reference Voltage Available • Compatible with All DSPs • Programmable Volume Control in 13 bit Linear Mode • Designed for Standard 2. 048 MHz Master Clock • CDMA / AMPS Dual mode Operation • 2. 7 V min. Supply voltage Operation • Operational Mode compatibility with the MSM 2300&3000 • Enhanced features with MSM 3000 through three-line serial bus interface (SBI) • BBA+Tx-AGC, BBA+Rx-AGC PA Duplex DA Own CDMA Cellular/PCS *Voice Band CODEC (GM 0936 TQ) Tx AGC BBA Synth. LNA REF. *GDC 6 P 1310 TQ Mixer Ant. APPLICATION Rx AGC *GDC 6 P 1320 TQ 32 Mobile Station Modem SRAM Flash Memory * Coming Soon System IC SBU ( Dec. 1999 / Rev. 01 )

SUPER I/O MICRO PERIPHERAL ⓐ : GM 82 C 803 C(Prime 3 C) ⓑ : Line Drivers / Receivers Available Not Available Printer EPP/ ECP (CD-ROM, HDD, FDD) ⓑ Super I/O Part Memory Part GD 75232 ⓐ GD 75232 External Storage used by ⓒ : SIR Module External Fax / Modem Serial Mouse ⓒ Main Chipset Part CPU Part BIOS Part (Main Board) 33 System IC SBU ( Dec. 1999 / Rev. 01 )

MICRO PERIPHERAL FUNCTION GUIDE SECTION DEVICE PACKAGE Super I/O GM 82 C 803 C 100 PQFP SCSI GM 82 C 700 68 PLCC/80 QFP UART GM 16 C 550 40 DIP, 44 PLCC/QFP GD 75232 GD 75323 Line Dirver / Receiver FUNCTION 2. 88 MB FDC, UART with FIFO, EPP/ECP PIO, IDE, SIR, PC 95 Compatible Fast SCSI-2 Controller REF. SMC 37 C 669 AIC 6360 UART with 16 byte FIFOs NS 16 C 550 20 DIP/SOP EIA RS-232 D Interface (3 D/5 R) SN 75 C 185 20 DIP/SOP EIA RS-232 D Interface (5 D/3 R) Own 34 System IC SBU ( Dec. 1999 / Rev. 01 )

TELECOM FUNCTION GUIDE Cordless Telephone Hand-set Single In Line Telephone & Cordless Telephone Base-set GM 6530/32/35 DPLL E 2 PROM GL 3361 GL 6840 A/B GL 6850/1 Compander Ringer DPLL GL 6551 GL 6552 FM IF Dialer Compander GL 6965 GL 6962/A Speech FM IF GMS 81 C 6004 Dialer 1 4 7 * 2 5 8 0 3 6 9 # Key Pad Microcontroller GMS 81 C 6004 Speaker MIC HEI Products 35 System IC SBU ( Dec. 1999 / Rev. 01 )

TELECOM SECTION FUNCTION GUIDE DEVICE PACKAGE GL 6551 20 DIP/SOP Low Operating Voltage : 2. 4 ~ 7 V Total Gain : 10 ~ 100 d. B TK 10651 GL 6552 14 DIP/SOP Built-in Auto Level Control KA 8512 GL 3361 16 DIP/SOP Low Power FM IF for CT MC 3361 C GM 6530 16 DIP/SOP 15 Ch, Selecting for 46/49㎒ CT (Serial Interface) MC 145169 GM 6532 16 DIP/SOP 10 Ch, Selecting for 45/48㎒ CT (Parallel Interface) HYL 21014 GM 6535 16 DIP(300 MIL) 16 SOP(150 MIL) Universal Programmable PLL for CT MC 145162 GL 6965 20 DIP External Adjustable Transmitting, Receiving & Side Tone Gains TA 31065 N GL 6962/A 16 DIP/SOP Auto Gain Control, Low Operating Voltage TEA 1062/A GL 6840 A/B 8 DIP Internal Rectifier Bridge & Zener Diode L 3240/1240 GL 6850/1 8 DIP Adjustable 2 -frequency Tone X-point Switch GM 62093 A 40 DIP CMOS 12 x 8 Cross Point Switch with Control Memory LED Driver GM 6486 40 DIP / 44 PLCC Compander FM IF DPLL Speech FUNCTION REF. Ringer 33 Output LED Driver 36 KA 2410/1 M 093 MM 5486 System IC SBU ( Dec. 1999 / Rev. 01 )

