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Описание презентации 5/7/2012 Electronic Materials by BASF Name DD/MM/2012 Committed по слайдам
5/7/2012 Electronic Materials by BASF Name DD/MM/2012 Committed to a changing world
Our chemicals are used in almost all industries We combine economic success, social responsibility and environmental protection. Sales 2011: € 73, 497 million EBIT 2011: € 8, 586 million Employees (as of December 31, 2011): 111, 141 In 2011, BASF filed for around 1, 050 new patents worldwide 6 Verbund sites and around 370 production sites. BASF – The Chemical Company
Performance Products 15, 697 (+ 28 %)Million € (change compared with previous year) Chemicals 12, 958 (+ 14 %) Functional Solutions 11, 361 (+ 17 %)Oil & Gas 12, 051 (+ 12 %) Plastics 10, 990 (+ 12 %) BASF Group 73, 497 Agricultural Solutions 4, 165 (+ 3 %) Other* 6, 275 (+ 7 %)6 % 9 %21 %18 % 15 %16 % * Activities not assigned to a particular division are reported in Other BASF Sales by Segment in
Chem icals Plastics. Performanc e Polymers Polyurethanes Crop Protection Oil & Gas Perform ance Products Nutrition & Health. Dispersion s & Pigments Care Chemicals Paper Chemicals. Inorganic s Petrochemicals Intermediates Functional Solutions Construction Chemicals Coatings. Catalyst s Agricultural Solutions Oil & Gas Performance Chemicals. BASF Segment
Inorganics Glues & Impr. Resins. Inorganic Chemicals CIP & Metal Systems. Electronic Materials BASF Fuel Cell Fertilizers. Inorg. NA & Inorg. Life Science Chemicals. Electronic Materials by BASF At a Glance
We offer high purity, quality process chemicals and specialized solutions for semiconductors, flat panel displays, lighting such as LED as well as photovoltaics. Electronic Materials by BASF We Enable Digital Life
75/7/2012 Electronic Materials by BASF Mega Trends & Opportunities for the Electronic Industry Impact of globalization Energy efficiency and new resources Consumerism Mega trends Opportunities for the industry Communication Longer operating times Universal connectivity Contribution of the electronic materials Easy to use interfaces Fashion. Consumer needs Faster / Higher performance Smaller space / light weight Energy efficient Lower cost Solutions towards specific challenges • Wet deposition • Chemical Mechanical Planarization • Advanced etching, cleaning and photolithography • Innovative process chemical solutions or metallization inks and pastes for solar cells Highly reliable supply of electronic grade chemicals such as: • H 2 O 2, H 2 SO 4 • NMP • NH 3, HCl. Better light harvesting and emission
5/7/2012 Electronic Materials by BASF Electronics Industry Value Chain and Where We Serve Semiconductors $318 Bn Interconnect Substrates $62 Bn Passives $35 Bn Displays $125 Bn Energy $45 Bn Other Devices $145 Bn. Other Electronics $720 Bn. Communications $460 Bn. Computers $530 Bn. Electronic Equipment $1, 710 Bn Electronic Components $730 Bn Fab Materials $25 Bn Interconnect Materials $20 Bn Passive Materials $4 Bn Displays Materials $37 Bn Energy Materials $34 Bn Other Materials $8 Bn. Electronic Material $147 Bn Wafers, Gases, Photomasks, CMP, Photo Resists, Wet Chemicals, Targets / Precursors Laminate, Ceramics, Photo Resist, Wet Chemicals, Drilling Materials Glass, Films, Color Filters, Phosphors, Shadow Masks, Targets, Thick Films Silicon, Substrates, Anodes, Cathodes, Separators Metal Foils, Composites, Glass and Metal Substrate, Magnetic Films. Packaging Materials $13 Bn Leadframe Metal, Bonding Wire, Molding Compound, Die Attach Assembly Materials $6 Bn Solder Masks, Thermal Materials, Adhesive, Encap- sulants. Dielectrics, Electrodes, Terminations, Magnetics, Separators Raw and Industrial Materials $44 Bn Polysilicon, Polymers Cu Foil, Glass-Cloth, Polymers, Pl Films, Metals, Inorganics, Polysilicon Copper, Inorganics, Films, Metals. Copper, Gold, Polymers Tin, Polymers. Al Foil, Inorganics, Metal- Powders 8 Source: Prismark Partners
