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Blind Micro-vias Embedded Resistors Multi-Tier Boards Chip-on-flex RF Product Multi-chip Modules Embedded Capacitance 2/8/08 Blind Micro-vias Embedded Resistors Multi-Tier Boards Chip-on-flex RF Product Multi-chip Modules Embedded Capacitance 2/8/08 Capabilities Overview Compunetics, Inc. Fine-line Technology

Agenda • Corporate Overview • Compunetics, Inc. Company Profile • Current Capabilities • Technology Agenda • Corporate Overview • Compunetics, Inc. Company Profile • Current Capabilities • Technology Roadmap • Future Plans • Samples 2/8/08 Compunetics, Inc.

Corporate Overview l 30+ Years Experience in Design, Development and Manufacture of Highly-sophisticated Electronic Corporate Overview l 30+ Years Experience in Design, Development and Manufacture of Highly-sophisticated Electronic Systems l Telecommunications, Medical, Industrial, Transportation and Government Markets l Internal Control over Manufacturing l 330+ Employees 2/8/08 Compunetics, Inc.

Corporate Overview Compunetix, Inc. Compunetics, Inc. Chorus Call, Inc. USA Instrumentation Systems Division Communication Corporate Overview Compunetix, Inc. Compunetics, Inc. Chorus Call, Inc. USA Instrumentation Systems Division Communication Systems Division Printed Circuit Board Group Chorus Call International Switzerland Germany Italy India South Africa Greece Brazil Canada Australia Video Systems Division Federal Systems Division 2/8/08 Compunetics, Inc.

Company Profile Compunetics, Inc. Manufacturing Engineering Quality Services Global Products Production Engineering Group Consisting Company Profile Compunetics, Inc. Manufacturing Engineering Quality Services Global Products Production Engineering Group Consisting Of 8 Engineers Dedicated To Managing / Fabricating Critical Or Technologically Challenging Projects 2/8/08 Sales / Marketing Company Differentiators Compunetics, Inc. Engineering Services PCB Layout & Design To Handle Customer Design Overflow And To Give Support To Customer’s Design Group

Company Profile l l l l l 2/8/08 SBA/FAR 19 Small Business 38 Years Company Profile l l l l l 2/8/08 SBA/FAR 19 Small Business 38 Years Experience Producing Complex Interconnect Systems Customers in Commercial, Education, Telecommunication, and Government Markets Independent Internal R&D ESOP 2007 Revenues: $11. 0 Million 70+ Employees 25+ Engineers and Professionals ISO 9001: 2000 Registered and MIL Spec Certified Compunetics, Inc.

Company Profile Quality Certifications • ISO 9001: 2000 Registered • UL Certified for Single Company Profile Quality Certifications • ISO 9001: 2000 Registered • UL Certified for Single / Double Sided and Multilayer Boards • ITAR Registered • MIL-P-55110 Certified for FR 4, Polyimide • General Dynamics Land Systems Certified for Prototypes and Production • Hamilton Sundstrand Space Certification • JPL / NASA Flight Certified • General Dynamics UK Award For “Best Overall Business Performance 2004 / 2005” 2/8/08 Compunetics, Inc.

Company Profile Types of Business • Prototypes, Quick Turn & Small To Medium Production Company Profile Types of Business • Prototypes, Quick Turn & Small To Medium Production • Military Spec PCBs • Backplanes • Rigid, Flex & Rigid/Flex (Class 2, 3 & Mil Spec) • High Layer Count – Up to 52 Layers, High Density PCBs • Independent Design/Drafting Group • Buried Passives • High Density Interconnects • Multi Chip Modules, Chip-On-Board • Engineering / Design Assistance 2/8/08 Compunetics, Inc.