T V / REMOCON / OTHERS FUNCTION GUIDE DEVICE PACKAGE GL 3812 22 DIP Audio/Video Switch GL 3820 8 DIP Video Switch GL 3276 A 8 SOP Preamplifier for Remote Control Use GL 3277 8 SOP Preamplifier for Remote Control Use (Enhanced immunity against noise, Support RC-5) OWN SMPS GL 494 16 DIP/SOP Voltage Mode PWM Control Circuit TL 494 Leakage Detector GL 7101 8 DIP/SOP Earth Leakage Current Detector Sync. Deflection Circuit GL 1151 20 DIP Clock Driver HC 2509 HC 2510 24 TSSOP Memory Register HG 74 ALVC 16835 C HG 74 ALVC 168235 C 56 TSSOP/ SSOP SECTION FUNCTION REF. Own TV Remocon Horizontal Phase Shifter AFC, Sawtooth Wave Generator PLL Clock Distribution for Synchronous DRAM Application 18 -bit Universal bus Driver Designed for 2. 3 V to 3. 6 V Operation 37 TEA 2014 m. PC 2800 AGR M 54122 L LA 7851 PI 6 C 2509 PI 6 C 2510 PI 74 ALVC 16334 System IC SBU ( Dec. 1999 / Rev. 01 )

LCD Drive IC FUNCTION GUIDE ▣ TFT-LCD MODULE BLOCK DIAGRAM VGA CARD LCD MODULE Source Driver VGA Card L V D S Controller (ASIC) Gate Driver TFT-LCD Panel DC-DC Converter 38 System IC SBU ( Dec. 1999 / Rev. 01 )

LCD Drive IC SECTION FUNCTION GUIDE DEVICE PACKAGE FUNCTION REF. GM 10 S 6401 TCP TFT-LCD Source Driver / 6 bit / 384 Ch. Output VS 3384 GM 10 S 6402 TCP TFT-LCD Source Driver / 6 bit / 384 Ch. Output TMS 57561 HD 66324 GM 10 S 8401 TCP TFT-LCD Source Driver / 8 bit / 384 Ch. Output / 10 V u. PD 16750 GM 10 S 8402 TCP TFT-LCD Source Driver / 6 bit / 384 Ch. Output / 15 V T 6 L 50 *GM 10 G 5251 TCP TFT-LCD Gate Driver / 256 Ch. Output *GM 10 G 5252 TCP TFT-LCD Gate Driver / 256 Ch. Output / Output Mod. *GM 11 S 1201 TCP / COG HL 14203 TFT-LCD STN-LCD TMS 57605 Own SED 1565 QFP Segment type LCD Driver / 3 Com * 42 Seg LC 75853 HL 15203 SEG-LCD STN-LCD Driver / 65 Com * 132 Seg QFP Segment type LCD Driver / 3 Com * 52 Seg LC 75823 HL 15703 QFP Segment type LCD Driver / 3 Com * 57 Seg LC 75883 HL 14104 QFP Segment type LCD Driver / 4 Com * 41 Seg LC 75854 HL 15604 QFP Segment type LCD Driver / 4 Com * 56 Seg Own * Coming Soon 39 System IC SBU ( Dec. 1999 / Rev. 01 )

Audio Section FUNCTION GUIDE 144 QFP/LQFP QS 3000 Application Ref. • PCI FM Sound Controller • Hardwired 3 D Effect PC Sound Own 100 FP/LQFP • PCI FM Audio Controller with Softwired 3 D • Wavetable & Audio Station Software Support PC Sound Own QS 1500 100/148 QFP • 64 Poly Wave Table Sound DSP • Max 24 M ROM & AC 97 Codec Compatible • Reverb & Chorus, Mic Echo Game Machine Music Instrument Own QS 1000 100 QFP • Wave Table 2 Chip Sound DSP • 4/8/16 M ROM Compatible KARAOKE, VCD Own QS 1080 100 QFP • Wave Table 1 Chip Sound DSP • 8 M ROM Compatible Built-in KARAOKE, VCD Own GMAC 9704 48 LQFP • High Performance Audio CODEC • 18 bit Full Duplex Stereo D/A, A/D PC, MP 3 STAC 9704 GMAC 9708 48 LQFP PC, MP 3 STAC 9708 GM 0560 DAC& Codec Package QS 3100 DSP& Controller Device Funtion 24 SSOP DVD, DBS, Karaoke, MP 3 PCM 1727 GM 0561 20 SSOP DVD, DBS, Karaoke, MP 3 PCM 1720 GM 0550 24 SSOP DVD, DBS, Karaoke, MP 3 PCM 1723 GM 0551 20 SSOP DVD, DBS, Karaoke, MP 3 PCM 1720 GM 0552 GM 0553 20 SSOP DVD, DBS, Karaoke, MP 3 PCM 1717 PCM 1718 • High Performance Audio CODEC • 2 Additional DAC's for Multi-Channel Application • High Performance Audio DAC • 384 fs/768 fs or 33. 8688 MHz System Clock • Dual PLL, 96 d. B Dynamic Range • High Performance Audio DAC • 384 fs/768 fs or 33. 8688 MHz System Clock • 96 d. B Dynamic Range • High Performance Audio DAC • 256 fs/384 fs/768 fs System Clock • BPZ Control, De-emphasis • High Performance Audio DAC • 256 fs/384 fs/768 fs System Clock 40 System IC SBU ( Dec. 1999 / Rev. 01 )