Electronic Materials by BASF Our Answers — Portfolio 9 Semiconductor Solutions Display Solutions Photovoltaic Solutions Lighting Solutions Others. Market IC fabrication Display materials Solar cell LED materials Solution Innovation leadership for/by By providing lead free metallization ink for laser printing technology. Proprietary solutions for the semiconductor processes inluding cleaning, etching, photolithography, chemical mechanical planarization (CMP), and wet deposition. A series of proprietary process chemicals and customized copper (Cu) solutions • Environment-friendly portfolio of metallization inks and pastes • Chemical solutions during the process of cutting, cleaning, etching and texturing, as well as doping Ultrapure chemicals and gases By providing high performance chemical solution for electrochemical deposition By translating market needs into chemical solutions By providing highest available purity to produce high performance LEDs System houses/ formulators Ultrapure chemicals and gases High reliability and product consistency by back-integration
• Reliable and consistent high quality product • State-of-the-art production facility • Excellent container technology to keep chemicals at the best possible purity levels • Analytical expertise and quality management to ensure quality consistency • Ultra-modern laboratories in Asia and Europe • Just-in-time delivery • 100% reliable supply • Fast response time • Dedicated R&D team • BASF’s globally integrated R&D network and broad chemical expertise • Collaboration with research institutes, tool suppliers and customers. Production Analytics Logistics Research. Electronic Materials by BASF Key to Our Success 10 We are active in three major markets of U. S. Europe and Asia Pacific!
Electronic Materials by BASF Worldwide Presence – Sales by Region 11 Net sales 3 rd party 2011 Asia Pacific. Europe North America
Electronic Materials by BASF Worldwide Presence Germany Global Headquarters, R&D, Production, Sales & Marketing. North America Production and Sales & Marketing Korea Sales & Marketing Japan Sales & Marketing China Production, Service Center Sales & Marketing Malaysia Service Center Sales & Marketing Singapore Production, Sales & Marketing Hong Kong Regional Headquarters Taiwan Production, Development, Sales & Marketing
State-of-the-art R&D and application facilities in Europe and Asia Approx. 100 employees dedicated to the development activities in Electronic Materials A component of approx. 9, 300 employees of BASF’s R&D and technology community Some of our R&D projects: Advanced BEOL and FEOL cleaning solutions Copper electroplating New CMP slurries Collaborations with academic organizations, leading research institutes, tool suppliers and customers. Electronic Materials by BASF R&D to Meet Customer Needs
Electronic Materials by BASF Quality Management Quality management is an integral part of our daily business. To generate customer satisfaction, we pay strict adherence to a customer-oriented process optimization and strive for continuous improvement. We have a worldwide network of quality management and combine with a Safety & Environment system to ensure reliable and sustainable development products. Our certifications include: OHSAS 18001 ISO 14001 ISO 17025 ISO TS 16949 ISO
Electronic Materials by BASF Quality Control We ensure our products stand for the high purity and quality required for processes and applications our customers in the next generation need We are the first and only company to receive an ISO-17025 trace analysis certificate for our testing laboratory from Taiwan. We apply the most advanced techniques in quality control, including: Assay Anion impurity analysis Trace metal impurity analysis Liquids particle measurement General physical/chemical properties measurement Tailor-made services for customers Trouble-shooting clarification
BASF Advanced Materials CMP Chemical mechanical planarization of wafer surfaces Advanced cleaning & etching Cleaning and etching of wafer surfaces. Wet deposition Wet chemical deposition of thin layers. BASF core competencies: Customer needs: Innovation in IC industry know-how Chemistry know-how (Nano)particles Electrochemical and electroless methods Formulations & additives: Surfactants, corrosion inhibitors, etc. Planarization Chemical deposition Selective cleaning Nanotechnology Interlayer adhesion Etc. Tailor-made development for our customer Early interaction with research centres and tool manufacturer Strategic collaborations. Electronic Materials by BASF Chemistry innovation as an enabler
Electronic Materials by BASF Our Key Products 17 Semiconductor Solutions Display Solutions Photovoltaic Solutions Lighting Solutions Others. Market IC fabrication Display materials Solar cell LED materials Solution ? System houses / formulators P LANAPUR ® S ELECTIPUR ® F OTOPUR ® C UPUR ® SELECTIPUR ® F OTOPUR ® SELURIS® Textur® Cypo. Sol® Inorganic acids Organic solvents Hydrogen chloride gas Hydroxylamine free base SELECTIPUR ® NH 3 7.