Company Profile Customer Base • • 2/8/08 General Dynamics Lockheed Martin Do. D / Company Profile Customer Base • • 2/8/08 General Dynamics Lockheed Martin Do. D / Do. E IBM ITT / EDO Intel Tektronix ü ü Land Systems United Kingdom AIS ATP • • • Compunetics, Inc. Orbital DRS Northrop Grumman Terumo Raytheon L 3 Communications Philips Medical Maxtek David Sarnoff Bombardier Kadflex

Capabilities • Engineering Services • PCBs With 35 Micron Lines And Spaces • Multilayer Capabilities • Engineering Services • PCBs With 35 Micron Lines And Spaces • Multilayer PCBs 52 Layers + • Buried Resistors to 10%, Laser Trimmed to +/- 1% • Embedded Capacitors • Controlled Impedance to 2% • Blind and Buried Vias, Laser Micro Vias Including Stacked and Stepped Via Technology • 4 mil Mechanically Drilled Holes • Drafting and Design From Netlist (Gerber Generation) • Special Selective Plating • High Density Flex and Rigid Flex Circuits 2/8/08 Compunetics, Inc.

Capabilities • Conductive Epoxy w/ Dupont CB 100 • High Tolerance Laser Routing with Capabilities • Conductive Epoxy w/ Dupont CB 100 • High Tolerance Laser Routing with Optical Alignment • Flex on Frames • Mechanical Routing with Optical Alignment • Controlled Depth Route to 2 mils • Panel Sizes to 28”x 26” • 3 -Dimensional Plating • Sequential Build (Build-up Technology) • RF / Microwave Product • Heat Sink Boards • High Speed Laminates Including: Rogers, Taconic Arlon and High Speed FR 4 (Isola, Nelco) 2/8/08 Compunetics, Inc.

Technology Road Map Plating Aspect Ratio Current Production Engineering 2/8/08 10: 1 13: 1 Technology Road Map Plating Aspect Ratio Current Production Engineering 2/8/08 10: 1 13: 1 11: 1 14: 1 Current 12 Months 24 Months +/- 0. 0030” +/- 0. 0015” PTH Tolerance (finished hole size) 24 Months 9: 1 12: 1 Production Engineering 12 Months +/- 0. 0025” +/- 0. 0012” +/- 0. 0020” +/- 0. 0010” Compunetics, Inc.

Technology Road Map Soldermask And Screening Minimum Soldermask Web Production Engineering Minimum Soldermask Clearance Technology Road Map Soldermask And Screening Minimum Soldermask Web Production Engineering Minimum Soldermask Clearance Production Engineering Legend Min Height / Line Width Production Engineering 2/8/08 Current 12 Months 24 Months 0. 0035” 0. 0030” 0. 0025” Current 12 Months 24 Months 0. 0030” 0. 0025” 0. 0020” Current 12 Months 24 Months 0. 050” / 0. 006” 0. 040” / 0. 005” 0. 030” / 0. 006” 0. 035” / 0. 005” 0. 030” / 0. 004” Compunetics, Inc.

Technology Road Map *. 0. 062” thick board ** 0. 125 thick board Mechanical Technology Road Map *. 0. 062” thick board ** 0. 125 thick board Mechanical Number of Layers Production Engineering Current 12 Months 24 Months 26 52 28 56 32 60 12 Months 24 Months 0. 0060” 0. 0040” 0. 0050” 0. 0030” Smallest Mechanical Drilled Holes* Current Production Engineering 2/8/08 0. 0060” 0. 0040” Compunetics, Inc.

Technology Road Map Laser Drilled Microvias Minimum Hole to Capture Pad Current 12 Months Technology Road Map Laser Drilled Microvias Minimum Hole to Capture Pad Current 12 Months 24 Months 0. 006” / 0. 010” 0. 003” / 0. 006” 0. 005” / 0. 009” 0. 002” / 0. 006” 0. 004” / 0. 008” 0. 002” / 0. 005” Current 12 Months 24 Months 0. 5: 1 0. 7: 1 0. 6: 1 0. 8: 1 0. 7: 1 1: 1 Current 12 Months 24 Months Production Engineering No Evaluation No Yes Yes Multi-Level Microvias (Stacked) Current 12 Months 24 Months No Yes Yes Yes Production Engineering Aspect Ratio of Blind Microvia Production Engineering Copper Filled Microvias Production Engineering 2/8/08 Compunetics, Inc.