0 PRODUCT LINE - UP 1 0 DIGITAL MEDIA 2 0 MCU 3 0 MIXED SIGNAL 4 1 IMAGING TECHNOLOGY 5 0 MERGED MEMORY LOGIC 6 0 FOUNDRY & ASIC 7 0 SALES NETWORK 8 41 System IC SBU ( Dec. 1999 / Rev. 01 )

CMOS Image Sensor Features ¨ 800 x 600, 640 x 480, 400 x 300 Pixels ¨ 8 um x 8 um Square Pixels ¨ High Efficiency, Low Voltage Photosensor with on chip RGB color filters and microlens ¨ Integrated 8 -bit ADC for Direct Digital Output Built-in AGC ¨ Digital Correction of Fixed Pattern Noise Row Driver ¨ Integrated Pan and Window Control ¨ Clock Speed up to 15 Mhz for 30 fps Operation Color /B&W Pixel Array ¨ Programmable Frame Rate and Readout Mode I 2 C ¨ Control through Standard I 2 C Bus ¨ 3. 3 V (5 V tolerant), 65 m. W@30 fps of SVGA Timing and Control Register ADC Block Line Buffer Horizontal Select 42 8 bit System IC SBU ( Dec. 1999 / Rev. 01 )

Digital Imaging Systems Analog CCD Imager Programmable Driver v PC Video Input Device (PVID) CDS/ADC/AGC Timing Gen. DC/DC Converter Digital CMOS Pixel Array Digital Processing and Interface PC System Direct Display Communication channel * Low Power Consumption - Mobile Application * Single Power Supply * SOC (System On a Chip) - Lower System Cost * Ideal for PC and Digital Communication ADC Buffer 43 System IC SBU ( Dec. 1999 / Rev. 01 )

Row Driver Functional Block Diagram Control Signals CMOS Pixel Color /B&W Pixel Array Analog Output ADC Block Digital Noise Filter Line Buffer 8 bit Voltage I 2 C Timing and Control Register 1. 7 V Horizontal Select Intensity x Time 44 System IC SBU ( Dec. 1999 / Rev. 01 )

CMOS Image Sensor Product SECTION HV 7141 B 48 CLCC 800 x 600 Effective pixels, Integrated 8 -bit ADC with Built-in AGC VGA HV 7131 B 48 CLCC /20 CDIP 640 x 480 Effective pixels, Integrated 8 -bit ADC with Built-in AGC CIF HV 7121 B 48 CLCC 400 x 300 Effective pixels, Integrated 8 -bit ADC with Built-in AGC SVGA HB 7141 B 48 CLCC 800 x 600 Effective pixels, Integrated 8 -bit ADC with Built-in AGC VGA HB 7131 B 48 CLCC /20 CDIP 640 x 480 Effective pixels, Integrated 8 -bit ADC with Built-in AGC CIF HB 7121 B 48 CLCC 400 x 300 Effective pixels, Integrated 8 -bit ADC with Built-in AGC ISP Black /White PACKAGE SVGA Color DVICE FEATURE H 1 A 424 M 167 64 LQFP Comp. /USB Controller HSE 401 100 PQFP Dedicated sensor control and signal processing chip for HYUNDAI CMOS Chipset HYUNDAI Image Compression & Maple bus interface & DSP/ISP interface 45 System IC SBU ( Dec. 1999 / Rev. 01 )

Black & White CCD Camera DISPLAY EIA/CCIR Type CCD Image Sensor Signal Processor GCA 325/29 DB VIDEO OUTPUT GCD 4402 LENS Monitor Vertical Clock Driver Timing Generator GCD 1001 S GCD 5412 HEI Products 46 System IC SBU ( Dec. 1999 / Rev. 01 )

B/W CCD Camera DISPLAY DEVICE PACKAGE FUNCTION GCA 325 DB 16 PLASTIC DIP 250 K EFFECTIVE PIXELS. EIA TYPE ICX 054 AL GCA 329 DB 16 PLASTIC DIP 290 K EFFECTIVE PIXELS. CCIR TYPE ICX 055 AL GCD 1001 S 16 SSOP VERTICAL CLOCK DRIVER FOR CCD SYSTEM GCD 5412 48 TQFP TIMING & SYNC PULSE GENERATOR GCD 4402 32 TQFP SIGNAL PROCESSOR FOR B/W CCD CAMERA 47 REF. OWN CXD 2400 R CXA 1310 AQ System IC SBU ( Dec. 1999 / Rev. 01 )