CUPUR® is BASF’s wet deposition solution for various deposition processes CUPUR® solution includes super-filling copper electroplating solutions (CUPUR® ECP Series), 3 D through-silicon-vias (TSV) solutions (CUPUR® TSV Series), selective electroless Ni & Co capping layer deposition (CUPUR® Capping Series) and also for backend packaging / bumping application (CUPUR® Packaging Series) Benefits of CUPUR® : Tailor-made solutions Stable quality Dedicated and professional team for speedy implementation and reliable production. Electronic Materials by BASF CUPUR®: Making Layer Deposition
Electronic Materials by BASF FOTOPUR®: Chemical for Photolithography FOTOPUR ® are surfactants, chelating and anti-corrosion agents used for photolithography, a crucial step in electronics manufacturing. BEOL and FEOL application FOTOPUR ® C Series for defect reduction rinse solution FOTOPUR ® R Series for post etch/post ash/post implant residue removers Bumping and 3 D TSV application FOTOPUR ® D Series for photoresist/polyimide developer FOTOPUR ® S Series for photoresist/polyimide stripper Benefits of FOTOPUR ® : Tailor-made solutions and S table quality
PLANAPUR ® : Slurries are used in CMP (Chemical Mechanical Planarization) step of semiconductors for polishing wafer surfaces. A system of abrasive particles and chemicals is used for polishing the surface without scratches during the layer-by-layer build up process of electronic chips. The tremendous decrease in the size of pattern structures on electronic microchip surfaces is impacting the size of polishing particles, now being on nanometer scale. Benefits of PLANAPUR ® : Tailor-made solutions Reduction of surface defects on the electronic chip Increase of production efficiency. Electronic Materials by BASF PLANAPUR®: Customized Polishing
Electronic Materials by BASF SELECTIPUR®: Best Cleaning and Etching SELECTIPUR ® is high-purity chemicals for cleaning and etching step in IC manufacturing, including bumping and 3 D TSV application. As integrated circuits (ICs) have consistently migrated to smaller feature sizes, the cleaning process involved is more important than ever. BASF cleaning product includes: H 2 O 2 , IPA, NH 4 OH, H 2 SO 4 , HCI, HNO 3 , CH 3 COOH, and HF. The efficient wet etching process relies heavily on chemicals with precise recipe control. BASF provide high quality and tailor-made SELECTIPUR ® based on customers’ requirement from diversified developing electronic manufacturing industry Benefits of SELECTIPUR ® Tailor-made solutions Constant quality
Cypo. Sol® is metallization ink and paste used for metallization of front and back side of solar cell wafers Product range comprises metallization inks for both the screen printing process and the new laser transfer printing (LTP) technology Reduce cracking rate in ultra-thin solar cell production, boost performance and simplify handling Benefits of Cypo. Sol ® : high performance and efficiency simplify handling Eco-friendly. Electronic Materials by BASF Cypo. Sol®: For Better Metallization
Cleaning solution for use in the production of solar cell wafers SELURIS ® Clean is used twice in the process: before and after phosphoric acid doping After doping, SELURIS ® Clean removes any disruptive residual phosphorus remaining on the surface Benefits of SELURIS ® Clean: Enhanced cell efficiency, i. e. higher performance Environmentally sound Unwanted electric errors are eliminated. Electronic Materials by BASF SELURIS® Clean: Easy Way to Clean
Electronic Materials by BASF Our Competencies at a Glance 2430 years We have been serving the electronic industry for over 30 years. Leading We are one of the global market leaders in electronic materials 100 Approximately 100 employees dedicated to R&D activities in Electronic Materials, fully integrated into BASF’s R&D and technology community with approx. 9, 300 employees Over 150 patents We have applied over 150 patents within the last 5 years
255/7/2012 Electronic Materials by BASF Future of Electronics enabled by Electronic Materials We are committed to a changing world!