Technology Road Map Imaging And Mechanical Layer-to-Layer Registration Production Engineering Signal Pad Annular Ring Technology Road Map Imaging And Mechanical Layer-to-Layer Registration Production Engineering Signal Pad Annular Ring Inners Production Engineering Plane Clearance Inners Production Engineering Copper Feature to Board Edge Production Engineering 2/8/08 Current 12 Months 24 Months +/- 0. 0030” +/- 0. 0020” +/- 0. 0025” +/- 0. 0014” Current 12 Months 24 Months 0. 0040” 0. 0035” 0. 0025” 0. 0030” 0. 0020” Current 12 Months 24 Months 0. 016” 0. 011” 0. 014” 0. 010” 0. 012” 0. 008” Current 12 Months 24 Months 0. 0050” 0. 0030” 0. 0045” 0. 0025” 0. 0040” 0. 0020” Compunetics, Inc.

Technology Road Map Imaging And Etching * Half Ounce Copper Trace / Space Outers Technology Road Map Imaging And Etching * Half Ounce Copper Trace / Space Outers * Current 0. 0040” / 0. 0040” 0. 0015” / 0. 0015” Controlled Impedance Tolerance * Production Engineering 2/8/08 24 Months +/- 0. 0004” +/- 0. 00025” +/- 0. 0003” +/- 0. 0002” Current 12 Months 24 Months +/- 10% +/- 2% Production Engineering 12 Months +/- 0. 0005” +/- 0. 0003” Trace Width Tol. Inners* 0. 0030” / 0. 0030” 0. 0025” / 0. 0030” 0. 0012” / 0. 0012” 0. 0010” / 0. 0010” Current Production Engineering 12 Months 0. 0035” / 0. 0035” 0. 0015” / 0. 0015” Trace / Space Inners * 0. 0035” / 0. 0035” 0. 0030” / 0. 0035” 0. 0012” / 0. 0012” 0. 0010” / 0. 0010” Current Production Engineering 12 Months +/- 7% +/- 2% +/- 5% +/- 2% Compunetics, Inc. 24 Months

Future Plans l l l Investigating Laser Direct Imaging Equipment Working With Dielectric Solutions Future Plans l l l Investigating Laser Direct Imaging Equipment Working With Dielectric Solutions On Reducing Fiber Weave Effect Using Proprietary Fiberglass Weave In PCB Materials Evaluating Factory Relocation And Expansion Sub-mil High Density Product Multi-Layer LCP Packages Investigating Large Panel Production Equipment 2/8/08 Compunetics, Inc.

Samples Embedded Passives (Resistors) l l A True Thin-Film, Nickel-Phosphorous (Ni. P) Alloy. About Samples Embedded Passives (Resistors) l l A True Thin-Film, Nickel-Phosphorous (Ni. P) Alloy. About 0. 1 To 0. 4 Microns Of The Alloy Is Electro-Deposited On To The Rough, Or Tooth Side Of Copper Foil During Manufacturing Typical Tolerance Of 10 – 20% Resistors Tested At Final Test And During Inner Layer OHMEGA-PLY LAMINATE copper resistive material (0. 1 -0. 4 micron thick) dielectric substrate copper (EXAMPLE OF AVAILABLE CORE) 2/8/08 Compunetics, Inc.

Samples Embedded Passives (Capacitors) l l Bulk Capacitance Formed By Placing Power And Ground Samples Embedded Passives (Capacitors) l l Bulk Capacitance Formed By Placing Power And Ground Layers Close Together Thin Dielectrics Separate Power And Ground To Create Parallel Plate Capacitor C = ke. A/t Cu Where: C = Capacitance e = Dielectric Constant of Material A = Board Area in Square Inches k = Permittivity of Free Space – Constant of 225 t = Dielectric Thickness in inches 2/8/08 Film Core Cu Copper clad laminate Double sided (power and ground) Dielectric is a Polyimide and Ba. Ti. O composite. Thickness of dielectric is key…thinner is better Compunetics, Inc.