Digital Color CCD Camera DISPLAY NTSC/PAL Type CCD Image Sensor CDC GCA 325/329 DC GCD 4002 DSP GCD 4101/AT ANALOG Output CCIR 656 Digital Output LENS *GCD 4102 Vertical Clock Driver Timing Generator Camera Controller USB Interface GCD 1001 S GCD 2101 GMS 81516 GCD 3001 A USB Output CDC : CCD to Digital Converter DSP : Digital Signal Processor USB : Universal Serial Bus HEI Products * Coming Soon 48 System IC SBU ( Dec. 1999 / Rev. 01 )

Color CCD Camera DISPLAY VGA Type : New Feature CCD Image Sensor CDC GCA 333 KC GCD 4002 LENS Vertical Clock Driver DSP GCD 1001 S GCD 4132 USB Output CDC : CCD to Digital Converter DSP : Digital Signal Processor USB : Universal Serial Bus HEI Products * Coming Soon 49 System IC SBU ( Dec. 1999 / Rev. 01 )

Color CCD Camera DISPLAY DEVICE PACKAGE FUNCTION REF. GCA 325 DC 16 PLASTIC DIP 250 K Effective pixels NTSC type CCD image sensor ICX 054 AK GCA 329 DC 16 PLASTIC DIP 290 K Effective pixels PAL type CCD image sensor ICX 055 AK GCA 333 KC 16 PLASTIC DIP 330 K Effective pixels VGA type CCD image sensor ICX 084 AK GCD 1001 S 16 SSOP Vertical CCD clock driver OWN GCD 2101 48 TQFP Timing clock generator for NTSC/ PAL CCD camera OWN GCD 4101/AT 100 LQFP Digital signal processor for NTSC/ PAL CCD color camera OWN GCD 4002 48 LQFP CCD output to 10 bit digital converter (CDS/AGC/ADC) OWN GCD 3001 A 100 TQFP USB camera interface OWN GCD 4132 100 LQFP 1 ST USB Image signal processor for VGA OWN GMS 81516 64 LQFP Camera controller OWN 50 System IC SBU ( Dec. 1999 / Rev. 01 )

0 PRODUCT LINE - UP 1 0 DIGITAL MEDIA 2 0 MCU 3 0 MIXED SIGNAL 4 0 IMAGING TECHNLOLGY 5 1 MERGED MEMORY LOGIC 6 0 FOUNDRY & ASIC 7 0 SALES NETWORK 8 51 System IC SBU ( Dec. 1999 / Rev. 01 )

0. 35µm MDL* Technology Items HDL 350/HDL 350 A HDL 351 1. 58 0. 84 Lreal (n/p) (Logic) [µm] 0. 4/0. 45 0. 4/0. 4 Main Supply Voltage [V] 3. 3, 5 3. 3 I/O Supply Voltage [V] 3. 3/5 3. 3(/5) 0. 75/-0. 85 0. 65/-0. 65 400/200, 680/410 545/260 Ioff [p. A/µm] <1 <5 Gate Ox. Thickness [Å] 100 70/125 Triple Well Poly-Si, Diffusion W-Polycide, Ti-Silicide CMP/SOG-EB Now (DRAM Cell) [µm 2] VTn/VTp [V] ID, sat (n/p) [µA/µm] Well Gate, S/D Planarization Availability * : Merged DRAM Logic 52 System IC SBU ( Dec. 1999 / Rev. 01 )

0. 25µm/0. 18µm MDL Technology Items HDL 250 HDL 180 Process Technology 0. 25µm 0. 18µm DRAM Cell Structure Stack(Cylinder) Lreal (n/p) (Logic) [µm] 0. 25/0. 3 0. 18/0. 18 Core Supply Voltage [V] 2. 5 1. 8 2. 5(/3. 3/5) 1. 8(/3. 3) Metal Layer 3~5 4 -6 Availability Now Spice Para. : Nov. ’ 99, Prod. : Dec. ’ 00 I/O Supply Voltage [V] 53 System IC SBU ( Dec. 1999 / Rev. 01 )

MDL Library Features Library Name HDL 350/ HDL 350 A HDL 250 Process Technology 0. 35µm 0. 25µm Route Layers 3 3/4/5 Supply Voltage[V] 3. 3/5 2. 5 Primitive 335 I/O 296 Cell Density(Kgates/mm 2) 13. 3 32 Logic cell Speed(NAND 2, 2 FO) 143 ps/105 ps 83 ps Power Dissipation(W/gate/MHz) 0. 28 u/0. 92 u 0. 08 u Max. I/O Current 24 m. A Special I/O PCI*, AGP*, USB*, GTL*, SCSI*, HSTL*, SSTL*, PECL* TBD No. of Cells * : 3. 3 V only 54 System IC SBU ( Dec. 1999 / Rev. 01 )