STI slurry HK/MG slurry Barrier slurry TSV slurry Cu Bulk slurry Slurry additives Post CMP cleaners SIO Etch BOE Etch Poly Etch Al Etch Cu Etch Ti Etch ITO Etch Cr Etch Mo Etch Spinetch Metal multilayer stacks Etch H 2 O 2 H 2 SO 4 H 3 PO 4 HAFB GBL NMP NH 4 OH HCl HNO 3 NH 4 F HF IPA CH 3 COOH KOH Na. OH Acetone Methanol Detergent PI solvent Copper electro- plating additives and electrolytes Dual damascene 3 D-TSV Electro-less deposition for Cu capping layers Co. WP Ni. Mo. PIC FPD Solar Cells IC IC ICAdvanced Materials Photoresist Ancillaries. Cleaning Etching CMP Wet Deposition Advanced Cleaning, Etching, and Photoresist Ancillaries. Electronic Materials by BASF Product Range SELURIS Cypo. Solar Cells BEOL and FEOL application Defect reduction rinse solution Post etch residue removers. Post ash residue removers. Post implant residue removers. IC FPD Solar Cells Photoresist and polyimide developer Photoresist and polyimide stripper Thinner
Electronic Materials by BASF Smaller and higher performance device 1943 1998 IBM ASCC Apple i. Mac Apple i. Phone Size 250 cm H, 1500 cm W 38 cm H, 38 cm W 11 cm H, 5 cm W Wight 4500 Kg 15800 g 137 g Wire 80 um 250 nm 45 nm Speed Less than 2. 25 MHz 500 MHz 1 GHz 2010 IC Industry pursues “High Performance”, “Low Cost” and “Small Space”
29 Electronic Materials by BASF Semiconductor process development 1970 1980 1990 2000 201010 um 3 um 1. 5 um 1 um 800 nm 600 nm 350 nm 250 nm 180 nm 130 nm 90 nm 65 nm 45 nm 32 nm 22 nm 10 um (1971) e. g. Intel 8008 3 um (1975) e. g. Intel 8088 1. 5 um (1982) e. g. Intel 80286 1 um (1985) e. g. Intel 80386 800 nm (1989) e. g. P 5 Pentium 600 nm (1994) e. g. Motorola Power. PC 601 350 nm (1995) e. g. Pentium II Klamath 250 nm (1998) e. g. AMD K 6 -2 & Intel Core i 5 180 nm (1999) e. g. Coppermine E 130 nm (2000) e. g. Power PC 7447 90 nm (2002) e. g. IBM Xenon 65 nm (2006) e. g. Core Duo 45 nm (2008) e. g. Core 2 32 nm (2010) Core i 3 22 nm (2011)i. Mac Apple Power. Book G 4 i. Pad / i. Phone. XBOX
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