Samples Embedded Passives (Capacitors) l l Reduction In SMT Caps Needed On PCB Closely Samples Embedded Passives (Capacitors) l l Reduction In SMT Caps Needed On PCB Closely Spaced Planes Have Lower Inherent Inductance Therefore Supply Current On A Very Short Time Scale Thus Damping Fluctuations Of Voltage At Device Input Low Inductance Planes Reduces EMI Initial Data Indicates That Surface Mounted Capacitance Can Be Effectively Replaced By Embedded Capacitance With Only A Small Fraction Of The Total Discrete Capacitance 2/8/08 Compunetics, Inc.

Samples Embedded Passives (Capacitors) Products 2/8/08 Compunetics, Inc. Samples Embedded Passives (Capacitors) Products 2/8/08 Compunetics, Inc.

Samples Embedded Passives (Capacitors) Application • Before Embedded Capacitance ü 18 Layers ü Blind Samples Embedded Passives (Capacitors) Application • Before Embedded Capacitance ü 18 Layers ü Blind vias: 1 -2, 18 -17 ü Buried vias 2 -17 ü Over 2000 Caps • After Embedded Capacitance ü 18 Layers ü No Blind Vias ü Buried vias 2 -17 ü Removed 800+ Caps 2/8/08 Compunetics, Inc.

Samples Controlled Impedance Flex l l Faster Signals with Faster Rise/Fall Times Require Controlled Samples Controlled Impedance Flex l l Faster Signals with Faster Rise/Fall Times Require Controlled Impedance Flex Cables In Order To Have Cable Flexible, Need To Etch Traces Near 3 mils (Larger Traces Require Thicker Dielectrics For Same Impedance, Making Board Less Flexible) • Controlled Impedance Flex ü 8 Layers ü Trace / Space – 3. 0 / 3. 0 ü Du. Pont AP & LF Flex Material ü Differential Controlled Impedance 2/8/08 Compunetics, Inc.

Samples Rigid-Flex l l Common Application To Add Reliability And/Or To Reduce Assembly Costs Samples Rigid-Flex l l Common Application To Add Reliability And/Or To Reduce Assembly Costs Through Removal Of Connectors And Cabling More Common Due To Tight Spaces And Need For Increased Reliability In Products, Especially In Military • Military Avionics Rigid Flex ü 8 Layers ü 2 oz. Copper ü Loose-leaf Design for Increase Flexibility ü 3 Double Sided Flex Cores w/Coverlay ü Military Specification 2/8/08 Compunetics, Inc.

Samples Rigid-Flex • Satellite Systems ü 12 Layers ü Flight Certified Product ü Polyimide Samples Rigid-Flex • Satellite Systems ü 12 Layers ü Flight Certified Product ü Polyimide / Du. Pont AP Flex ü Immersion Gold • Military ü 22 Layers ü 6 Layer Loose-leaf Flex ü Polyimide / Du. Pont AP Flex ü HAL Finish 2/8/08 Compunetics, Inc.

Samples High Speed – Mixed Material Boards l l Need For Low Df/Dk Materials Samples High Speed – Mixed Material Boards l l Need For Low Df/Dk Materials for Today’s Technology Mix Low Df/Dk, High Cost Material with Higher Df/Dk Low Cost Material Keep Critical Signals on/with Low Df/Dk Material Some Materials can not be Mixed with Certain Other Materials • Mixed Material 10 Gb Ethernet ü 8 Layers ü Blind Vias – 1 -4 For Stub Control ü Conductive Epoxy Filled Vias ü Rogers 4003 / FR 4 Material ü Cavity Construction at Gold Fingers 2/8/08 Compunetics, Inc.

Samples High Speed – Mixed Material Boards • FR 4 Material (Glass Bundles) • Samples High Speed – Mixed Material Boards • FR 4 Material (Glass Bundles) • Rogers 4000 (Ceramic Filled) 2/8/08 Compunetics, Inc.