MDL Core Items HDL 500 HDL 350/350 A HDL 250 Process 0. 5µm 0. 35µm 0. 25µm Features 16 Mb(x 16), Fast Page, 5 V 16 Mb(x 16), EDO, 5 V 1 Mb(x 16), EDO, 3. 3/5 V 2 Mb(x 16), EDO, 3. 3/5 V 4 Mb(x 16/x 64), SDRAM, 3. 3/5 V 16 Mb(x 16), EDO, 3. 3/5 V 16 Mb(x 32), SDRAM, 2. 5/3. 3 V 32 Mb(x 512), SDRAM, 2. 5/3. 3 V 64 Mb(x 16), SDRAM, 3. 3 V Availability Now Now 55 System IC SBU ( Dec. 1999 / Rev. 01 )

Compiler Cell Overview Compiler Type HDL 350 HDL 250 Process Technology 0. 35µm MDL 0. 25µm MDL ASPRAM 8~128 K 4 Q, ’ 99 ATPRAM - - ADPRAM 8~64 K - SSPRAM 8~64 k SDPRAM 8~64 k ROM 16~512 k Multiplier - - 56 System IC SBU ( Dec. 1999 / Rev. 01 )

0 PRODUCT LINE - UP 1 0 DIGITAL MEDIA 2 0 MCU 3 0 MIXED SIGNAL 4 0 IMAGING TECHNLOLGY 5 0 MERGED MEMORY LOGIC 6 1 FOUNDRY & ASIC 7 0 SALES NETWORK 8 57 System IC SBU ( Dec. 1999 / Rev. 01 )

Logic Process Technology FEATURES Items HL 80 S 13 HL 60 S 13 HL 50 S 13 HL 35 S 14 HL 25 S 15 HL 18 S 16 Process Technology 0. 8㎛ 1 P 3 M 0. 6㎛ 1 P 3 M 0. 5㎛ 1 P 3 M 0. 35㎛ 1 P 4 M 0. 25㎛ 1 P 5 M 0. 18㎛ 1 P 6 M Operating Voltage [V] 5 5 5 3. 3 2. 5 1. 8 Mask Layers 14 14 13 16 18 20 Twin Well 175 145 130 73 50 38 LOCOS STI Si. O₂ NO NO Gate Poly Single N-type Dual gate Gate Materials WSi₂ polycide Ti-salicide Co-salicide Source/Drain Diffusion only Ti-salicide Co-salicide Metalization Tapered Ti. W/AL/Ti. W Ti/Ti. N/W-plug Ti/AL/Ti/Ti. N Double Poly Flat ROM Now Well Tox(Electrical) [Å] Isolation Gate Oxide Option Process Availability Retro. Twin Well Ti/CVD-Ti. N/W IMP-Ti/CVD-Ti. N (W-CMP option) W-CMP Ti/AL/Ti/Ti. N Dual Gate Oxide Double Poly Triple Well Under Development Flat ROM Low Vt 1. 8 V Standard Flat ROM 3. 3 V Standard Now 58 Now Spice Para : Now System IC SBU ( Dec. 1999 / Rev. 01 )

High Voltage Process Technology Items 1. 2µm Operating Voltage(Vd/Vg) 170(300)V/5 V FEATURES 0. 8µm 0. 6µm 0. 5µm 40 V/40 V 12 V/12 V 16 V/16 V 20 V/5 V 40 V/40 V 18 V/18 V SOI P-substrate P-substrate 23(22) 20 20 22 19 21 17 Device Structure LDMOS Bi-Directional Spacer DDD Channel Length [µm] 3. 0(5. 0) 2. 0 3. 0 1. 6 2. 0 3. 0 Drift Length [µm] 9. 0(18. 0) 4. 0 - - 1. 4 4. 0 - Gate Oxide [Å] 500 1000 385 460 145 1000 600 Availability Now Now Starting Materials Mask Layers Bi-Directional Uni-Directional DDD Spacer DDD LDMOS 59 System IC SBU ( Dec. 1999 / Rev. 01 )

Flash Process Technology Items FEATURES HFL 350 HFL 250 0. 35µm 0. 25µm 1. 32 0. 71 0. 4/0. 4 0. 25/0. 30 3. 3 2. 5 I/O Supply Voltage [V] 3. 3(/5) 2. 5/3. 3 VTn/VTp [V] 0. 6/-0. 7 0. 55/-0. 8 ID, sat (n/p) [µA/µm] 545/260 570/250 Ioff [p. A/µm] <5 <10 Tunneling Ox. Thickness [Å] 100 70 Triple Well Ti-Salicide, Ti-Salicide W-Polycide, Ti-Salicide CMP/SOG-EB CMP Now Spice Para : Apr. ’ 00, Prod. : Jan. ’ 01 Process Technology (Flash Cell) [µm 2] Lreal (n/p) (Logic) [µm] Main Supply Voltage [V] Well Gate, Source/Drain Planarization Availability 60 System IC SBU ( Dec. 1999 / Rev. 01 )

OTP Process Technology FEATURES F Design Rule 0. 6 um F Mask Layers 25(27) , Double Poly Triple Metal F Starting Material P(100), Non-Epi, 9~10 Ω/㎠ F Well CMOS Twin-Well Structure F Isolation Conventional LOCOS, Bird’s Beak=0. 18 um/side F Transistor Normal Tr. , High Voltage Tr. , EPROM Tr. Gate Length (Ldrawn) NV / HV / EPROM 0. 60 um / 1. 4 um / 0. 6 um Channel Buried channel PMOS Gate Material Only N-type poly-Si (POCL 3 Doped) F Inter-Layer-Dielectric Thermally reflowed BPSG over TEOS based LPCVD F Metallization materials sandwitch structure of Ti. W/AL/Ti. W PE- F Inter-metal dielectric TEOS/Etch-backed SOG/PE-TEOS structure F Passivation dielectric PSG based APCVD F Final Film material PIQ Coating F EPROM Cell Size 10. 54µm² F Data Retension 38 years for 75℃ F ESD MM 300 V↑, HBM 3000↑ 61 System IC SBU ( Dec. 1999 / Rev. 01 )

ASIC Library FEATURES Items Library Name Gate Array Standard Cell HSG 500/501 HSC 600 A/600 HSC 501/500 HSC 350 HSC 250 0. 5µm 0. 6µm 0. 5µm 0. 35µm 0. 25µm 2 -3 2 -3 3 -4 3 -5 3. 3/5 3. 3 2. 5 Primitive 314/313 309 348 335 I/O 316/400 116 87 88 323 7. 6 7. 2 9 18 32 Logic cell Speed(NAND 2, 2 FO) 195 ps/185 ps 342 ps/224 ps 191 ps/174 ps 90 ps 70 ps Power Dissipation(W/gate/MHz) 1. 7 u/2. 3 u 0. 41 u/0. 92 u 0. 29 u/0. 64 u 0. 19 u 0. 15 u 24 m. A 8 m. A 12 m. A PCI, AGP, SSTL, PECL, LVDS, USB IEEE 1394 Process Technology Route Layers Supply Voltage[V] No. of Cells Cell Density(Kgates/mm 2) Max. I/O Current Special I/O PCI*, SCSI*, HSTL*, SSTL*, GTL* PCI * : 3. 3 V only 62 System IC SBU ( Dec. 1999 / Rev. 01 )

Compiler Cell Overview Compiler Type FEATURES HSC 600 A/600 HSC 501/500 HSC 350 HSC 250 0. 6µm 0. 5µm 0. 35µm 0. 25µm Async. RAM 128~64 K 128~72 K 16~72 K Async. Two Port RAM 128~32 K 16~72 K Async. Dual Port RAM 128~16 K 16~72 K Sync. RAM 256~64 K 128~147 K 16~72 K - - - 16~72 K 256~128 K 128~256 K 8~72(DP) 8~64 Process Technology Sync. Dual Port RAM ROM Multiplier 63 System IC SBU ( Dec. 1999 / Rev. 01 )

IP FEATURES Overview Items RISC MCU/DSP • ARM Family • Hyperstone Analog • 80 XX • 65 C 02 • Z 80 • 80186 • OAK DSP • DSP 3 B • HDC 23 D 801 Feature Bus & Peripherals • ADC • DAC • PLL • IEEE 1394 PHY(2 Q, ’ 00) • PCI • USB • RAMBUS RAC • IEEE 1394(2 Q, ’ 00) • RS-ECC • 10/100 MAC • QPSK, Viterbi ARM Family / Hyperstone(32 bit RISC Core) Items ARM 710 A ARM 7 TDMI ARM 720 T Hyperstone Process Technology 0. 6µm TLM 0. 35µm TLM 0. 6/0. 35µm TLM Operating Voltage [V] 5/3. 3 5/3. 3 40 MHz@5 V, 26 MHz@3. 3 V 60 MHz@3. 3 V 60 MHz@5 V, 108 MHz@3. 3 V Synopsys, VSS, Verilog-XL Verilog-XL 2, 300 x 1, 300 4, 900 x 4, 500 1, 200 x 1, 800 3, 500 x 3, 500 8, 500 x 6, 900/0. 6µm 4, 500 x 4, 000/0. 35µm 0. 6 m. A/MHz/@3. 3 V 1. 8 m. A/MHz/@3. 3 V 0. 6 m. A/MHz/@3. 3 V 1. 1 m. A/MHz/@3. 3 V - - Available Performance Simulation Model Core Size [µm²] Power Consumption Sample Chip 64 System IC SBU ( Dec. 1999 / Rev. 01 )