Samples Heat Dissipation Boards l l l Smaller Spaces and Hotter Running Parts Require Samples Heat Dissipation Boards l l l Smaller Spaces and Hotter Running Parts Require Design Consideration for Heat Dissipation Need To Provide Thermal Path Away From Components Several Design Changes Can be Made To Minimize Thermal Impact to Components – – – 2/8/08 Place Heat Generating Part Near Heat Sink or Board Edge Provide Thermal Path In Copper Including Using Edge Plating Use Thermal Vias to Connect to Internal Planes or Heat Sink Use of CB 100 for Thermal Vias Heat Sinks Thinner Board Materials Place Component Closer To Heat Sink Compunetics, Inc.

Samples Heat Dissipation Boards • Heat Dissipation Board ü 4 Layers ü Thin Core Samples Heat Dissipation Boards • Heat Dissipation Board ü 4 Layers ü Thin Core FR 4 ü Conductive Epoxy ü Heat Spreader Attached w/ Thermagon ü HASL Finish 2/8/08 Compunetics, Inc.

Samples RF Boards l l l Boards Typically Made on Teflon or Teflon Blend Samples RF Boards l l l Boards Typically Made on Teflon or Teflon Blend Products Etching Tolerance of +/-. 0003” Several Areas of Tight Tolerance Routing +/-. 002 (Requires Laser Routing w/Vision System Some Designs Require Metal Backing Most Require Wirebondable Gold 2/8/08 Compunetics, Inc.

Samples RF Boards • Commercial RF ü 2 Layers ü Rogers 3003 ü Laser Samples RF Boards • Commercial RF ü 2 Layers ü Rogers 3003 ü Laser Routed Slots ü Trace Tolerance +/-. 0003” ü Wirebondable Gold 2/8/08 • Military RF ü 4 Layers ü Rogers 6002, 4350, 4403 ü Blind 1 -2, 4 -3; Buried 2 -3 ü Cavity 4 to 3 ü Trace Tolerance +/-. 0003” ü Wirebondable Gold Compunetics, Inc.

Samples Laser Drilled Blind Micro-vias l l l l Typically. 004” to. 006” Laser Samples Laser Drilled Blind Micro-vias l l l l Typically. 004” to. 006” Laser Drilled Hole From Layers 1 to 2 and/or From N to (N-1) Dielectric Distance. 003” to. 004” Aspect Ratios less than. 50: 1 Material Typically RCC (Resin Coated Copper) or Flat Glass FR 4 Enables Pin Escaping Small Pitch BGAs or BGAs on Thick PCBs Used to Conserve Routing Channels on Inner Layers Enables Double Sided Assembly in Some Cases 2/8/08 Compunetics, Inc.

Samples Laser Drilled Blind Micro-vias 2/8/08 Compunetics, Inc. Samples Laser Drilled Blind Micro-vias 2/8/08 Compunetics, Inc.

Samples Chip On Flex (Direct Die Attach) • Chip On Flex ü 2 Layers Samples Chip On Flex (Direct Die Attach) • Chip On Flex ü 2 Layers ü Trace / Space – 2 / 2 ü 2 mil Laser Drilled Vias ü Wirebondable Gold ü 2 mil Adhesiveless Pyralux 2/8/08 Compunetics, Inc.

Samples Buried Resistors on Flex • Buried Resistor on Flex ü 2 Layers ü Samples Buried Resistors on Flex • Buried Resistor on Flex ü 2 Layers ü Ohmega Ply Resistor ü Resistor Covered By Kapton ü Immersion Silver Finish ü 2 mil Adhesiveless Pyralux 2/8/08 Compunetics, Inc.