IP FEATURES DSP Core Items OAK DSP 3 A/DSP 3 B HDC 23 D 801 0. 35µm 0. 6µm/0. 35µm 3. 3 5/3. 3 80 Mips 40 Mips/80 Mips 42 Mips Synopsys, Verilog Model VHDL Model 5, 000 x 5, 100 1, 280 x 2, 570(DSP 3 B) 4, 600 x 5, 200(except Memory) Power Consumption 1. 2 m. A/Mips 1. 12 m. A/Mips@3. 3 V(DSP 3 B) 4. 6 m. A/Mips@3. 3 V Design Type RTL + Gate RTL Application MP 3 Decoder DVD, Modem, PCS AC 3 + Virtual 3 AC 3 + Prologic MPEG Layer I, II Process Operating Voltage[V] Performance Simulation Model Core Size(µm²) 65 System IC SBU ( Dec. 1999 / Rev. 01 )

ASIC Design Procedure / Tools PROCEDURE/TOOLS Design Process Leading EDA Tool In-house Tool Function Sim. Verilog-XL, Model. Sim* VELA (Delay Calculator) Logic Synthesis Design Compiler PCALC Design for Test Compiler, Test. Gen, Syntest Formal Verif. Design Verifyer Timing Verif. Prime. Time, Pearl P&R Planet, Apollo (Power Calculator) Toggle. Counter (Toggle Rate Extractor) AWAVE (Waveform Viewer) DRC/LVS Dracula, Hercules, Calibre TRC LPE Star-RC (Test Rule Checker) * Memory model requested by customers. 66 System IC SBU ( Dec. 1999 / Rev. 01 )

ASIC Design Flow Memory Model Generation(Veri. Gen) DESIGN FLOW . v . V /. VHD RTL Description (VHDL/Verilog-HDL) Function Simulation (Verilog-Turbo/Model. Sim) Formal Verification (Design Verifyer) . V Logic Synthesis (Design Compiler). vcd, . shm . V &. SDF from Vela Fault Simulation (Turbo. Fault) ATPG (Test. Gen) Simulation Result Analysis (AWAVE/Sim. Wave/ Turbo. Wave) Formal Verification (Design Verifyer) Static Timing Anal. (Prime. Time) Full scan Insertion (Test Compiler) . V. V &. SDF from Vela Formal Verification (Design Verifyer) Static Timing Anal. (Prime. Time). V. vcd, . shm. out Tabular . VCD Tr. - level Power Anal. (Power. Mill/Star. Sim) . VHD : VHDL Netlist. V : Verilog HDL Netlist. SPI : Spice Netlist. SPF : Standard Parasitic Format. SDF : Standard Delay Format. VCD : Value Change Dump Data . V Gate-level Sim. (Verilog-XL/Model. Sim) Gate-level Power Anal. (PCALC) . SPF &. V Floorplanner (Planet) P&R (Apollo) Vector TRC to Tester . SDF &. V. SDF Vela Screener . SPF . V. SPI Verilog 2 Spice (Vela) . SPI DRC/LVS (Dracula/Hercules/Calibre) 67 LPE (Star-RC) System IC SBU ( Dec. 1999 / Rev. 01 )

ASIC Design Kit Availability Function DESIGN KITS Tool Name Vendor Version Note Design Compiler Synopsys 9708+ - Composer Cadence 97 A - Verilog-XL Cadence 2. 5+ - Model. Sim Mentor 0. 35 um VCS Synopsys ‘ 99. 4 Q NC-sim Cadence ‘ 99. 4 Q Prime. Time Synopsys 2. 1 - Pearl Cadence 3. 3 - Motive Synopsys 5. 1 Except 0. 25 um Sunrise Synopsys 2. 3 b+ - Test Compiler Synopsys 9708+ - Apollo Avant! 98. 4. 3. 2. 0. 26 - Delay Calculator Vela - 2. 5. 0 Utility Test Rule Checker TRC - 1. 0. 2 Utility Synthesis Schematic Capture Gate-level Simulation Static-Timing Analysis DFT Place & Route 68 System IC SBU ( Dec. 1999 / Rev. 01 )

ASIC Design Support & MCS DESIGN SUPPORT ASIC Design Support HYUNDAI supports each step of sign-off flow by expert design engineers to resolve client`s technical needs. q q q q STA(Static Timing Analysis) Service DFT(Design For Testability) Service Special Cell Circuit / Layout Design Physical Place/Route, Verification (DRC, LVS) Layout Merge Metal Revision EDA Design Kit Technology Porting Multi-Chip Service(MCS) Benefits q Vehicle for prototype or module verification q Cost reduction on prototyping q Super hot run in fab 69 System IC SBU ( Dec. 1999 / Rev. 01 )