Samples Laser Trimmed Embedded Resistors • Laser Trimmed Resistors ü Resistor Laser Trimmed Under Samples Laser Trimmed Embedded Resistors • Laser Trimmed Resistors ü Resistor Laser Trimmed Under Measurement ü Resistor Trimmed to +/- 1% ü Final Resistor Tolerance +/- 3% ü Application: High Speed Testing 2/8/08 Compunetics, Inc.

Samples Copper Filled Micro-vias l l l Via-in-pad Provides Flat Pad Surface for BGA Samples Copper Filled Micro-vias l l l Via-in-pad Provides Flat Pad Surface for BGA Attach Flat Surface Optimal For Stacked Micro-vias Need For Special Plating Chemistry Need For Special Plating Equipment Enables Pin Escaping High Pin Count. 5 mm Pitch BGAs Technology Under Development at Several US Shops 2/8/08 Compunetics, Inc.

Samples Copper Filled Micro-vias Current Plating Technology 2/8/08 Compunetics, Inc. Samples Copper Filled Micro-vias Current Plating Technology 2/8/08 Compunetics, Inc.

Samples Copper Filled Micro-vias l l Test Vehicles Manufactured and Evaluated Technology Approved for Samples Copper Filled Micro-vias l l Test Vehicles Manufactured and Evaluated Technology Approved for Production Using In-house Equipment The Smaller The Hole, The More Flat the Plating of Close to 1: 1 on Blind Microvias 2/8/08 Compunetics, Inc.

Samples Copper Filled Micro-vias Stacked Micro-vias 2/8/08 Compunetics, Inc. Samples Copper Filled Micro-vias Stacked Micro-vias 2/8/08 Compunetics, Inc.

Samples Du. Pont PF Material l l l l 2/8/08 All Polyimide Adhesive Flex Samples Du. Pont PF Material l l l l 2/8/08 All Polyimide Adhesive Flex “prepreg” Without Acrylic Lower Z-axis Expansion Without Acrylic Increase Reliability Much Lower Df (. 02 vs. . 004) Product Withstands MIL-Spec Thermal Shock Testing Product Still In Beta-Test at Several Shops Including Compunetics, Inc. Evaluations On-going at Several Large OEMs Compunetics, Inc.

Samples Du. Pont PF Material • Multi-Layer Flex w/ PF Material 2/8/08 • Multi-Layer Samples Du. Pont PF Material • Multi-Layer Flex w/ PF Material 2/8/08 • Multi-Layer Flex w/ LF Bondply Compunetics, Inc.

Samples Fine Line Technology (2 mil Trace/Space & Down) l l l 2/8/08 Required Samples Fine Line Technology (2 mil Trace/Space & Down) l l l 2/8/08 Required for High Pin Count Fine Pitch BGA Routing (<= 0. 5 mm Pitch) Chip On Board / Chip On Flex Used To Reduce Layer Count – More Tracks per Channel Seen with Laser Drilled Micro-vias Typically on Boards with Small Annular Rings Can be Combined with Embedded Passives Compunetics, Inc.

Samples Fine Line Technology (2 mil Trace/Space & Down) • Multi-Level Chip Package ü Samples Fine Line Technology (2 mil Trace/Space & Down) • Multi-Level Chip Package ü 6 Layer FR 4 ü 2 / 2 Trace / Space ü Embedded Resistors for Termination ü Multi-Level Cavity Construction ü Wirebondable Gold • Fine Line Package ü 1. 5 / 1. 5 (35 / 35 um) Trace / Space ü Wirebondable Gold ü 4 Layers FR 4 ü 31 mil Thick +/- 1 mil 2/8/08 Compunetics, Inc.

Samples Laser Ablation Of Soldermask Problem l l Tighter Pitch Parts Require Better Soldermask Samples Laser Ablation Of Soldermask Problem l l Tighter Pitch Parts Require Better Soldermask Registration Conventional Mask Annular Rings Leave Insufficient Mask Dams Solution l l 2/8/08 BGA Area Covered With Soldermask YAG Laser Used To Remove Mask From BGA Pads Mask Annular Ring Less Than 1 mil Mask Dams Remain Aiding Assembly Compunetics, Inc.