Package Availability PACKAGE GUIDE Pin Count PKG Type 100 PDIP SOIC SOJ 8 14 16 18 20 24 28 32 36 40 42 8 14 16 TSSOP PLCC 20 28 36 44 48 24 28 32 40 500 600 20 56 ◀ ‘ 98. 2 Q 44 48 20 24 48 28 32 44 52 68 (64) (80) (i) 64 PQFP 32 40 44 48 52 64 84 100 128 144 160 (i) (i) (i) 80 100 80 128 100 BQFP 120 144 160 144 184 208 (i) 184 208 304 * ( i ) meams I-QUAD PKG 304 176 132 119 PBGA PPGA 400 44 MQUAD TQFP 300 200 64 20 24 28 32 SSOP TSOP 48 169 192 196 208 225 256 272 313 324 352 388 420 456 468 492 (50 (E) (M) (E) * (M) meams MBGA (E) means EPBGA All lead counts are available 70 System IC SBU ( Dec. 1999 / Rev. 01 )

0 PRODUCT LINE - UP 1 0 DIGITAL MEDIA 2 0 MCU 3 0 MIXED SIGNAL 4 0 IMAGING TECHNLOLGY 5 0 MERGED MEMORY LOGIC 6 0 FOUNDRY & ASIC 7 1 SALES NETWORK 8 71 System IC SBU ( Dec. 1999 / Rev. 01 )

Sales Network Head Quarters HYUNDAI Micro. Electronics Seoul Office Hyundai Micro. Electronics Young. Dong B/D, Daechi-dong, Kangnam-gu Seoul , 135 -738, KOREA • Digital Meida MCU Mixed Signal Merged Memory Logic Domestic Sales : D. S Kim Overseas Sales : James Choi Manager Tel : (82)2 -3459 -3451 Tel : (82)2 -3459 -3542 E-mail : Stephano@hmec. co. kr E-mail : jimchoi@hmec. co. kr • Foundary & ASIC Domestic Sales : J. S Shim Overseas Sales : C. S Choi Senior Manager Tel : (82)2 -3459 -3375 Tel : (82)2 -3459 -3389 E-mail : shimjs@hei. co. kr E-mail : choics@hmec. co. kr • Imaging Technology Domestic Sales : J. M Woo Overseas Sales : J. C Park Senior Manager Tel : (82)336 -630 -2039 Tel : (82)336 -630 -2151 E-mail : jmwoo@hei. co. kr E-mail : parkjc@hei. co. kr HEA HEC HYUNDAI Micro. Electronics America Inc 3101, North First Street San Jose, CA 95134 HMEC Beijing Office Rm. 1902, Landmark Bldg. 8 North Dongsanhuan District, Beijing, China Tel : (1)408 -232 -8000 Fax : (1)408 -232 -8135 HMEC Shanghai Office HEU Rm. 1702, 17 th Fl. , No. 2200, Yan An Xi Road Shanghai, 200335, P. R. C. HYUNDAI Micro. Electronics U. K. Co. , Ltd. 241 Brooklands Road, Weybridge, Surrey, KT 13 ORH. UK Tel : (4)1932 -827 -7739 Fax : (44)1932 -827 -7746/7 HYUNDAI Micro. Electronics Hongkong Co. , Ltd. RM. 1602, 16 F, Bank of America Tower, 12, Harcourt Road, H. K. HYUNDAI Micro. Electronics Deutschland GMBH. Tel : (49)6142 -921 -229 Fax : (49)6142 -921 -214 Tel : (852)2841 -2015 Fax : (852)2971 -1622 HET HYUNDAI Micro. Electronics Taiwan Co. , Ltd. HES 8 F No. 161, Min Sheng E. Rd. , Sec. 2, Taipei, Taiwan, R. O. C HYUNDAI Micro. Electronics ASIA PTE. Co. , Ltd. #42 -02, Suntec City Tower 1, 7 Temasek Boulevard, Singapore 038987 Tel : (86)21 -5257 -0496/7 Fax : (86)21 -6209 -2686 HEH HED Frankfurter Str. , 107 D-65479 Raunheim, Germany Tel : (86)10 -6590 -9634 Fax : (86)10 -6590 -0908 Tel : (65)432 -4553 Fax : (65)336 -5933 Tel : (886)2 -2500 -8357 Fax : (886)2 -2509 -8977 HEJ HYUNDAI Micro. Electronics Japan Co. , Ltd. 9 Fl. , Yurakucho Denki Bldg. , 1 -7 -1 Yurakucho Chiyoda-Ku, Tokyo, Japan 72 Tel : (81)3 -3211 -1095 Fax : (81)3 -3211 -5447 System IC SBU ( Dec. 1999 / Rev. 01 )

Hyundai Micro. Electronics Young. Dong B/D, Daechi-dong, Kangnam-gu Seoul , 135 -738, KOREA Tel : 82 -2 -3459 -3883 Fax: 82 -2 -3459 -5842/5843 E-mail : dcleem@hmec. co. kr http: //www. hyundaimicro. co. kr 73 Printed In Korea Dec. 1999 / Rev. 01